Method for preparing high-heat-conductivity diamond copper-base composite material through super-high-pressure sintering
A copper-based composite material, ultra-high pressure technology, applied in metal material coating process, ion implantation plating, coating and other directions, can solve the problems of high cost, high brittleness, etc., to improve service life, short preparation time, Process conditions that are easy to achieve
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Embodiment 1
[0027] Embodiment 1: preparation diamond volume fraction is the diamond / copper composite material of 50%
[0028] In this example, diamonds with a particle size of 109-120 μm were subjected to vacuum micro-evaporation chromium plating at a temperature of 650° C., and the thickness of the chromium plating layer was 0.1 μm to obtain plated diamond particles;
[0029] In this example, 30g of plated diamond particles and 76g of copper powder with an oxygen content of less than 0.1% are put into a V-shaped mixer, mixed for 3.5 hours, and the speed is 40r / min, then 21g is taken out and put into a grinding body. Add alcohol and grind for 0.5 hours, put it into a self-made steel mold, hold the pressure for 1min under the display of 20MPa in a hydraulic press, and press it into a green body. Put the green body into a pyrophyllite mold and put it into a six-sided top press for ultra-high pressure sintering. The process conditions are: the sintering pressure is 5GPa, the power is 2100W, ...
Embodiment 2
[0031] Embodiment 2: preparation diamond volume fraction is the diamond / copper composite material of 55%
[0032] Carry out vacuum micro-evaporation chromium plating at a temperature of 700°C on diamonds with a particle size of 109-120 μm, and the thickness of the chromium plating is 0.1 μm to obtain plated diamond particles;
[0033] The electrolytic copper powder is reduced by hydrogen in a tube furnace, the reduction temperature is 350°C, the reduction holding time is 3.5 hours, and the reduced copper powder with an oxygen content of less than 0.1% is obtained;
[0034] In this example, put 28g of plated diamond particles and 58g of reduced copper powder into a V-shaped mixer, mix for 4 hours at a speed of 35r / min, then take out 21g, put it into a grinding body, and add alcohol to grind After 0.5 hours, put it into a self-made steel mold, hold the pressure for 1min under the hydraulic pressure display of 15MPa, and press it into a green body. Put the green body into a pyro...
Embodiment 3
[0036] Embodiment 3: preparation diamond volume fraction is the diamond / copper composite material of 50%
[0037] Carry out vacuum micro-evaporation chromium plating at a temperature of 750°C on diamonds with a particle size of 109-120 μm. The thickness of the chromium plating is 0.1 μm to obtain plated diamond particles;
[0038] The electrolytic copper powder is reduced by hydrogen in a tube furnace, the reduction temperature is 400°C, the reduction holding time is 3 hours, and the reduced copper powder with an oxygen content of less than 0.1% is obtained;
[0039] In this example, put 24g of plated diamond particles and 61g of reduced copper powder into a V-type mixer, mix for 5 hours at a speed of 30r / min, then take out 21g, put it into a grinding body, and add alcohol for grinding After 0.5 hours, put it into a self-made steel mold, hold the pressure for 1min under the hydraulic pressure display of 15MPa, and press it into a green body. Put the body into a pyrophyllite m...
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