69 results about "Thick film technology" patented technology

Apparatus and methods for delivering high frequency energy to tissue with improved temperature sensing. The treatment apparatus may be a delivery device positionable adjacent to the tissue. The delivery device may further include an electrode adapted to deliver high frequency energy to the tissue and at least one thermal sensor. In one embodiment, the thermal sensor may include a thermocouple junction of dissimilar metals formed by either thin film or thick film techniques. Alternatively, the thermal sensor may include a body composed of a resistive material having a resistance that varies with temperature to an extent sufficient to measure the skin temperature. A region of the delivery device near the thermal sensor may be heated, before skin contact is established during treatment, for purposes of detecting contact by the occurrence of heat loss from the delivery device region.

The invention provides a preparation method of a ceramic substrate for high-power LED packaging, comprising the following steps of: preparing for the surface-processed ceramic substrate, covering the ceramic substrate with prepared cuprous oxide slurry, forming a circuit diagram, drying, sintering, reducing and plating a film to prepare ceramic substrate with a smooth and compact metal surface. With the combination of a thick film technology and a bonded copper principle on the surface of the ceramic substrate, metallization is realized without coating equipment and a complex technology required by a thin preparation technology and a special technology for direct bonded copper. In addition, with the combination of a direct bonded copper principle, the bonding strength of the metal layer and ceramic is raised and the spalling problem caused by thermal shock is minimized. According to the invention, the technology is simple; large-scale equipment is not required; raw materials are low-priced; the yield is high; metal patterning is convenient; surface fineness is high; and the copper layer thickness on the surface of the substrate is especially controllable so as to make the operation of a power electronic device more stable.

A 6D acceleration sensor for measuring three axial accelerations and angular accelerations in 3D space coordinate system features that the thick-film technology is used, the dual E-shaped circular ceramic membranes and cross beam are used as sensitive elastic substance, and the force-sensitive thick-film resistors are sintered on the ceramic substance for bridging. It can be used for the robot.

The invention discloses a steel and titanium alloy low-temperature pulse ion nitrocarburizing and cathode arc ion plating M/MN alternate plating thick-film technology, and belongs to the technical field of material surfaces. The technology is characterized in that the stress relief annealing is performed for a workpiece 3 by cold rolling or cold drawing; a nitrocarburizing layer and M/MN alternate composite thick-film layer with a mildly transitional hardness of a wear resistant layer on the surface of the workpiece is prepared to prevent the falling of a coating film; a transition layer with a thickness of 1-3 microns is formed between a modified layer and an ion plating M film layer to improve the adhesiveness of the coating film; ion plating M and MN alternate coating films are prepared; the ion plating M film can partially absorb the internal stress of the MN plating film; and the plating film is not liable to fall. The technology has the effects and benefits of solving low hardness and weak wear resistance of a titanium alloy, replacing electroplating hard chromium, having no environmental pollution, having no harm to human bodies and having wide application range, such as molds, machine tool parts, mine machinery, locomotives and piston rings.

A pressure sensor includes a membrane having a radially peripheral edge region fixedly arranged on a support. One side of the membrane can be acted on by a medium being measured and the membrane can be deflected in response to pressure of the medium. Measuring elements and an electric circuit interconnecting the measuring elements are arranged on the membrane, the measuring elements and the circuit being applied by the thick-film technique and sintered on in a thermal process. The membrane is made of an electrically conducting metal and bears an insulating layer, on which the measuring elements and the electric circuit are arranged. In this case, the insulating layer consists of a material having a coefficient of expansion that lies between the coefficient of expansion of the metal of the membrane and the coefficient of expansion of the material of the measuring elements and the electric circuit.

The invention provides a device and a method for improving screen printing precise alignment by using a contact photoetching machine. The method comprises the following steps: when photoetching, inserting a positioning jig frame provided with a screen printing mask image into the contact photoetching machine, adjusting brightness through an auxiliary spacer, setting compressed air to upwards move a spacer bearing platform, realizing X-Y-Z photoetching pre-positioning through sensor induction, aligning the screen printing image with a silicon wafer image on the spacer bearing platform through a microscopical alignment system, putting printing paint on a silk screen, and printing the image with a scraper blade, and when the spacer bearing platform moves downwards to the original position, taking the silicon wafer out. The device and the method have the following advantages that: the screen printing alignment precision is improved to +/-3 mum of the microelectronic technology from 10 to 15 mum of the common thick film technology; coating and alignment of substrates of a plurality of layers of stacked silicon wafers, which have different thicknesses, are realized; and application range is obviously widened. The device has simple structure, method and operation, is easily integrated and popularized, and realizes the substitution of a contact photoetching mask plate with the screen printing mask image.

The invention provides a differential scanning calorimeter and a manufacturing method thereof. The differential scanning calorimeter comprises a main body core part formed by using a thick-film technology and a heat insulating layer arranged on the outer side of the main body core part, wherein the main body core part comprises a conducting layer, a first insulating layer, a sensor layer and a second insulating layer which are sequentially arranged on one side of the conducting layer, and a third insulating layer, a heating layer and a fourth insulating layer which are arranged on the other side of the conducting layer; the sensor layer comprises a sample-side sensor and a reference-side sensor which are symmetrically distributed; the second insulating layer completely covers the sample-side sensor and the reference-side sensor. The integrally-formed main body core part is insulated from the outside by using the heat insulating layer, so that the heat loss is reduced, the complete machine is relatively small in heat capacity, and the high sensitivity and the relatively-small time constant of the differential scanning calorimeter are realized.

