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133 results about "Copper nickel alloy" patented technology

Method for comprehensively recovering copper-nickel concentrate

The invention discloses a comprehensive recovery method for copper-nickel concentrate, which comprises the following steps: smelting the copper-nickel concentrate to obtain smelting slag and high-nickel copper matte which are layered up and down; performing side-blowing converting on the air-quenched and granulated high-nickel copper matte to obtain high-nickel converting slag which is layered up and down and qualified crude copper; the liquid smelting slag and the high-nickel converting slag are mixed for two-step reduction smelting, iron slag and copper-nickel alloy which are layered up and down are obtained through weak reduction, and reducing slag and molten iron which are layered up and down are obtained through strong reduction. According to the method disclosed by the invention, one-step removal of the Ni element is realized through side-blowing reinforced stirring of the granulated copper matte, so that application of the high-nickel copper concentrate to large-scale continuous copper smelting becomes possible. And meanwhile, through cooperative treatment of the smelting slag and the converting slag, short-process comprehensive recovery of Cu, Ni and Fe elements is achieved. The deeply depleted tailings are subjected to water quenching to form a calcium-silicon glass body which has a curing effect on heavy metal ions and is a high-quality building raw material, high-valued and full-quality utilization of mineral resources is realized, and the method is a brand-new technical route for widening the application range of raw materials, reducing cost and improving efficiency in a copper smelting plant.
Owner:CINF ENG CO LTD

Copper-nickel alloy foil and preparation method and application thereof

The invention provides a copper-nickel alloy foil and a preparation method and application thereof, and belongs to the technical field of lithium ion battery negative electrode current collectors, and the preparation method comprises the following steps: preparing a copper-nickel composite electrolyte, and adding a coordination agent, a pH buffer agent and an additive into the copper-nickel composite electrolyte to obtain a mixed electrolyte; the coordination agent comprises a main coordination agent and an auxiliary coordination agent, and the main coordination agent comprises at least one of trisodium citrate, potassium sodium tartrate and sodium pyrophosphate; the auxiliary coordination agent comprises at least one of ammonia water, glycine and triethanolamine; and a cathode and an anode are placed in the mixed electrolyte, the pH of the mixed electrolyte is controlled to be 6-10, direct current is applied for electrochemical deposition, and the copper-nickel alloy foil is obtained. According to the method, the alkalescence system is adopted, the main coordination agent and the auxiliary coordination agent are used, full coordination of free Cu < 2 + > and Ni < 2 + > is achieved, precipitation is avoided, the hydrogen evolution phenomenon is greatly reduced, and the alloy foil quality is improved.
Owner:HUBEI ZHONGYI TECH +1

Production process of novel copper-based alloy bimetallic synthesis material

The invention discloses a production process of a novel copper-based alloy bimetallic synthesis material, and relates to the field of alloy materials.The production process comprises the steps that a copper-nickel alloy is selected as a base material, a titanium alloy is selected as a functional layer, and stress distribution of a bonding layer is designed and optimized through gradient component distribution; preparing a copper-nickel alloy liquid by utilizing vacuum induction melting, supporting and fixing a core rod through three points, and controlling temperature and flow velocity for pouring to form co-growth crystals; the surface of the base material is cleaned through a sand blasting process, a Cu-Ti nano coating is coated through a PVD technology, and a nanoscale convex-concave structure is formed; building a mathematical model of a temperature field and a component diffusion field, and optimizing and combining area temperature distribution and diffusion behaviors through simulation analysis; through gradient temperature control annealing treatment, residual stress is eliminated, and diffusion is promoted; the bonding performance is evaluated by combining shear strength and microhardness tests; and dividing the production process based on the modular design. The method can be widely applied to the industrial fields with high-temperature, high-strength and corrosion-resistant requirements.
Owner:SHANGHAI HEWEI IND

Seawater conductivity sensor electrode material based on copper-nickel-based nanostructure and preparation method of seawater conductivity sensor electrode material

