Preparation process of chip-type fixed resistor with good stability
A technology of fixed resistance and preparation process, applied in the direction of adding terminal resistors, resistors, resistance manufacturing, etc., can solve the problems of high failure rate of resistors, large resistance deviation, circuit damage, etc., to achieve good stability and good resistance. Effect
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Embodiment 1
[0023] A preparation process for a chip type fixed resistor with good stability, the steps are:
[0024] Cut the resistor body according to the specified process size, and set grooves horizontally and vertically on the upper and lower surfaces of the resistor body;
[0025] (2) Printing a negative electrode on the back of the base substrate, the negative electrode is located on the transverse score line between the longitudinal score line and the perforation adjacent to the longitudinal score line, and the transverse score line between each perforation;
[0026] (3) Print the positive electrode on the front side of the bottom substrate, the position of the positive electrode corresponds to the negative electrode, forming treatment; print a surface electrode on each positive electrode of the bottom substrate, forming treatment, and then fire the negative electrode and the positive electrode ;
[0027] (4) Print and form a resistance layer between the longitudinal directions of...
Embodiment 2
[0036] A preparation process for a chip type fixed resistor with good stability, the steps are:
[0037] Cut the resistor body according to the specified process size, and set grooves horizontally and vertically on the upper and lower surfaces of the resistor body;
[0038] (2) Printing a negative electrode on the back of the base substrate, the negative electrode is located on the transverse score line between the longitudinal score line and the perforation adjacent to the longitudinal score line, and the transverse score line between each perforation;
[0039] (3) Print the positive electrode on the front side of the bottom substrate, the position of the positive electrode corresponds to the negative electrode, forming treatment; print a surface electrode on each positive electrode of the bottom substrate, forming treatment, and then fire the negative electrode and the positive electrode ;
[0040] (4) Print and form a resistance layer between the longitudinal directions of...
Embodiment 3
[0050] A preparation process for a chip type fixed resistor with good stability, the steps are as follows:
[0051] (1) Cut the resistor body according to the specified process size, and set the horizontal and vertical grooves on the upper and lower surfaces of the resistor body respectively;
[0052] (2) Printing a negative electrode on the back of the base substrate, the negative electrode is located on the transverse score line between the longitudinal score line and the perforation adjacent to the longitudinal score line, and the transverse score line between each perforation;
[0053] (3) Print the positive electrode on the front side of the bottom substrate, the position of the positive electrode corresponds to the negative electrode, forming treatment; print a surface electrode on each positive electrode of the bottom substrate, forming treatment, and then fire the negative electrode and the positive electrode ;
[0054] (4) Print and form a resistance layer between the ...
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