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High-thermal-conductivity metal-based composite material with graphene-modified interface and preparation method thereof

A composite material and graphene technology, applied in metal processing equipment, transportation and packaging, etc., can solve the problems of large interface thermal resistance, low interface layer thermal conductivity, and large difference in theoretical values, so as to improve thermal conductivity, The effect of adjusting the interface thickness and interfacial thermal resistance

Inactive Publication Date: 2018-09-28
SHANGHAI JIAO TONG UNIV
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  • Abstract
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Problems solved by technology

However, the experiments in Document 4 "Effect of the surface tungsten coating on the thermal conductivity of diamond / copper composites" (Rare Metal Materials and Engineering, 45 (2016) 2692-2696) have proved that the thermal conductivity of the composite material increases with the thickness of the diamond tungsten coating. The increase first increases and then decreases. Although the thermal conductivity of the composite material can be improved by coating tungsten on the diamond surface or forming a carbide layer, it is still far from the theoretical value. The main reasons are: (1) the relationship between diamond and metal matrix In contrast, the thermal conductivity of the interface layer is too low (tungsten 178W / mK, the thermal conductivity of the carbide is lower than that of the metal matrix copper alloy); (2) The coating on the diamond or the formed carbide coating is too thick, causing a large The thermal resistance of the interface leads to a large difference between the thermal conductivity of the composite material and the theoretical thermal conductivity; (3) It is difficult to precisely control the thickness and uniformity of the interface layer, so the modification effect is not ideal

Method used

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  • High-thermal-conductivity metal-based composite material with graphene-modified interface and preparation method thereof
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  • High-thermal-conductivity metal-based composite material with graphene-modified interface and preparation method thereof

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preparation example Construction

[0042] Such as figure 1 As shown, the preparation method of the high thermal conductivity metal matrix composite material of the graphene modified interface of the present invention specifically includes the following steps:

[0043] (1) First, the metal powder matrix is ​​annealed and reduced to remove oxides on the surface;

[0044] (2) Coating the annealed and reduced metal powder with a solid carbon source or a gaseous carbon source, and growing in situ at a high temperature under the protection of a hydrogen atmosphere to obtain a graphene-coated metal powder;

[0045] (3) The graphene-coated and modified metal powder matrix is ​​mixed with diamond, and sintered by hot pressing to prepare a high thermal conductivity metal matrix composite material with a graphene-modified interface.

[0046] The present invention is explained in detail by following embodiment:

Embodiment 1

[0048] The pure copper powder with a particle size of 70 μm and a purity of 99.9% was annealed at 450 °C for 2 hours in a hydrogen-argon gas mixture, and 30 g of the annealed and reduced pure copper powder was added to a PMMA (1.25 g)-250 mL anisole (250 mL) solution , after mechanical stirring and mixing for 4 hours, centrifuge at 4000 rpm for 7 minutes, remove the lower layer of powder, dry at 80 ° C, put the coated copper powder in a crucible, and put it in a tube furnace Access to H 2 (200sccm) and Ar (300sccm) protective gas. The temperature in the furnace was raised to 900°C within 1.5 hours, held for 1 hour, and then rapidly cooled to room temperature in a hydrogen-argon mixture atmosphere to obtain in-situ grown graphene-modified copper powder; Particles (0.395 g) were mixed with graphene-modified copper powder (2.346 g). Hot press sintering, sintering at 900 ° C for 1 hour, the pressure is 50Mpa, the high thermal conductivity diamond-reinforced copper composite mate...

Embodiment 2

[0051] The pure copper powder with a particle size of 70 μm and a purity of 99.9% was annealed at 450°C for 2 hours in a hydrogen-argon gas mixture, and 30 g of the annealed and reduced pure copper powder was added to a PMMA (2.5 g)-250 mL anisole (250 mL) solution , after mechanical stirring and mixing for 4 hours, centrifuge at 4000 rpm for 7 minutes, remove the lower layer of powder, dry at 80 ° C, put the coated copper powder in a crucible, and put it in a tube furnace Access to H 2 (100sccm) and Ar (400sccm) protective gas. The temperature in the furnace was raised to 900°C within 1.5 hours, kept for 1 hour, and then rapidly cooled to room temperature in a hydrogen-argon mixture atmosphere to obtain in-situ grown graphene-modified copper powder; diamond particles with a particle size of 100 μm and a volume fraction of 50% (0.658g) mixed with graphene-modified copper powder (1.676g), hot-pressed and sintered, sintered at 920 ° C for 1 hour, and the pressure was 60 MPa to ...

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Abstract

The invention provides a high-thermal-conductivity metal-based composite material with a graphene-modified interface and a preparation method of the high-thermal-conductivity metal-based composite material. The high-thermal-conductivity metal-based composite material with the graphene-modified interface comprises diamond and graphene-modified metal powder. The preparation method comprises the following steps that 1, annealing reduction is carried out on the metal powder so as to remove oxides on the surface; 2, the metal powder subjected to annealing reduction is coated with a solid carbon source or a gas carbon source, and high-temperature in-situ growth is carried out under the protection of hydrogen atmosphere to obtain graphene-coated metal powder; and 3, the graphene-coated metal powder is mixed with the diamond, and the high-thermal-conductivity metal-based composite material with the graphene-modified interface is prepared through hot-pressing sintering. According to the preparation method, the interface wettability between the metal matrix and the diamond particles is effectively improved, and the thermal resistance of the interface is reduced; and the high-thermal-conductivity graphene is introduced, so that the heat conductivity of the composite material is improved; and the high-thermal-conductivity metal-based composite material can be used as a material for the thermal management of a high-power-density device.

Description

technical field [0001] The invention relates to the field of metal matrix composite materials, in particular, to a metal matrix composite material with high thermal conductivity and a preparation method thereof, especially to a kind of in-situ growth graphene to modify the surface of a metal matrix, and then use the powder Metallurgical technology to prepare high thermal conductivity metal matrix composites. Background technique [0002] With the miniaturization of electronic components, the problem of thermal failure has attracted widespread attention. In order to meet the development needs of electronic technology, among thermal management materials, high thermal conductivity metal matrix composites have made great progress. Diamond has high intrinsic thermal conductivity (2000W / mK) and low thermal expansion coefficient, so diamond particle reinforced metal matrix composites are ideal for future thermal management materials. However, the wettability between the substrate ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C26/00C22C1/05B22F1/02B22F1/00B22F3/14
CPCC22C1/05C22C26/00B22F1/00B22F3/14B22F2998/10B22F1/16B22F1/0003B22F1/145
Inventor 熊定邦曹怀杰谭占秋李志强张荻
Owner SHANGHAI JIAO TONG UNIV
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