The invention discloses a seawater conductivity sensor electrode material based on a copper-nickel-based nanostructure and a preparation method, the electrode material comprises: a substrate, a copper-nickel-based nanostructure layer being formed on the surface of the substrate; the substrate comprises an insulating compound and a coating coated on the surface of the insulating compound, the insulating compound comprises at least one of high-resistance silicon, silicon oxide, aluminum oxide ceramic and plastic, the coating comprises a metal coating and / or a semiconductor coating, and the copper-nickel-based nanostructure layer is in a dendritic crystal or cluster form. The copper-nickel alloy nanostructure is a core material of the electrode, so that the electrode material has high specific surface area and rich active sites, the measurement accuracy and measurement limit of the electrode material can be improved, the service life can be prolonged, the manufacturing cost can be reduced, and the application requirements of the ocean Internet of Things can be met.
Owner:OCEANOGRAPHIC INSTR RES INST SHANDONG ACAD OF SCI

Normalized high-strength medium-carbon acid-resistant container steel and preparation method thereof

PendingCN120210664AChemical compositionNiobium
The invention relates to normalized high-strength medium-carbon acid-resistant container steel and a preparation method, and belongs to the technical field of steel manufacturing. The acid-resistant container steel comprises the following chemical components in percentage by mass: less than or equal to 0.20% of C, less than or equal to 0.55% of Si, 1.20-1.70% of Mn, less than or equal to 0.025% of P, less than or equal to 0.010% of S, less than or equal to 0.050% of Nb, less than or equal to 0.050% of V, less than or equal to 0.030% of Ti, more than or equal to 0.020% of Al, less than or equal to 0.0060% of Ca and a matrix element Fe. A proper amount of Nb (niobium), V (vanadium) and Ti (titanium) alloy elements are added to replace a traditional Cu (copper) and Ni (nickel) alloy combination, and the alloy component cost is greatly reduced while high strength and acid resistance are guaranteed.
Owner:SHOUGANG GROUP CO LTD

Alternating current weak current high-precision detection system and method

The invention provides an alternating-current weak current high-precision detection system and method, and the system comprises a copper-nickel alloy shielding cover which is used for inhibiting space power frequency radiation interference and power system broadband noise, and a magnetic sensitive element which is used for converting the detected magnetic field change into a corresponding initial current signal, the trans-impedance amplifier is used for converting the initial current signal into a voltage signal; the adaptive noise suppression module collects a power frequency fundamental wave reference signal and a harmonic wave reference signal, generates a harmonic wave anti-phase counteracting signal, and performs anti-phase counteracting on real noise of the initial current signal; the analog-to-digital converter is used for converting the voltage signal into a discretized digital signal, and the discretized digital signal comprises a target signal and a random noise signal; and the FPGA coherent demodulation module is used for carrying out cross-correlation operation and narrow-band filtering on the target signal and the random noise signal to separate out a micro-current signal. The technical problems that in the prior art, composite noise covering is limited, the frequency fluctuation adaptability is poor, and microvolt-level signals are difficult to capture are solved.
Owner:NINGBO CRRC TIMES TRANSDUCER TECH CO LTD

Gradient copper-nickel alloy and preparation method thereof

The invention discloses a gradient copper-nickel alloy and a preparation method thereof, and belongs to the technical field of alloy preparation. CuCrZr is laid on the substrate, laser printing is carried out, and a CuCrZr alloy layer is formed on the surface of the substrate; gradient powder feeding printing is carried out on the CuCrZr alloy layer, and circulation is carried out for multiple times; the conveyed powder comprises CuCrZr and GH4169, the content of the CuCrZr is reduced along with the number of times of gradient powder feeding printing, and during last gradient powder feeding printing, only GH4169 is conveyed, printing is conducted, and the gradient copper-nickel alloy is obtained. Through the composition gradient design from CuCrZr to GH4169 and the multi-cycle printing process, collaborative improvement of high strength and high plasticity is achieved, and the product of high strength and ductility is obtained. According to the method, a single component can realize structure-function integration from high thermal conductivity and electrical conductivity to excellent high-temperature strength and corrosion resistance, and the application potential of a material system in different fields is greatly expanded.
Owner:QILU UNIVERSITY OF TECHNOLOGY (SHANDONG ACADEMY OF SCIENCES)

Multi-measuring-point armored alloy thermocouple and compensation calibration method thereof

