Micro-nano layer-shaped copper/copper alloy composite board and preparation method thereof

A composite plate and copper alloy technology, applied in metal rolling, metal rolling, metal processing equipment, etc., can solve the problems of low material utilization rate, limited strength improvement, insufficient interface bonding strength, etc., to achieve the number of plate layers and Controllable thickness, improved smoothness and flatness, and high raw material utilization

Pending Publication Date: 2021-11-12
ANHUI UNIVERSITY OF TECHNOLOGY AND SCIENCE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Physical vapor deposition and high pressure torsion techniques suffer from the same disadvantages of low productivity and small sample size
Although the cumulative stack rolling technology overcomes the above difficulties, the material utilization rate is generally not high, and the interface is easily polluted, and the interface bonding strength is not enough
Although the diffusion welding + rolling technology has improved the interface bonding strength, material utilization, product size and production efficiency, the thickness of the sample microlayer is relatively large, and it is difficult to reduce it to less than 100 μm, so the strength improvement is very limited

Method used

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  • Micro-nano layer-shaped copper/copper alloy composite board and preparation method thereof
  • Micro-nano layer-shaped copper/copper alloy composite board and preparation method thereof
  • Micro-nano layer-shaped copper/copper alloy composite board and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] This embodiment adopts the following equipment: thermal diffusion welding equipment, forging equipment, and four-roll rolling mill.

[0044] The process flow chart of the preparation method for preparing a micro-nano layered copper / copper alloy composite board in this embodiment is as follows figure 1 As shown, the specific operation is as follows:

[0045] 1) The copper and copper alloy used in this embodiment are T2 pure copper and H70 brass respectively, the thickness of the T2 pure copper plate is 1mm, the thickness of the H70 brass plate is 0.8mm, and the plane size is 80×100mm 2 , the chemical composition (mass percentage) of the T2 pure copper plate used is: Cu+Ag: 99.94%, Zn: 0.0041%, Pb: 0.0007%, Sn: 0.0005%, Fe: 0.0031%, Ni: 0.0028% , Si: 0.028%, and the rest are unavoidable impurities; the chemical composition (mass percentage) of H70 brass plate is: Cu: 70.12%, Zn: 29.7%, Fe: 0.035%, Pb: 0.001%, Sb: 0.001%, Bi: 0.0006%, Ni: 0.08%, and the rest are unavoida...

Embodiment 2

[0051] This embodiment adopts the following equipment: thermal diffusion welding equipment, forging equipment, and four-roll rolling mill.

[0052] The process flow chart of the preparation method for preparing a micro-nano layered copper / copper alloy composite plate / foil in this example is as follows figure 1 As shown, the specific operation is as follows:

[0053] 1) The thickness of the T2 pure copper used in this embodiment is 0.5mm, the thickness of the QAl-10-3-1.5 aluminum bronze plate is 0.5mm, and the plane size is 100×100mm 2 , the chemical composition (mass percentage) of pure copper used is: Cu+Ag: 99.94%, Zn: 0.0041%, Pb: 0.0007%, Sn: 0.0005%, Fe: 0.0031%, Ni: 0.0028%, Si : 0.028%, the rest are unavoidable impurities; the chemical composition (mass percentage) of QAl-10-3-1.5 aluminum bronze is: Cu: 84.12%, Al: 9.67%, Mn: 1.52%, Zn: 0.50% , Fe: 3.21%, Pb: 0.03%, Ni: 0.51%, and the rest are unavoidable impurities.

[0054] 2) Select 100 pieces of T2 pure copper ...

Embodiment 3

[0059] This embodiment adopts the following equipment: thermal diffusion welding equipment, forging equipment, and four-roll rolling mill.

[0060] The process flow chart of the preparation method for preparing a micro-nano layered copper / copper alloy composite plate / foil in this example is as follows figure 1 As shown, the specific operation is as follows:

[0061] 1) The thickness of the T2 pure copper used in this embodiment is 1 mm, the thickness of the copper chromium zirconium plate is 1 mm, and the plane size is 50 × 50 mm 2 , the chemical composition (mass percentage) of pure copper used is: Cu+Ag: 99.94%, Zn: 0.0041%, Pb: 0.0007%, Sn: 0.0005%, Fe: 0.0031%, Ni: 0.0028%, Si : 0.028%, the rest are unavoidable impurities; the chemical composition (mass percentage) of copper chromium zirconium is: Cu: 96.90%, Al: 0.23%, Mg: 0.184%, Cr: 0.57%, Zr: 0.50%, Fe: 0.49%, Si: 0.51%, P: 0.11%, and the rest are unavoidable impurities.

[0062] 2) Select 10 pieces of T2 pure coppe...

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Abstract

The invention provides a micro-nano layer-shaped copper/copper alloy composite board and a preparation method thereof. Copper and copper alloy boards with the thickness ranging from 0.5 mm to 2 mm are stacked in a multi-layer manner, then the copper and copper alloy boards are tightly welded together through a thermal diffusion welding treatment means, then the thickness of the boards is reduced to 10 mm or below through a forging treatment process, and finally, the micro-nano layer-shaped copper/copper alloy composite board/foil is obtained through a traditional rolling technology. Compared with the prior art, layers of the board are firmly combined, the number of layers and the thickness of the board are controllable, and the thickness of the composite board can reach the thickness of a foil.

Description

technical field [0001] The invention relates to the field of preparation of structural materials, in particular to a micro-nano layered copper / copper alloy composite plate and a preparation method thereof. Background technique [0002] Copper and copper alloys are non-ferrous metal materials widely used in modern industry. At present, the demand for copper and copper alloys in microelectronics, machinery manufacturing, construction industry, aerospace and other fields continues to grow. Coarse crystalline copper and copper alloys have low strength. How to improve their strength has attracted extensive attention from the industrial and scientific circles. Improving the strength of copper and copper alloys will promote their further applications. [0003] The layered structure design can effectively improve the strength and plasticity of the metal material, and the strength of the material will increase significantly with the decrease of the layer thickness, so the layered co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21B1/38B21B3/00B21B47/00
CPCB21B1/38B21B3/00B21B47/00B21B2001/386B21B2003/005
Inventor 李建生王晓震王刚刘桐赵禹鹿宪珂陈明桂凯旋
Owner ANHUI UNIVERSITY OF TECHNOLOGY AND SCIENCE
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