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Semiconductor production method

A production method and semiconductor technology, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve the problems of reducing product yield, position shift, product scrap, etc., to reduce production difficulty and improve yield. , to avoid the effect of tilt

Active Publication Date: 2017-09-01
GREAT TEAM BACKEND FOUNDRY (DONGGUAN) LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing semiconductor production process, the position of the copper bridge frame usually shifts when it is soldered to the lead frame by reflow soldering, and the shift often exceeds the allowable range of production, which leads to product scrapping and reduces the yield of the product

Method used

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  • Semiconductor production method
  • Semiconductor production method
  • Semiconductor production method

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Embodiment Construction

[0047] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only the technical solutions of the present invention. Some, but not all, embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0048] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct...

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Abstract

The invention discloses a semiconductor production method. A lead frame and a copper bridge frame having positioning holes are provided; the surface of the lead frame is printed with a bonding material; punching is carried out on the lead frame with the bonding material printed so as to form positioning teeth plugging with the positioning holes cooperatively; and the lead frame and the copper bridge frame are assembled and the lead frame and the copper bridge frame are welded by means of reflow soldering. Because punching is carried out after printing of the bonding material at the lead frame and then the positioning teeth are formed, welding positioning of the copper bridge frame is realized by plugging of the positioning teeth with the positioning holes of the copper bridge frame, thereby overcoming defects like the position deviation caused by reflow soldering of the copper bridge frame, protecting the copper bridge frame from being affected during the reflow soldering process, and improving the product yield. Moreover, the positioning teeth forming by punching is done after bonding material printing, so that the production difficulty can be reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a semiconductor production method. Background technique [0002] At present, the production process of semiconductors is mainly as follows: setting bonding material on the lead frame, placing the chip to be welded on the corresponding position of the bonding material, reflow soldering the chip and the lead frame through the bonding material, printing the bonding material on the surface of the chip and the lead frame, and then The copper bridge frame is placed on the lead frame and chip, and then the copper bridge frame is reflow soldered. In the existing semiconductor production process, the position of the copper bridge frame usually shifts when it is soldered to the lead frame by reflow soldering, and the shift often exceeds the production allowable range, which leads to product scrapping and reduces the yield of the product. Contents of the invention [0003] The obj...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60
CPCH01L24/83H01L2224/83815H01L2224/97H01L2224/38H01L2224/40245
Inventor 曹周黄源炜桑林波
Owner GREAT TEAM BACKEND FOUNDRY (DONGGUAN) LTD
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