The multi-measuring-point armored alloy thermocouple comprises a thermode, a metal armored layer arranged outside the thermode in a sleeving mode and an insulating material filled between the thermode and the metal armored layer, a plurality of metal wires of the thermode are made of copper-nickel alloy materials and are arranged in order, one ends of the metal wires are welded to form a measuring end, and the other ends of the metal wires are welded to form a welding end. The metal armor layer adopts a layered structure design and is composed of an innermost layer, a middle layer and an outermost layer; the metal armoring layer adopts a spiral winding armoring structure design, and an armoring material is wound around the thermocouple wire in a spiral mode. According to the invention, research is carried out from the aspects of structure, process method, dynamic characteristics, numerical simulation, alloy material components and the like, and analysis and inspection are carried out in combination with the means of theoretical analysis, experimental test and the like, so that the use of precious thermocouple materials is effectively reduced; and finally, the comprehensive performances such as the bending quality, the dynamic response time, the measurement precision, the stability and the manufacturing cost of the armored cable are improved.
Owner:XINGUO GRP CO LTD

Aluminum-copper composite strip and preparation method thereof

The invention discloses an aluminum-copper composite strip and a preparation method thereof, the strip comprises a copper alloy layer, an aluminum material layer and an intermetallic compound layer, the aluminum material layer is embedded in the copper alloy layer, the intermetallic compound layer is located between the copper alloy layer and the aluminum material layer, the copper alloy layer is a precipitation strengthening type copper-nickel alloy, and the intermetallic compound layer is an aluminum alloy layer. The average particle size of second-phase particles in the copper alloy layer is smaller than or equal to 20 nm, the intermetallic compound layer is composed of a first diffusion layer and a second diffusion layer which are stacked, the first diffusion layer contains a Cu9Al4 intermetallic compound, the second diffusion layer contains a CuAl2 intermetallic compound, and the thickness of the second diffusion layer is smaller than or equal to 2 microns. The preparation method of the strip comprises the technological processes of grooving, surface cleaning, composite rolling, intermediate annealing, cold rolling, annealing before forming, splitting and packaging. The strip achieves good matching of strength, conductivity, heat stress relaxation resistance and bending performance, and is suitable for occasions with high requirements for comprehensive performance of materials, such as automobile wire harness connecting terminals and the like.
Owner:NINGBO POWERWAY ALLOY MATERIAL CO LTD +2

Copper-nickel alloy nanoparticle catalyst, preparation method thereof and application of copper-nickel alloy nanoparticle catalyst in microbial electrosynthesis

PendingCN120082916ACellsElectrolytic organic productionMicrobial electrosynthesisPtru catalyst
The invention discloses a copper-nickel alloy nanoparticle catalyst and a preparation method and application thereof in microbial electrosynthesis, and belongs to the technical field of energy conversion and microbial electrosynthesis, the preparation method comprises the following steps: dissolving Cu (NO3) 2 and Ni (NO3) 2 in a mixed solution of water and ethanol, dispensing the mixed solution on a carbon-based material, drying the surface by baking and drying overnight, and obtaining the copper-nickel alloy nanoparticle catalyst. A copper-nickel loaded carbon-based material is obtained; calcining the copper-nickel loaded carbon-based material in air at 350-450 DEG C to obtain a copper-nickel oxide loaded carbon-based material; and reducing the carbon-based material loaded with the copper-nickel oxide in flowing H2 at 500-600 DEG C to obtain the copper-nickel alloy nanoparticle catalyst. According to the method, the volatile fatty acid can be synthesized by taking CO2 as a raw material, and the product yield and the Faraday efficiency are relatively high. The method is simple to operate, mild in condition and low in cost, and has relatively high environmental benefits.
Owner:SOUTHEAST UNIV

High-pressure air separation liquid valve with multi-stage low-temperature self-tightening sealing structure

The invention relates to a high-pressure air separation liquid valve with a multi-stage low-temperature self-tightening sealing structure, which relates to the technical field of low-temperature high-pressure fluid control and comprises a valve body assembly, a multi-stage sealing assembly and a valve rod thermal compensation assembly. The multi-stage sealing assembly is arranged on the valve element in a stepped mode and comprises a primary metal hard sealing ring, a secondary modified PTFE sealing ring and a three-stage self-tightening type metal spring energy storage ring, and the main sealing function, the flexible compensation function and the pressure self-tightening function are achieved respectively. The valve rod thermal compensation assembly comprises a titanium alloy valve rod and a copper-nickel alloy thermal buffer sleeve, and the displacement of the sealing face is automatically compensated at the low temperature through the difference between a reserved gap and the thermal expansion coefficient of a material. Through multi-stage sealing cooperation and intelligent thermal compensation, the problem of sealing leakage caused by material failure and thermal deformation under the ultralow-temperature and high-pressure working conditions is effectively solved, all-working-condition reliable sealing is achieved, the safety of the valve in the extreme environment is remarkably improved, and the service life of the valve in the extreme environment is remarkably prolonged.
Owner:CHANGZHOU YINGDE GAS CO LTD

