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36results about How to "Avoid associativity" patented technology

Surface grafting modified aramid fiber and preparation method thereof

The invention relates to a surface grafting modified aramid fiber and a preparation method of the fiber. The method comprises the following steps of: mixing gamma-glycidoxypropyltrimethoxysilane with the aramid fiber with amino on the surface, placing the above mixture into a mixed solution of gamma-methacryloxypropyltrimethoxylsilane and another alkoxy silane, adding deionized water and an organic solvent into the resulting product, and carrying out cleaning and drying after the reaction ends to obtain hyperbranched polysiloxane modified aramid fiber, wherein the surface of the obtained fiber is connected with methacryloxy and another active functional group through chemical bonds. The surface of the fiber provided by the invention not only has the group capable of resisting strong ultraviolet irradiation, but also has the active functional group with high reactivity, as well as is improved in interface bond performance with a resin matrix; the types of the active functional groups can also be changed by regulating process conditions to adapt to reactions with a plurality of different resin matrixes to obtain a plurality of composite materials with outstanding comprehensive performance; and the fiber provided by the invention has the characteristics of high flexibility, strong controllability and wide application field range.
Owner:SUZHOU UNIV +1

Preparation method, product and application of BiOI/WO3 heterojunction efficient photoelectrocatalysis electrodes

The invention discloses a preparation method, product and application of BiOI/WO3 heterojunction efficient photoelectrocatalysis electrodes, and particularly relates to that a hydrothermal method is adopted firstly. WO3 films grow in situ on FTO, bismuth nitrate, potassium iodide, anhydrous ethanol and p-benzoquinone are used for preparing an electro-deposition solution according to certain raw material ratio, the electrodeposition of the BiOI is conducted on the WO3 in the electro-deposition solution to prepare the BiOI/WO3 heterojunction photoelectrocatalysis electrodes. By changing the timeof electrodeposition, BiOI/WO3 heterojunction electrodes with different shapes and thicknesses are obtained. According to the preparation method of the BiOI/WO3 heterojunction efficient photoelectrocatalysis electrodes, the prepared BiOI/WO3 heterojunction electrodes have higher activity of photoelectrocatalysis degradation of organic wastewater than pure WO3, and the preparation method has the characteristics of easy availability of raw materials, simple production processes, and the like, the heterojunction photoelectrocatalysis electrodes can be used circularly without causing secondary pollution.
Owner:XI'AN UNIVERSITY OF ARCHITECTURE AND TECHNOLOGY

Multi-material photocuring 3D printing equipment

The invention discloses multi-material photocuring 3D printing equipment, and belongs to the technical field of 3D printing. The multi-material photocuring 3D printing equipment comprises a forming platform, an integrated nozzle extrusion mechanism, a coating spreading mechanism and a photocuring mechanism, wherein the integrated nozzle extrusion mechanism is arranged above the forming platform, comprises a plurality of extrusion nozzles and a plurality of charging barrels corresponding to the extrusion nozzles, discharge ports of the charging barrels communicate with the extrusion nozzles through conveying pipes, the coating spreading mechanism is arranged on one side of the forming platform, and the photocuring mechanism is arranged above the forming platform; and different kinds of printing materials are sequentially stacked on the forming platform through the plurality of extrusion nozzles, the stacked printing materials are evenly spread through the coating spreading mechanism, and the photocuring mechanism provides a light source for curing the printing materials and enables the printing materials to be polymerized and formed by adjusting a light path. The multi-material photocuring 3D printing equipment can achieve integral manufacturing of large-size multi-material parts, is easy to operate, can avoid mutual pollution of different materials, is high in interface bonding performance of formed heterogeneous materials, and is suitable for preparing heterogeneous and multi-level structure heterogeneous materials.
Owner:HUAZHONG UNIV OF SCI & TECH

Receiver pulse signal interference evaluation method based on error rate

The invention discloses a receiver pulse signal interference evaluation method based on an error rate. The method comprises the following steps: S1, determining an error rate calculation formula of a receiver under pulse signal interference; s2, preparing two groups of receiving antennas of which the working frequencies cover the passband of the receiver, wherein one group of receiving antennas is connected with a broadband oscilloscope, and the other group of receiving antennas is connected with a spectrum analyzer; s3, processing the data received by the broadband oscilloscope and the spectrum analyzer and obtaining the pulse period, the pulse width and the received signal to interference ratio of the unknown pulse signal when being interfered by the unknown pulse signal; s4, estimating the bit error rate value of the receiver under the pulse interference according to the bit error rate calculation formula obtained in the step S1; and S5, evaluating the disturbed degree of the receiver according to the predetermined relationship between the bit error rate and the working efficiency of the receiver and the estimated error rate. According to the method, the interference degree of the pulse signal on the receiver is objectively quantified, and the effectiveness of the evaluation result is ensured.
Owner:BEIHANG UNIV

