Zinc-copper-nickel alloy and preparation method and application thereof

Abstract

The invention discloses a zinc-copper-nickel alloy. The zinc-copper-nickel alloy comprises the following components in percentages by weight: 13-25% of Ni, 15-40% of Zn, 0.01-0.25% of Fe, 0.01-0.5% of Mn and the balance of Cu and inevitable impurities. The zinc-copper-nickel alloy has excellent high-temperature oxidation resistance, salt-spray corrosion resistance and soldering performance. The zinc-copper-nickel alloy cannot oxidize when baked for 5-15 minutes at the high temperature of 280 DEG C; the non-corrosive duration of the zinc-copper-nickel alloy in a 5% NaCl salt mist atmosphere is longer than or equal to 8 hours; and if the zinc-copper-nickel alloy is soaked in tin liquor at the temperature of 245+ / - 5 DEG C and then is taken out 3-5 seconds later, the tinplated area is 95% or above. The zinc-copper-nickel alloy can be applied to electronic and electrical products such as shielding covers, and can also be used as raw materials of other electronic and electrical products with high requirements on comprehensive properties including high-temperature oxidation resistance, salt-spray corrosion resistance and soldering performance.

Description

technical field [0001] The invention relates to the technical field of copper alloy and its application, in particular to a zinc-nickel-nickel alloy with excellent high-temperature oxidation resistance, salt-spray corrosion resistance and soldering performance. The zinc-nickel-nickel alloy can be applied to electronic and electrical products such as shielding covers. Background technique [0002] In recent years, with the rapid development of modern electronics and communication industries, the use of high-shielding zinc-nickel-nickel copper has increased significantly, and customers have higher and higher requirements for high-temperature oxidation resistance, salt spray corrosion resistance, and soldering properties of zinc-nickel-nickel shielding. , while the traditional zinc-nickel-nickel shielding parts have obvious oxidation, desoldering, and missing soldering after reflow soldering after assembly, that is, the anti-oxidation and soldering properties of the material are...

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Problems solved by technology

[0002] In recent years, with the rapid development of modern electronics and communication industries, the use of high-shielding zinc-nickel-nickel copper has increased significantly, and customers have higher and higher requirements for high-temperature oxidation resistance, salt spray corrosion resistance, and soldering properties of zinc-nickel-nickel shielding. , while the traditional zinc-nickel-nickel shielding parts have obvious oxidation, desoldering, and missing soldering after reflow soldering after assembly, that is, the anti-oxidation and soldering properties of the material are insufficient, and appear after 8 hours of 5% NaCl salt spray atmosphere Severe corrosion, the corrosion area is > 5%, according to the provisions of GB / T 6461-2002 "Rating of samples and test pieces of metal and other inorganic coatings on metal substrates after corrosion tests", the appearance rating is low RA Level 4, it will seriously affect the appearance and reliability of the subsequently prepared shield

[0003] At present, the conventional grades of zinc-nickel-nickel copper used in electronic shielding cover materials are American Standard C7701 and C7521 zinc-nickel-nickel copper, and the main components are Cu-Ni-Zn-Mn. Oxidation will occur after baking for 1 to 3 minutes), poor salt spray corrosion resistance (obvious corrosion spots will appear after 4 hours in a 5% NaCl salt spray atmosphere), poor soldering performance (de-soldering, leakage after reflow soldering at 245°C) Welding phenomenon), can not meet the use requirements of the shielding cover material

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