Natural seawater natural film forming test device for copper-nickel alloy heat transfer tube

The invention provides a copper-nickel alloy heat transfer pipe natural seawater natural film forming test device, which comprises a water pump, a seawater pipeline, at least one flusher module and a control system, seawater enters the flusher module through the water pump and the seawater pipeline, each flusher module comprises a water inlet water mixer, a water return water mixer and a heat transfer pipe, the inlet water mixer is provided with a plurality of water inlet end connectors, the return water mixer is correspondingly provided with a plurality of water outlet end connectors, one end of each heat transfer pipe is communicated with the corresponding water inlet end connector, the other end of each heat transfer pipe is communicated with the corresponding water outlet end connector, and the interiors of the inlet water mixer and the return water mixer are of labyrinth structures. The flow velocity of seawater entering different heat transfer pipes is kept consistent. By adopting the natural film-forming test device, a natural seawater natural film-forming test can be carried out on a plurality of heat transfer pipes at the same time, and by combining the positions of the water inlet end interface and the water outlet end interface and through a labyrinth structure in the water inlet and return water mixer, the same flow velocity of seawater in the heat transfer pipes with different specifications is realized, so that the natural film-forming test requirement is met; and a technical support is provided for corrosion protection of the copper-nickel alloy heat transfer pipe of ship sea communication heat exchange equipment.
Owner:CHINA SHIPBUILDING INDUSTRY CORPORATION NO725 RESEARCH INSTITUTE

Manufacturing method of copper-nickel alloy pipe with excellent high-temperature plasticity

The invention provides a manufacturing method of a copper-nickel alloy pipe with excellent high-temperature plasticity. The manufacturing method comprises the following steps that S1, Ni, Fe, Mn, Ti, CuMg20 and Cu raw materials are weighed according to components of a nickel-based alloy pipe; s2, raw materials of Cu, Ni, Fe, Mn and Ti are smelted, CuMg20 is added for deoxidation, and an alloy round ingot is obtained through casting; s3, the alloy round ingot is subjected to homogenizing annealing; s4, forging and upsetting the alloy round ingot to obtain an upset round ingot; s5, performing hot extrusion on the upset round ingot to obtain a tubular billet; s6, the tubular billet is subjected to cold rolling, and annealing is conducted between pass cold rolling; and S7, the tubular billet is subjected to heat treatment, and the copper-nickel alloy pipe is obtained. According to the method, the uniformity and thermoplasticity of the alloy structure are improved, the plasticity and comprehensive mechanical performance of the copper-nickel alloy pipe in the high-temperature environment are remarkably improved, and the method is stable, high in repeatability and beneficial to large-scale production of the high-quality copper-nickel alloy pipe.
Owner:WUXI LONGDA METAL MATERIAL CO LTD

Method for preparing copper-nickel alloy for solid-state battery through alkaline system

The invention discloses a method for preparing a copper-nickel alloy for a solid-state battery through an alkaline system, and belongs to the technical field of solid-state batteries. A pyrophosphate aqueous solution system is used as an electrolyte, and the copper-nickel alloy is prepared through an electro-deposition method; the pyrophosphate aqueous solution system comprises the following components: raw materials of copper pyrophosphate and nickel chloride, a main complexing agent of potassium pyrophosphate, an auxiliary complexing agent of ethylenediaminetetraacetic acid or potassium sodium tartrate, a brightener and an additive. The components and thickness of the alloy are adjusted by changing the metal ion concentration, the input amount of the complexing agent and the like and changing the technological parameters (pH, current density, electrodeposition time and the like), the copper-nickel alloy with the tensile strength reaching 1012.70 MPa, the elongation reaching 5.27% and the nickel content being 8.93% can be prepared, the corrosion resistance is excellent, the coating thickness is uniform, electrodeposition can be conducted at the normal temperature, and the copper-nickel alloy can be used for preparing the copper-nickel alloy with the tensile strength reaching 1012.70 MPa, the elongation reaching 5.27% and the nickel content reaching 8.93%. Therefore, the method is suitable for large-scale industrial production.
Owner:MEIZHOU JIATAI TECHNOLOGY CO LTD +1

Seawater film forming device and method for marine copper-nickel alloy heat exchange tube

