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Preparation method of nanometer carbon fiber-copper composite material

A nano-carbon fiber and composite material technology, which is applied in the field of composite material preparation of electronic components, can solve the problems of poor fiber orientation, high equipment requirements, large capillary force, etc., and achieves adjustable thermal expansion coefficient, high thermal conductivity, and copper density. low effect

Active Publication Date: 2014-06-25
GRIMAT ENG INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The above problems are that even if the directional arrangement of carbon fibers is achieved in the process of pressing the preform, the degree of orientation of the fibers is poor, and the infiltration of nanofiber preforms has a large capillary force, which is difficult to achieve, and the requirements for equipment are high.

Method used

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  • Preparation method of nanometer carbon fiber-copper composite material
  • Preparation method of nanometer carbon fiber-copper composite material
  • Preparation method of nanometer carbon fiber-copper composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] according to figure 1 In the process shown, the electroless copper plating layer on the surface of carbon nanofibers, the copper layer is 90% of the mass of carbon nanofibers, the hydrogen reduction temperature is 400 ° C, the reduction time is 1 hour, under 90 MPa pressure, 900 ° C hot isostatic pressing for 25 minutes, Obtain nano-carbon fiber-copper blank, then through hot rolling, the reduction ratio is 70%, and the reduction ratio of cold rolling is 10%, obtain nano-carbon fiber-copper composite material, such as Figure 2-3 shown. The density of the material is 8.2g / cm 3 , the thermal conductivity parallel to the fiber x-y direction is 250W / mK, the thermal expansion coefficient is 8ppm / ℃, the thermal conductivity perpendicular to the fiber z-axis direction is 120W / mK, and the thermal expansion coefficient is 17ppm / ℃.

Embodiment 2

[0020] according to figure 1 In the process shown, the electroless copper plating layer on the surface of carbon nanofibers, the copper layer is 80% of the mass of carbon nanofibers, the hydrogen reduction temperature is 400 ° C, the reduction time is 1 hour, under 95 MPa pressure, 950 ° C hot isostatic pressing for 25 minutes, Obtain the carbon nanofiber-copper blank, then through hot rolling, the reduction ratio is 65%, and the cold rolling reduction ratio is 8%, so as to obtain the carbon nanofiber-copper composite material, such as Figure 2-3 shown. The density of the material is 7.5g / cm 3 , the thermal conductivity parallel to the fiber x-y direction is 280W / mK, the thermal expansion coefficient is 10ppm / ℃, the thermal conductivity perpendicular to the fiber z-axis direction is 150W / mK, and the thermal expansion coefficient is 16.5ppm / ℃.

Embodiment 3

[0022] according to figure 1 In the process shown, the electroless copper-nickel layer on the surface of carbon nanofibers is 65% of the mass of carbon nanofibers, the hydrogen reduction temperature is 400°C, the reduction time is 1 hour, and the pressure is 100MPa, 1000°C hot isostatic pressing for 30min, Obtain the carbon nanofiber-copper blank, control the reduction rate at 60% through hot rolling, then cold rolling, the reduction rate is controlled at 5%, obtain the carbon nanofiber-copper composite material, such as Figure 2-3 shown. The density of the material is 6.5g / cm 3 , the thermal conductivity parallel to the fiber x-y direction is 300W / mK, the thermal expansion coefficient is 9ppm / ℃, the thermal conductivity perpendicular to the fiber z-axis direction is 180W / mK, and the thermal expansion coefficient is 16ppm / ℃.

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Abstract

The invention discloses a preparation method of a nanometer carbon fiber-copper composite material, which belongs to the technical field of preparation of electronic component composite materials. The method comprises the following steps: plating nanometer carbon fibers with a certain volume fraction of copper or copper-nickel alloy by chemical plating or electroplating, reducing the metalized nanometer carbon fibers in hydrogen, then preparing a nanometer carbon fiber-copper composite material blank by hot isostatic pressing or discharge plasma sintering, finally performing hot rolling cogging, and performing cold rolling to realize oriented arrangement of the nanometer carbon fibers, so as to prepare the nanometer carbon fiber-copper composite material. The prepared nanometer carbon fiber composite material has a density lower than that of copper, is adjustable in thermal expansion coefficient, is high in thermal conductivity in the parallel fiber direction, and is widely used in microelectronic packaging, laser diodes, IGBT and semiconductors, radiating fins, and cover plates.

Description

technical field [0001] The invention belongs to the technical field of electronic component composite material preparation, and in particular relates to a preparation method of nano carbon fiber-copper composite material. Background technique [0002] The heat dissipation of traditional electronic devices uses high thermal conductivity metals such as copper and silver as heat dissipation materials, but the thermomechanical fatigue at the junction of the heat sink and the electronic substrate shortens the life of the electronic device. In materials with low expansion coefficient and high thermal conductivity, carbon fiber reinforced metal matrix composites can not only reduce the thermal expansion coefficient and density, but also enhance the strength, modulus, thermal conductivity, and improve its high temperature performance. Compared with other high thermal conductivity materials, it is easy to processing. [0003] Carbon nanofibers have high specific strength, specific m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C47/14C22C47/04C22C49/14C22C101/10C22C121/02
Inventor 张习敏郭宏尹法章范叶明韩媛媛徐骏
Owner GRIMAT ENG INST CO LTD
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