Condensation type ultraviolet emission device packaging structure

The invention, which relates to the technical field of the semiconductor packaging structure, provides a packaging structure of a condensation type ultraviolet emission device, comprising a substrate, a light-emitting cup, an ultraviolet emission chip and a lens, the incident plane of the lens is a plane, and the light-emitting surface is a convex surface. An annular flange extending in the direction away from the lens is arranged on the peripheral face of the end, used for making contact with the light outlet cup, of the lens, a first annular boss extending towards the base is arranged on the edge, away from the lens, of the annular flange, a first annular groove is formed in the end face, provided with the light outlet, of the light outlet cup, and the first annular boss extends into the first annular groove. The inner wall of the first annular boss abuts against the side wall of the first annular groove, the bottom face of the first annular boss abuts against the bottom face of the first annular groove, the inner wall of the first annular boss is connected with the side wall of the first annular groove in an adhesive mode through an adhesive, and the bottom face of the first annular boss is connected with the bottom face of the first annular groove in an adhesive mode through an adhesive mode. According to the scheme provided by the invention, the transmission distance of ultraviolet rays and the stability of a product structure can be improved.
Owner:ZHIXIN SEMICON (HANGZHOU) CO LTD

Connecting structure of hydraulic oil cylinder top cover and oil cylinder

PendingCN114109964AAvoid easy disassemblyAvoid possible thread damage after disassemblyThermal insulationFluid-pressure actuatorsThermodynamicsSilicon rubber
The invention relates to the technical field of top cover and oil cylinder connecting structures, in particular to a hydraulic oil cylinder top cover and oil cylinder connecting structure which comprises an oil cylinder body, an oil cylinder top cover body is arranged on the outer surface of the upper end of the oil cylinder body, and inner hexagon screws which are evenly distributed are arranged on the outer surface of the upper end of the oil cylinder top cover body. The oil cylinder body is fixedly connected with the oil cylinder top cover body through an inner hexagon screw, and a movable rod is movably connected to the outer surface of the upper end of the oil cylinder top cover body in a penetrating and sealing mode. Through the arrangement of the first connecting groove, when oil starts to enter the oil cylinder body, due to the fact that the temperature of hydraulic oil is about 70 DEG C, substances such as carbon dioxide and air which are prone to expanding after being heated are contained in the first air bag, and the first air bag is made of a silicon rubber material, the problem that in the prior art, when thread loosening is solved through thread fixing and locking glue is avoided; and the problem that the screw thread or the surface of the combined part is possibly damaged after the screw thread or the combined part is disassembled is solved, and the overall practicability is improved.
Owner:侯祖刚

Preparation process of chip-type fixed resistor with good stability

The invention relates to a preparation process of a chip-type fixed resistor with good stability. The preparation process comprises the following steps: cutting a resistor body according to a specified technological size, and respectively transversely and longitudinally arranging slots on the upper surface and the lower surface of the resistor body; printing a negative electrode on the back surface of a base plate substrate, wherein the negative electrode is arranged on a transverse cutting line between a longitudinal cutting line and through holes adjacent to the longitudinal cutting line as well as transverse cutting lines among the through holes; printing a positive electrode on the front surface of the base plate substrate, and performing the molding processing by aligning the positive electrode to the negative electrode; and then molding, washing and nickel plating to obtain the chip-type fixed resistor. By adopting a way for printing a surface electrode on the positive electrode of the base plate substrate, the surface electrode can sufficiently fill and cover the part of the front electrode on the transverse cutting lines, so that a coated conductive layer is firmly combined with the back surface electrode and the surface electrode, and the stability of the resistor is better.
Owner:天津泰新益科技发展有限公司

Bonding structure, bonding method and packaging box body containing bonding structure

Disclosed are a bonding structure, a bonding method and a packaging box body containing the bonding structure; the bonding structure comprises a quantum chip and a PCB; the PCB is used for being bonded with the quantum chip, an opening is formed in the PCB, and the length, the width or the diameter size of the opening are smaller than the corresponding size of the quantum chip; the quantum chip islocated below the opening of the PCB and makes contact with the PCB; the upper surface of the first part of the quantum chip is exposed through the opening, and the upper surface of the second part is shielded by the PCB on the edge of the opening. The size of the opening is smaller than that of the quantum chip, so that the quantum chip can be in additional contact with the PCB from the back surface of the PCB, the area where the quantum chip makes contact with the PCB can be used for grounding or signal connection, the wiring area on the front surface of the PCB is effectively saved, and the overall bonding strength is improved; and in addition, the phenomenon that the chip and a sample box base are not firmly combined and the heat contact between the chip and the base is poor during installation when a chip is placed from the front surface of the PCB can be avoided.
Owner:UNIV OF SCI & TECH OF CHINA

Colored anti-skid pavement paving material and paving method thereof

The invention discloses a colored anti-skid pavement paving material, which comprises a base material and a colored glass anti-skid aggregate, and is characterized in that the base material is prepared from the following components in percentage by weight: 30 percent of 601 type prepolymer resin, 10 percent of 602 type prepolymer resin, 2.5 percent of toner, 57 percent of calcium carbonate, 0.5 percent of dispersing agent, 0.1 to 0.3 percent of accelerant, 0.1 percent of stabilizer, and 0.1 percent of antioxygen; the weight of the colored glass non-slip aggregate is 30 to 50 percent of the weight of the base material. The anti-skid aggregate subjected to coating is premixed in the high-fluidity base material, so that the aggregate can maintain favorable fluidity while organically combining with the base material to form a whole structure, one-time forming and paving processes can be realized, potential quality hazards, such as unevenness of aggregate distribution, poor combination of the aggregate and the base material, and impurity pollution, easily caused by the existing process are avoided, the anti-skid pavement paving quality is ensured to the greatest extent, and the problems that the existing colored anti-skid pavement paving process is low in efficiency, great in waste and high in cost, and mechanical construction cannot be adopted can be fundamentally solved.
Owner:ANHUI TOPLIGHT MATERIAL TECH CO LTD
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