The invention relates to the field of metal material corrosion and protection, and provides a seawater film-forming device and method for a marine copper-nickel alloy heat exchange tube, and the seawater film-forming method comprises the following steps: S1, preparing the seawater film-forming device; s2, calculating the total flow Q of the pipeline system: Q = n * A * v * 3600 / 1000000; s3, determining the flow of the sea water pump, wherein the flow of the sea water pump is equal to 1.2-1.3 Q; s4, building a seawater film forming device; s5, setting the flow velocity of a pipeline, namely debugging the water by using a starter to ensure that the flow velocity in the heat exchange pipe reaches 1.0-3.0 m / s; and S6, seawater film forming time: forming a film after the heat exchange tube is continuously scoured by seawater for 20-60 days. According to the seawater film forming method for the marine copper-nickel alloy heat exchange tube, the seawater film forming method is easy to operate and convenient to implement; the film forming effect is good; no chemical agent is used, so that the method is environment-friendly.
Owner:CHINA SHIPBUILDING INDUSTRY CORPORATION NO725 RESEARCH INSTITUTE

Preparation method and application of copper-nickel double-atom modified MXene-based electrocatalyst

The invention relates to a preparation method and application of a copper-nickel double-atom modified MXene-based electrocatalyst. According to the method, CuNiDA / MXene is obtained through acid leaching of CuNi / MXene with hydrochloric acid, copper-nickel diatoms with low metal loading capacity are obtained, and residual copper-nickel alloy nanoparticles in the molten salt etching process are successfully converted into the copper-nickel diatoms to be loaded on an MXene substrate in situ; the obtained copper-nickel diatom modified MXene-based electrocatalyst has copper-nickel diatoms coordinated by oxygen functional groups, so that the adsorption of reaction intermediates is enhanced, and the electrocatalytic performance is further improved. The prepared electrocatalyst shows the ammonia yield as high as 59225 [mu] g h <-1 > mg CuNi atom <-1 > and the Faraday efficiency as high as 94.8% in a reaction system for reducing nitrite into ammonia, and has the industrial prospect of green and sustainable synthesis of ammonia.
Owner:HEBEI UNIV OF TECH

A thermal expansion resistant gallium nitride chip package transition layer frame

The utility model discloses a kind of anti-thermal expansion gallium nitride chip packaging transition layer frame, its technical solution main point is, belong to chip packaging field, including transition layer frame body, the internal cavity of the transition layer frame body is provided with thermal expansion buffer structure, the inner end of the transition layer frame body is movably connected with chip body, the lower of the chip body is movably provided with heat conduction sheet, the heat conduction sheet is located in the inner end of transition layer frame body;By setting thermal expansion buffer structure is made of corrugated copper-nickel alloy metal honeycomb body, form honeycomb buffer layer, the special structure of thermal expansion buffer structure can absorb thermal deformation amount, and a pair of limit block can form limit structure in the outer end of chip body, avoid chip body in work with temperature rise and occur slight thermal expansion, and the possible slip, warping or shear stress accumulation that occur in packaging inside is generated, improve the anti-thermal expansion effect of this chip packaging transition layer frame.
Owner:XIAMEN XINJIANENG SEMICONDUCTOR TECHNOLOGY CO LTD +1

Copper electroplating heterojunction cell and physical vapor deposition equipment

ActiveCN224250104UPromote cross-linking reactionHigh light reflectivityVacuum evaporation coatingSputtering coatingHeterojunctionCopper plating
The utility model relates to the technical field of solar cells, in particular to a copper electroplating heterojunction cell and physical vapor deposition equipment, and the copper electroplating heterojunction cell comprises a yellow diaphragm, a copper-nickel alloy layer and a grid line; the yellow diaphragm comprises a copper seed layer; the copper-nickel alloy layer is deposited on the surface of the copper seed layer; the grid line is deposited on the copper-nickel alloy layer; the physical vapor deposition equipment is used for preparing a copper-nickel alloy layer of the copper electroplating heterojunction cell; the physical vapor deposition equipment is provided with a deposition chamber, and a copper-nickel alloy target material is arranged in the deposition chamber. The physical vapor deposition equipment can be used for preparing a copper electroplating heterojunction battery, and when the copper electroplating heterojunction battery forms a grid line, the loss of redundant electroplating materials can be reduced, and the cost can be reduced.
Owner:TONGWEI SOLAR ENERGY (CHENGDU) CO LID

Design method for improving corrosion resistance of copper-nickel alloy by adding alloy elements

