Oriented flexible heat conduction material as well as forming technology and application thereof

A heat-conducting material and molding process technology, applied to directional flexible heat-conducting materials and their molding processes and application fields, can solve the problems of increased heat accumulation and decreased product reliability, and achieve a simple process, improved heat dissipation effect, and easy large-scale production. Effect

Inactive Publication Date: 2014-04-23
HUAWEI TECH CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the continuous upgrading of electronic products and the continuous improvement of integration technology, the high density of semiconductors i

Method used

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  • Oriented flexible heat conduction material as well as forming technology and application thereof
  • Oriented flexible heat conduction material as well as forming technology and application thereof
  • Oriented flexible heat conduction material as well as forming technology and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0080] A molding process of an oriented flexible heat-conducting material, comprising the following steps:

[0081] Put 100 parts of vinyl-terminated polysiloxane into the kneader, 5 parts of fumed silica, 10 parts of alumina, 5 parts of polysiloxane containing silicon-hydrogen bonds, and 0.2 parts of alkynyl cyclohexanol, and knead After uniformity, add 0.1 part of platinum catalyst and 40 parts of expanded graphite and knead evenly to obtain the rubber material, take out the rubber material, put it into the directional molding mold, close the upper template, and simultaneously Pressure forming, the pressure method is 10Mpa air pressure, the time is 0.5min, and then heated and vulcanized (120°C, 60min), the movable mold bar is withdrawn, the upper mold is opened, and the vulcanized sample after orientation molding is taken out, and the oriented flexible thermal conductive material is obtained. .

[0082] Preparation of the thermally conductive sheet: Cut the obtained oriente...

Embodiment 2

[0086] A molding process of an oriented flexible heat-conducting material, comprising the following steps:

[0087] Put into the kneader 100 parts of vinyl-terminated polysiloxane, 5 parts of fumed white carbon black, 5 parts of boron nitride, 3 parts of polysiloxane containing silicon-hydrogen bond, 0.2 part of alkynyl cyclohexanol, After kneading evenly, add 0.1 part of platinum catalyst and 40 parts of expanded graphite and knead evenly to obtain the rubber material, take out the rubber material, put it into the directional molding mold, close the upper template, and place in two opposite directions parallel to the template At the same time, pressure is applied to form, the pressure method is 10Mpa air pressure, the time is 5min, and then heated and vulcanized (120°C, 60min), the movable mold bar is withdrawn, the upper mold is opened, and the vulcanized sample after orientation molding is taken out, and the oriented flexible thermal conductive material is obtained. .

[0...

Embodiment 3

[0092] A molding process of an oriented flexible heat-conducting material, comprising the following steps:

[0093] Put 100 parts of vinyl-terminated polysiloxane into the kneader, 5 parts of precipitated silica, 5 parts of aluminum oxide, 4 parts of polysiloxane containing silicon-hydrogen bonds, and 0.2 parts of alkynyl cyclohexanol, and knead After uniformity, add 0.1 part of platinum catalyst and 45 parts of expanded graphite and knead evenly to obtain the rubber material, take out the rubber material, put it into the directional molding mold, close the upper template, and simultaneously Pressure forming, the pressure method is 10Mpa air pressure, the time is 2min, and then heat vulcanization (120°C, 60min), exit the movable mold bar, open the upper mold, take out the vulcanized sample after orientation molding, and then obtain the oriented flexible thermal conductive material.

[0094] Preparation of the thermally conductive sheet: Cut the obtained oriented flexible therm...

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Abstract

The invention provides an oriented flexible heat conduction material. Main components of the oriented flexible heat conduction material are silicon rubber and anisotropism heat conduction packing. A plurality of heat conduction paths which are parallel to each other and continuous are formed in the oriented flexible heat conduction material by linearly and continuously arranging the anisotropism heat conduction packing filled in the silicon rubber in heat conduction path directions. The oriented flexible heat conduction material has good heat conduction property in a particular direction and good flexibility, can form good contact with an interface, is low in interface resistance and can be used for improving a heat dissipation effect very well. The embodiment of the invention also provides a forming technology and an application of the oriented flexible heat conduction material.

Description

technical field [0001] The invention relates to the field of flexible heat-conducting materials, in particular to an oriented flexible heat-conducting material and its forming process and application. Background technique [0002] With the continuous upgrading of electronic products and the continuous improvement of integration technology, the high density of semiconductors in products leads to a sharp increase in the accumulation of heat generated, and the accumulation of heat leads to a decrease in the reliability of products. Therefore, efficient heat dissipation methods are important for electronic products. Contents of the invention [0003] In view of this, the first aspect of the embodiments of the present invention provides an oriented flexible thermally conductive material, which has good thermal conductivity in a specific direction, and can well improve the heat dissipation effect. [0004] In the first aspect, the embodiment of the present invention provides an...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/04C08K3/36C08K3/22C08K3/04C08K3/38C08K7/06B29C43/58B29C35/02H01L23/373
CPCH01L23/373H01L23/3737H01L2924/0002B29K2083/005B29K2105/0005B29K2105/0014B29K2507/04B29K2509/00B29K2995/0013H01L2924/00B29C70/62F28F21/067F28F2255/02F28F2255/06F28F2255/14
Inventor 赵翠峰周晓松徐焰杜鸿达
Owner HUAWEI TECH CO LTD
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