Pellet electrical resistor and producing method thereof

A resistor and chip technology, applied in the manufacture of resistors, resistors, thick film resistors, etc., can solve the problems of small resistors, difficult to obtain, etc., and achieve the effect of low TCR, good heat resistance, and small resistance

Inactive Publication Date: 2003-08-20
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Hard to get smaller resistors

Method used

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  • Pellet electrical resistor and producing method thereof
  • Pellet electrical resistor and producing method thereof
  • Pellet electrical resistor and producing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] figure 1 is a sectional view of the chip resistor of the first embodiment of the present invention. In this figure, 3 denotes a resistive layer. Using a resistor body paste having an alloy composition shown in Table 1 below, a resistor layer was printed on one face of a square insulating substrate (hereinafter simply referred to as a substrate) 1 by a thick film technique such as screen printing. Next, in the same manner as the resistive layer 3, the upper electrode layer 2 is printed on both ends of the resistive layer 3 opposite to the substrate 1 so as to be in surface contact with the resistive layer 3. In a neutral or reducing atmosphere, the resistance layer 3 and the upper electrode layer 2 are simultaneously fired. Thereafter, protective film 4 is formed covering a part of resistive layer 3 . U-shaped end face electrode layers 5 are formed on both opposite end portions of the substrate 1 and the portion of the resistive layer 3 not covered by the protective ...

Embodiment 2

[0053] The chip resistors obtained by printing and firing the resistor body paste prepared in a similar manner to Example 1 using the alloy powders with the mixing ratios shown in Table 2 will be described below.

[0054] The resistance, temperature coefficient of resistance (TCR), and reliability (high temperature shielding test and thermal shock test) of the thus-prepared chip resistors were measured.

[0055] Comparative examples were prepared in the following manner. Utilize screen plate, on aluminum oxide substrate 10, print the paste that mixes alloy powder, glass frit and organic vehicle liquid to form in the similar manner with embodiment 1, will form on the substrate such as Figure 13 The upper electrode 11 is shown. The paste was dried at 100°C for 10 minutes, and then heated in a nitrogen atmosphere at 1000°C, thereby firing the resistor. Thereafter, end face electrodes and protective films were formed in a similar manner to Example 1, thereby producing a chip re...

Embodiment 3

[0060] image 3 is a cross-sectional view of a chip resistor according to a third embodiment of the present invention. In this chip resistor, the lower electrode layer 8 is printed and fired on opposite ends of one side of a square substrate 1, respectively, using a thick film technique such as screen printing. In the lower electrode layer 8, copper or silver powder is used as the metal powder, and a paste in which lead-borosilicate glass is added as a glass frit at a ratio of 3 wt % relative to the metal powder is used. Next, if image 3 As shown, the thick film technology is used to screen-print the resistive body paste with the alloy composition shown in Table 3 below, and the resistive layer 3 is printed on the lower electrode layer 8 . Next, in the same manner as the resistive layer 3, the upper electrode layer 2 is printed on both ends of the resistive layer 3 opposite to the substrate 1 so as to be in surface contact with the resistive layer 3. In a neutral or reduci...

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Abstract

The invention relates to a chip resistor. The object of the invention is to realize a low resistance and a low TCR, and also high accuracy and high reliability. The chip resistor is configured so as to have: a substrate; a resistance layer which is formed on at least one face of the substrate and which is made of a copper nickel alloy; upper-face electrode layers which make surface contact with the upper faces of both the end portions of the resistance layer; and end-face electrodes which are formed so as to cover the upper-face electrode layers. Since the bonding between the resistance layer and the upper-face electrode layers is conducted by metal-to-metal bonding, particularly, impurities which may affect the properties do not exist in the interface.

Description

[0001] This application is a divisional application of the invention patent application with the application number 97120647.3 and the application date of September 11, 1997, and the invention name is "chip resistor and its manufacturing method". technical field [0002] The present invention relates to a chip resistor widely used in electronic circuits, in particular to a chip resistor with low resistance and low TCR, and a manufacturing method thereof. Background technique [0003] In recent years, with the development of portable phones, video cameras, and notebook personal computers, there has been an increasing demand for small electronic devices. It is no exaggeration to say that the miniaturization of these electronic devices and the improvement of their performance depend on chip-type electronic components used for these devices. As for thin film resistors, there are known ruthenium oxide and compositions containing bismuth ruthenate and lead ruthenate which are comp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C1/142H01C7/00H01C17/00H01C17/28
CPCH01C1/142H01C17/006H01C17/281H01C7/003Y10T29/49101Y10T29/49082Y10T29/49099
Inventor 木村涼下山浩司米田尚继中尾惠一
Owner PANASONIC CORP
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