Heat dissipation structure and heat dissipation system adopting the same

Abstract

A heat dissipation structure includes a thermal interface material and a transition layer. The thermal interface material includes a matrix and a plurality of carbon nanotubes dispersed in the matrix. The thermal interface material has a first surface and a second surface opposite to the first surface. The transition layer is positioned on one of the first surface or the second surface of the thermal interface material. A thickness of the transition layer is in a range from about 1 nanometer to about 100 nanometers. The transition layer is in contact with the carbon nanotubes of the thermal interface material. An interface thermal resistance between the transition layer and the heat source is less than that between the plurality of carbon nanotubes and the heat source. The present application also relates to a heat dissipation system adopting the heat dissipation structure.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims all benefits accruing under 35 U.S.C. §119 from China Patent Application No. 200910109568.6, filed on Aug. 5, 2009 in the China Intellectual Property Office.BACKGROUND[0002]1. Technical Field[0003]The present disclosure relates to heat dissipation structures and heat dissipation systems and, particularly, to a heat dissipation structure and a heat dissipation system adopting the same.[0004]2. Description of Related Art[0005]Electronic components such as semiconductor chips are becoming progressively smaller, while heat dissipation requirements are increasing. A thermal interface material is commonly utilized between the electronic component and a heat sink to efficiently dissipate heat generated by the electronic component.[0006]A conventional thermal interface material is made by diffusing high heat conduction coefficiency particles in a base material. The particles can be made of graphite, boron nitride, silicon ...

AI Technical Summary

Problems solved by technology

However, a heat conduction coefficiency of these thermal interface materials is now considered too low for many contemporary applications, because it cannot adequately meet the heat dissipation requirements of modern electronic components.

However, in use, when the carbon nanotubes 22 contact the heat sink or a heat source, the interface thermal resistance between the thermal interface material 40 and the heat sink or heat source is large because of the carbon nanotubes directly contacting the heat sink or heat source, thereby affecting the heat dissipation efficiency of the thermal interface material.

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