The invention discloses a design method for improving corrosion resistance of a copper-nickel alloy by adding alloy elements. The design method comprises the following steps: screening the alloy elements; the first screening condition is that the solid solubility of the to-be-added alloy element in the copper-nickel alloy is larger than 0.1 wt.%, the second screening condition is that the standard electrode potential of the to-be-added alloy element is smaller than that of Ni, the third screening condition is that the deposition line of the to-be-added alloy element is lower than that of Cu2O, and the fourth screening condition is that the to-be-added alloy element is non-noble metal; based on the screening result, the mass percentage content range of the alloy elements is determined according to the maximum solid solubility of the alloy elements in the copper-nickel alloy; the ratio of the nucleation rate to the growth rate is larger than 104, and the corrosion rate is stabilized to be not higher than 0.02 [mu] m / a along with time, and the mass content of the alloy elements is obtained through optimization; and the final components and content of the added alloy element copper-nickel alloy are determined on the basis of the optimization result, and the corrosion resistance of the alloy element copper-nickel alloy is verified through experiments. The invention provides a design thought for the corrosion-resistant alloy with slowly dissolved main elements.
Owner:NORTHEASTERN UNIV CHINA

A cable for heating

The application relates to the technical field of automobile heating elements, in particular to a cable for heating, which comprises a conductor, an insulating layer and an outer covering, the insulating layer is sleeved on the conductor, and the outer covering is sleeved on the insulating layer; the conductor is a copper-nickel alloy, the resistance value of the copper-nickel alloy is 1.5 ohms / m, and the insulating layer is polyimide paint; the copper-nickel alloy conductor with the resistance value of 1.5 ohms / m is adopted, compared with the tin-copper alloy conductor with the resistance value of 1 ohm / m in the prior art, the heating efficiency is improved under the same current condition, the problem that the automobile cushion heating cable is slow to heat up in a low-temperature environment is effectively solved, the heating demand of a user for a seat can be quickly met, and the comfort experience is improved; meanwhile, the conductor is composed of multiple copper-nickel alloy wires and is plated with nickel on the surface, the structural stability and the conductivity of the conductor are enhanced, the polyimide paint insulating layer is tightly wrapped, the heating is ensured to be uniform and stable, local overheating is avoided, and the heating performance is further optimized.
Owner:SHANGHAI TONGYU HIGH TEMPERATURE WIRE CO LTD

Material shortage early warning device for screw feeder

The utility model discloses a material shortage early warning device for a screw feeder, which comprises an inductor, a feeder body, a large roller, a positioning plate and a cable, the feeder body is arranged on one side of the inductor, the large roller is arranged on one side of the feeder body, the positioning plate is arranged in the feeder body, the cable is arranged at the bottom of the inductor, and the large roller is arranged on the other side of the feeder body. A brush is arranged on one side of the positioning plate, a screw rail is arranged at the top of the feeder body, two screws are arranged on one side of the inductor, a bottom plate is arranged at the bottom of the inductor, and the corrosion-resistant layer, the compression-resistant layer, the extension plate, the screws, nuts and the sound insulation layer are arranged, and the corrosion-resistant layer is made of copper-nickel alloy, so that good corrosion resistance and mechanical strength are achieved; and two screw rods penetrate into the positioning plate, and two nuts are sleeved with threads at one ends of the screw rods, so that the inductor and the positioning plate can be limited and fixed, and the firmness of installation of the material shortage early warning device is improved.
Owner:SHENZHEN DAZHI AUTOMATION EQUIP CO LTD

A production process of copper-based alloy bimetallic synthetic material

The present invention discloses a production process for a copper-based alloy bimetallic composite material, relating to the field of alloy materials. The production process comprises: selecting a copper-nickel alloy as a substrate, selecting a titanium alloy as a functional layer, optimizing the stress distribution of the bonding layer by gradient component distribution design; preparing a copper-nickel alloy liquid by vacuum induction melting, fixing a core rod by three-point support, controlling the temperature and flow rate for casting to form a joint crystallization; using a sandblasting process to clean the substrate surface, applying a Cu-Ti nano-coating by PVD technology to form a nano-scale convex-concave structure; constructing a mathematical model of the temperature field and the component diffusion field, optimizing the temperature distribution and diffusion behavior of the bonding area by simulation analysis; performing a gradient temperature-controlled annealing treatment to eliminate residual stress and promote diffusion; evaluating the bonding performance by combining shear strength and microhardness testing; and dividing the production process based on modular design. The present invention can be widely used in industrial fields requiring high temperature, high strength, and corrosion resistance.
Owner:SHANGHAI HEWEI IND