The invention is about processing technology field in the production of ceramic metal film thick film products. Commonly used production of ceramic membrane two-dimensional structure of metal products is implemented on the plane of the ceramic substrate. On the basis of one or two metallization of substrate, through one or two lithography or the print or sinter of the metal slurry, the design flat rectangular structure is cut to complete the production. This invention involves the production technology of the three-dimensional structure carrier of metal ceramic membrane, so it is much more complicated than that of the two-dimensional structure, but it is entirely suitable for the related products of two thick-films processing including the pottery film and ceramic film. Whether using film techniques, or using thick-film technology, the key point of production and processing of the metal ceramic with 3-D carrier structure in this invention, is as follows. Use the grinding wheel machine to cut ceramic galley proof with groovy and then complete the production of the front and side metal pattern, in this way, carrier three-dimensional structure of the ceramic metal film is obtained.

The invention is a device for gauging the status of a material such as a fat or an oil. The device comprises: a housing; a hollow connecting element; a substrate, attached at the opposite end of the hollow connecting element; a sensor, proximate the substrate, for measuring an electrical property of the material being tested; a protective coating, wherein the protective coating covers the sensor and can be applied using either a thin-film or a thick-film technology; and, an electronic evaluation unit connected via at least one electric line to the sensor; and, is arranged proximate the housing and/or proximate the end of the connecting element that faces the housing.

A method and apparatus for configuring a pressure sensor. A homogeneous piece of metal can be provided. A pressure port and a machined diaphragm are integrated onto the homogeneous piece of metal, wherein the machined diaphragm is connected to the pressure port. The machined diaphragm can be configured utilizing Advanced Thick Film (ATF) technology, thereby providing a high-pressure pressure sensor for use in high-pressure sensing application based on the pressure port and the machined diaphragm and related pressure sensor components thereof.

The invention relates to a power electronics component that comprises a planar ceramics substrate (2) on whose one face condutor tracks (6), applied in thick-film technique, are disposed for electrically connecting electrical power components (7) of a circuit that are also disposed on the ceramics substrate (2). The ceramics substrate (2), with its other face, is brazed onto a metal a metal support element (1) that serves as a heat spreader. The support element (1) is linked with a thermoconducting housing part housing that accommodates the support element (1) in a thermoconductive manner. On the face of the support element (1) facing away from the ceramics substrate (2), approximately opposite the ceramics substrate (2), a second ceramics substrate (4) is brazed onto the ceramics substrate (2) that carries the circuit and has approximately the same dimensions.

The invention provides a hybrid integrated thick film heating device for a micro atomic gas chamber, and a preparation method thereof. With the thick film technology, heating resistors are printed ona substrate layer by layer and insulated isolation is carried out to form a multi-layer heating structure; a triode, a thermistor and a single-chip microcomputer and other elements are integrated on the substrate and each heating resistor is connected with the triode and is controlled by a DAC output port of the single-chip microcomputer; the single-chip microcomputer collects the voltage of the thermistor and a temperature signal by a ADC module; after processing based on a PID algorithm, the heating power of the heating resistor at each layer is controlled by the DAC to realize multi-gear continuously controlled high-integration heating device. According to the invention, the heating device has advantages of simple circuit structure, high integration degree and integration of controllingand heating; and various problems of the existing micro atomic gas chamber heating device can be solved. The hybrid integrated thick film heating device can be applied to more devices needing heat; moreover, the process is simple and the heating device is easy to prepare.

The invention relates to a thick film circuit board and a manufacturing method thereof. The thick film circuit board comprises a PCB (Printed Circuit Board) substrate, wherein the PCB substrate is provided with a front bonding pad, a via hole, a back bonding pad and a front insulating layer; the lower end of the front bonding pad is positioned in the front insulating layer; the front face of the PCB substrate is also provided with a front conductor circuit layer; the front conductor circuit layer comprises a first branch circuit layer, a second branch circuit layer and a third branch circuit layer and is a conductive layer with thickness of less than 10 mu m; and the middle part of the first branch circuit layer and the middle part of the second branch circuit layer are symmetrically provided with a first resistive layer and a second resistive layer respectively. The manufacturing method comprises the following steps of: forming the front bonding pad, the back bonding pad, the front insulating layer, the via hole, the front resistive layers and a bridging conductor on the PCB substrate through a thick film technology and punching. The front conductor circuit layer has small thickness, low resistive layer fall and a long service life; and by arranging a cut-off point, the resistive layer performance can be improved.

A device for foaming liquid includes a line system and a pump, via which at least one first line of the line system is connectible to at least one storage container in which the liquid to be foamed is stored, and via a second line of the line system is connectible to at least one outlet nozzle, an air-enrichment element by means of which air can pass through the liquid, and a heating element designed as a continuous flow heater. Furthermore, the heating element is arranged in the second line of the line system of the device and is designed as a thick-film heater in which an electric heating resistor is attached to a carrier using thick-film technology, on which carrier a flow path is provided for the liquid.

The invention discloses a method for preparing static-suppressor functional slurry cured at low temperature. The slurry is composed by adding solid constituents using low-temperature-cured organic matter as a carrier. The carrier consists of a resin, a diluent, a curing agent and a curing accelerator at a certain mass ratio, wherein the resin includes epoxy resin and phenolic resin; the diluent is a mixture of dimethyl glutarate, dimethyl adipate and dimethyl succinate; the curing agent is dicyandiamide; and the curing accelerator is organic carbamide. The solid constituents are composed of talcum powder, silica and aluminium powder at a certain mass ratio. According to the invention, the static-suppressor slurry is suitable for a thick-film technology platform and is used to prepare a chip-type static suppressor. Stronger adhesive force is realized between the cured slurry and an alumina ceramic substrate. The slurry has characteristics of great mechanical strength itself, damp and heat resistance, low trigger voltage, and good consistency.