Process for electrodeposition preparation of orientated short fiber reinforced metal -base composite materials
A technology of short fiber reinforcement and composite materials, applied in electrolytic coatings, electrolytic processes, electrolytic components, etc., can solve problems such as high cost, complicated equipment, and large fiber damage, and achieve convenient operation, wide applicability, and low cost. Effect
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Embodiment 1
[0016] Oriented distribution of Ni-SiC w Preparation of composite materials
[0017] Prepare the plating solution according to the following formula: nickel sulfamate 400g / L, nickel chloride 5g / L, boric acid 40g / L, place in a beaker after preparation, and heat to about 50°C in a water bath. The nickel processed into a round rod is used as the anode, which is fixed on the rotator, and a carbon brush is used to realize the conduction of the rotating anode. The content of silicon carbide whiskers is 10g / L. After the whiskers are washed and pickled, add 2g / L of cetyltrimethylammonium bromide, a surfactant, ultrasonically oscillate, add to the plating solution, stir evenly, and adjust the pH Standby around 4.0. The cathode is made of stainless steel plate, and the current density is controlled at 5.0A / dm 2 , the rotational speed of the anode is 2000r / min. After 5 hours of plating, take it off to get the Ni-SiC with the desired directional distribution w composite material.
Embodiment 2
[0019] Oriented distribution of Ni-Al 2 o 3w Preparation of composite materials
[0020] The plating solution formula is the same as that in Example 1: 400 g / L of nickel sulfamate, 5 g / L of nickel chloride, and 40 g / L of boric acid, which are placed in a beaker after being prepared, and the temperature is controlled at about 50° C. Pure nickel is used as the anode, and the cathode stainless steel processed into a round rod is fixed on the rotator, and carbon brushes are also used to realize the conduction of the rotating cathode. The content of alumina whiskers is 5g / L. After the whiskers are washed with water and pickled, 1g / L of surfactant sodium lauryl sulfate is added, ultrasonically oscillated, then added to the plating solution, stirred evenly, and the pH is adjusted to about 4.0. use. The current density is controlled at 2.5A / dm 2 , the cathode rotation speed is 1500r / min. After 3 hours of plating, take it off to get the desired directional distribution of Ni-Al 2...
Embodiment 3
[0022] Oriented distribution of Cu-SiC w Preparation of composite materials
[0023] The formula of the plating solution is: copper sulfate 200g / L, sulfuric acid 60g / L, put it in a beaker after preparation, and heat it to about 25°C in a water bath. Pure copper is used as the anode, stainless steel plate is used as the cathode, and the plating solution is rotated by a mechanical stirrer. The silicon carbide whisker content is 1g / L. After pretreatment, add sodium polyacrylate 0.1g / L, ultrasonically oscillate, add to the plating solution, stir well and set aside. The current density is controlled at 0.5A / dm 2 , the rotation speed is 500r / min. After 2 hours of plating, take it off to get Cu-SiC with desired orientation distribution w composite material.
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