Batch preparation method of ultra-flat copper-nickel alloy single crystal wafer

The invention discloses a batch preparation method of ultra-flat copper-nickel alloy single crystal wafers, and belongs to the field of preparation of single crystal alloy materials. According to the method disclosed by the invention, the batch preparation (more than 10 pieces) of 4-inch-level copper-nickel single crystal wafers is realized on the sapphire substrate on the basis of double-layer magnetron sputtering based on nickel first and copper second in cooperation with a batch preparation process of a slot type multi-piece annealing carrier, and the method has the remarkable advantages that the alloy proportion can be regulated and controlled, the crystal orientation is consistent, the surface roughness is lower than 1 nm and the like. According to the method disclosed by the invention, not only can the interface orientation and diffusion behavior be accurately regulated and controlled, but also the urgent requirements of multiple fields such as electronic interconnection, catalytic electrochemistry and two-dimensional material epitaxy on the high-performance Cu-Ni single crystal wafer can be met.
Owner:PEKING UNIV

Preparation method of nitrogen-sulfur-doped carbon quantum dots, prepared nitrogen-sulfur-doped carbon quantum dots and application of nitrogen-sulfur-doped carbon quantum dots

The invention relates to the field of corrosion inhibitors, and discloses a preparation method of nitrogen-sulfur-doped carbon quantum dots, the prepared nitrogen-sulfur-doped carbon quantum dots and application of the nitrogen-sulfur-doped carbon quantum dots, the preparation method comprises the steps that pretreated peanut cake residue powder and thiosemicarbazide are dissolved in a solvent to form electrolyte, an anode and a cathode are inserted into the electrolyte, and the nitrogen-sulfur-doped carbon quantum dots are obtained. According to the preparation method, peanut cake residues are used as raw materials, the raw materials are wide in source, available, low in price, non-toxic, good in biocompatibility and rich in carbon atoms and heteroatoms, and the nitrogen-sulfur-doped carbon quantum dots are obtained. The prepared nitrogen-sulfur-doped carbon quantum dots contain rich N and S functional groups, and have a good corrosion inhibition effect on acid pickling of copper-nickel alloy at different temperatures.
Owner:CHONGQING SAFETY PROD SCI RES CO LTD

Method for making porous graphene membranes and membranes produced using the method

Provided is a method for making a porous graphene layer of a thickness of less than 100 nm, including the following steps: providing a catalytically active substrate, said catalytically active substrate on its surface being provided with a plurality of catalytically inactive domains having a size essentially corresponding to the size of the pores in the resultant porous graphene layer; and chemical vapour deposition and formation of the porous graphene layer on the surface of the catalytically active substrate. The catalytically active substrate is a copper-nickel alloy substrate with a copper content in the range of 98 to less than 99.96% by weight and a nickel content in the range of more than 0.04-2% by weight, the copper and nickel contents complementing to 100% by weight of the catalytically active substrate.
Owner:HEIQ MATERIALS AG

Three-dimensional column array type nano-porous SnS lithium ion battery negative electrode and preparation method thereof

The invention provides a three-dimensional column array type nano-porous SnS lithium ion battery negative electrode, the negative electrode is composed of a nano-column array which is uniformly grown on the surface of a metal substrate in the vertical direction and has a three-dimensional porous structure, and the metal substrate is mainly one of a copper foil, a nickel sheet, foamy copper and foamy nickel; the nanorod is composed of an outer layer and an inner core, the outer layer is stannous sulfide, the inner core is a copper-nickel alloy nanorod, and the stannous sulfide of the outer layer is uniformly distributed on the surface of the metal substrate and is combined with the copper-nickel alloy nanorod of the inner core into a whole. The invention also provides a preparation method of the negative electrode. The method provided by the invention can simplify the production process of the negative electrode of the lithium ion battery and effectively improve the specific capacity and cycle performance of the negative electrode of the lithium ion battery.
Owner:SICHUAN UNIV

