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Method for making printed circuit board (PCB)

A manufacturing method and technology of PCB circuit boards, which are applied in the fields of printed circuit manufacturing, electrical components, printed circuits, etc., can solve problems such as waste water, and achieve the effects of saving energy and resources, simplifying the manufacturing process, and shortening the production cycle

Inactive Publication Date: 2011-08-17
HUIZHOU CITY GREEN MARK PHOTOELECTRIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a method for making PCB boards, aiming to solve the problem of producing a large amount of waste water in the process of making PCB boards in the prior art

Method used

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Embodiment Construction

[0021] In order to make the object, technical solution and effect of the present invention more clear and definite, the present invention will be further described in detail below.

[0022] The manufacturing process of PCB circuit board of the present invention comprises the steps:

[0023] 1. Interconnection on both sides of the inner line:

[0024] The inner core board first drills the buried holes with machinery or laser, and uses advanced laser lithography technology combined with plasma cleaning technology to complete the production of fine lines. This technology can completely achieve a line width / spacing of 0.5mm / 0.5mm The hole metallization of the through hole adopts the nanotechnology of silver paste or copper paste, and uses the screen printing process to pour the silver paste or copper paste into the pre-drilled holes. In the printing process, the fullness of the silver paste or copper paste to fill the holes is particularly important. Then high-temperature curing...

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PUM

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Abstract

The invention discloses a method for making a printed circuit board (PCB) and belongs to an integrated high density interconnection (HDI) technology, in particular to a new high density interconnection technology which combines the present dry method, thick film technology, laser engraved technology and plasma cleaning technology of the PCB. In the method, processes of image transferring, soldering-resistant exposure developing, plating holes and electroplating are not required, so the production process is simplified and higher interconnection density can be obtained; the method can be used for chip level assembly and 3G products, thereby realizing energy saving and emission reduction and reducing cost.

Description

technical field [0001] The invention relates to the field of manufacturing printed circuit boards, in particular to a method for manufacturing a PCB board. Background technique [0002] The traditional high-density interconnect printed board (HDI) process technology inevitably uses wet production, and the wet production process is long and requires multiple washings during the production process. The current conventional production process in the PCB manufacturing industry is inseparable from a large amount of water washing, whether it is the transfer of the initial drawing, the etching of the circuit, or the chemical deposition and electroplating process of the hole metallization. A lot of material and financial resources. The application of the existing environmental protection water treatment technology level cannot completely remove the organic and inorganic harmful substances in the wastewater, which will definitely cause environmental pollution and waste of energy. T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 邵国生段一侦
Owner HUIZHOU CITY GREEN MARK PHOTOELECTRIC TECH
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