Preparation method of graphite whisker reinforced copper base composite material

A technology of copper-based composite materials and graphite whiskers, which is applied in the field of metal-based composite materials, can solve the problems of difficult infiltration of copper solution, achieve low production costs, improve interface conditions, and increase wettability

Inactive Publication Date: 2012-08-08
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a common problem in the composite of carbon-based materials and copper is that the wetting angle between carbon and molten copper is greater than 90°, and it is difficult for the copper solution to impregnate completely.

Method used

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  • Preparation method of graphite whisker reinforced copper base composite material
  • Preparation method of graphite whisker reinforced copper base composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Electroless copper plating is used to plate a 1 μm copper layer on the surface of graphite whiskers: First, put graphite whiskers in 20% NaOH solution and boil for 15 minutes, then rinse with distilled water until neutral. Add 20% HNO 3 The solution was boiled for 15 minutes, rinsed with distilled water until neutral. Put the washed graphite whiskers into 20ml / LHCl+20g / LSnCl 2 Stir vigorously in the solution for 15 minutes until the solution is blue-gray, indicating that the reaction is complete. After washing with water, add 20ml / L HCl+0.5g / LPdCl to the graphite whisker 2 The solution was vigorously stirred for 15 minutes, and the reaction was complete when the solution turned light brown. Pour the sensitized and activated graphite whiskers into the copper plating solution. The formula of the solution is copper sulfate pentahydrate 15g / L, potassium sodium tartrate 14g / L, EDTA 19.5g / L, bipyridine 0.02g / L, Potassium ferrocyanide 0.01g / L. And add 10ml / L of formaldehyd...

Embodiment 2

[0023] A molybdenum layer with a thickness of 1 μm was plated on the surface of graphite whiskers by salt bath plating. Graphite whiskers and NaCl / KCl mixed salt with a certain amount of ammonium paramolybdate added were put into the ball mill and mixed for 30 minutes. The molar ratio of NaCl and KCl in the mixed salt was 1:1, and the mass fraction of ammonium paramolybdate in the mixed salt was 10%. After mixing evenly, put it into a tube furnace with a protective atmosphere and heat it to 1000°C, keep it warm for 120 minutes and then cool it with the furnace. The coated whiskers are washed with water and then sieved to remove excess impurities to obtain molybdenum-coated graphite whiskers. Using this process, a molybdenum layer with a thickness of 1 μm is evenly plated on the surface of the graphite whisker.

[0024] Preparation of porous preform: get a certain amount of molybdenum-coated graphite whiskers and binder paraffin into a beaker filled with n-heptane solution, t...

Embodiment 3

[0027] A molybdenum layer with a thickness of 0.5 μm was coated on the surface of graphite whiskers by salt bath plating. Graphite whiskers and NaCl / KCl mixed salt with a certain amount of ammonium paramolybdate added were put into the ball mill and mixed for 30 minutes. The molar ratio of NaCl and KCl in the mixed salt was 1:1, and the mass fraction of ammonium paramolybdate in the mixed salt was 10%. After mixing evenly, put it into a tube furnace with a protective atmosphere and heat it to 1000°C, keep it warm for 60 minutes and then cool it with the furnace. The coated whiskers are washed with water and then sieved to remove excess impurities to obtain molybdenum-coated graphite whiskers. Using this process, a molybdenum layer with a thickness of 0.5 μm is uniformly plated on the surface of the graphite whisker.

[0028] Preparation of porous preform: get a certain amount of molybdenum-coated graphite whiskers and paraffin wax binder and pour it into a beaker filled with...

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Abstract

The invention belongs to the research field of metal base composite material and relates to a high heat conductive graphite whisker reinforced copper base composite material and a preparation method thereof. The composite material comprises two parts of a matrix pure copper and a plated reinforcing phase high heat conductive graphite whiskers, wherein a volume fraction of the copper is 40%-65%, and a volume fraction of the plated graphite whisker is 35%-60%. A production process of the composite material comprises the steps of: first, plating copper or molybdenum on a surface of the graphite whisker by a chemical plating or salt bath plating method to form a 0.5-2 mum thick coating; adding a proper amount of binder into the graphite whisker treated with metal plating; carrying out compression molding; removing the binder through thermal debinding to form a porous preform; and finally stacking the preform and the pure copper and placing the two into an infiltration furnace to carry outvacuum pressure infiltration, so as to obtain the final graphite whisker reinforced copper base composite material part.

Description

technical field [0001] The invention relates to a graphite whisker-reinforced copper-based composite material with high thermal conductivity and a preparation method thereof, belonging to the technical field of metal-based composite materials. Background technique [0002] With the rapid development of information technology, the integration of chips in electronic components is getting higher and higher, the power is getting higher and higher, and the heat dissipation requirements for packaging materials are also getting higher and higher. At the same time, the thermal expansion coefficient of the packaging material should also maintain a good match with the ceramic substrate and the chip, because the thermal expansion coefficient of the packaging material and the ceramic substrate and the chip is too different, it is easy to cause the chip and the ceramic substrate to burst or some soldering Cracking of spots and welds can lead to failure of electronic devices. Since tradi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C47/12C22C47/04C22C49/14C22C121/02C22C101/10
Inventor 何新波刘骞刘婷婷张昊明任淑彬吴茂曲选辉
Owner UNIV OF SCI & TECH BEIJING
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