Preparation method of strippable ultrathin carrier copper foil

The invention relates to the technical field of printed circuit board manufacturing, in particular to a preparation method of strippable ultrathin carrier copper foil, which comprises the following steps of: A) forming a plating layer a on the upper surface of a carrier by adopting a magnetron sputtering process, and depositing a copper metal layer on the plating layer a by adopting an electroplating process; the plating layer a is a copper-nickel alloy layer; b) coating an organic solvent on the upper surface of the copper metal layer, and forming an organic stripping layer after curing; c) depositing metal copper on the organic stripping layer by adopting an electroplating process to obtain a copper foil; and performing oxidation treatment and roughening treatment on the upper surface of the copper foil to obtain an oxide layer and a copper particle layer. The transition layer is prepared by adopting a magnetron sputtering process, the organic stripping layer is formed by adopting a special organic solvent, the transition layer and the organic stripping layer can be well matched with other layer groups, the strippable ultrathin carrier copper foil is prepared, and the cost is relatively low.
Owner:JIANGSU HENGTONG COPPER & ALUMINUM FOIL NEW MATERIALS RES INST CO LTD +1

Smelting system

The utility model discloses a smelting system. The smelting system sequentially comprises a smelting furnace, a converting furnace, a dilution electric furnace and a reduction electric furnace according to the smelting sequence. Copper-nickel sulfide concentrate, lump coal, oxygen-enriched air and the like are subjected to a smelting reaction in a smelting furnace, generated copper-nickel matte enters a converting furnace for converting through a connector, crude copper or high-nickel matte is produced and sent to a subsequent refining procedure for further treatment, converting slag produced by the converting furnace is subjected to sedimentation treatment through a dilution electric furnace, and then a crude copper product or a nickel matte product and dilution electric furnace slag are obtained; and after the depleted electric furnace slag is treated by a reduction electric furnace, copper-nickel alloy and waste slag can be obtained. According to the equipment, high-copper and low-nickel copper-nickel sulfide concentrate can be treated, and a crude copper product and a copper-nickel alloy are obtained; and high-nickel and low-copper sulphide copper-nickel concentrate can also be treated, and high-nickel matte and copper-nickel alloy products are obtained. The device has the advantages of wide raw material adaptability, high working condition adjusting capability and continuous and stable production.
Owner:CHINA NERIN ENGINEERING CO LTD

Method for regulating and controlling average grain diameter of copper-nickel alloy B30 flange forge piece

The invention provides a method for regulating and controlling the average grain diameter of a copper-nickel alloy B30 flange forge piece, which comprises the following steps of: S1, blanking a bar billet: selecting a copper-nickel alloy BFe30-1-1 bar billet as a raw material of a flange forge piece to be manufactured, and blanking and cutting; s2, heating is conducted, specifically, the copper-nickel alloy BFe30-1-1 bar billet is heated; s3, upsetting and drawing forging is conducted, specifically, the heated blank is subjected to multi-pass drawing and upsetting in a free forging mode; the original blank is forged into a round cake shape matched with the die cavity through integral upsetting, drawing, cogging and forging; s4, die forging forming is conducted, specifically, the round-cake-shaped forge piece subjected to upsetting and cogging is placed into a corresponding die cavity, and die forging forming is conducted; and S5, annealing treatment. According to the method for regulating and controlling the average grain diameter of the copper-nickel alloy BFe30 flange forge piece, the obtained flange forge piece has high mechanical performance, corrosion resistance and the average grain diameter, and the average grain diameter ranges from 0.05 mm to 0.1 mm.
Owner:CHINA SHIPBUILDING INDUSTRY CORPORATION NO725 RESEARCH INSTITUTE

A copper-nickel alloy powder and a method for producing the same

PendingCN122274198ANickel saltNickel alloy
This invention relates to the field of advanced non-ferrous metal materials technology, and provides a copper-nickel alloy powder and its preparation method, comprising: using soluble copper salt and soluble nickel salt as reactants, preparing a copper-nickel composite hydroxide through a precipitation reaction; decomposing the copper-nickel composite hydroxide into a copper-nickel composite oxide; reducing the copper-nickel composite oxide in a protective atmosphere; and obtaining a copper-nickel alloy powder with a laser particle size of 125-489 nm and an oxygen content not exceeding 0.31 wt% after sieving. This invention can effectively control the dispersibility, particle linkage state, and particle size of the copper-nickel alloy powder, achieving controllable preparation across a broad spectrum to obtain copper-nickel alloy powders with different degrees of agglomeration, laser particle sizes, and excellent compositional control precision.
Owner:YOUYAN POWDER NEW MATERIALS (HEFEI) CO LTD