Printing roller for laser paper printing and manufacture process thereof
A production process and plate roller technology, applied in printing process, printing surface preparation, printing and other directions, can solve the problems of high cost, ugly layered plates, low efficiency, etc., and achieve the effect of solving waste and controlling product quality
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0059] Example 1
[0060] A manufacturing process of a plate roller for laser paper printing, including the following steps:
[0061] A. Copper plating: Put the roller body 1 into an electroplating tank containing a copper plating solution for electroplating. The current density is 16ASF, the electroplating temperature is 30°C, the electroplating time is 30min, and the Vickers hardness is 180. The copper layer is plated. The thickness is 10um; in the step A, the copper plating solution is composed of the following raw materials: copper sulfate 5g / L, disodium ethylenediaminetetraacetic acid 10g / L, potassium sodium tartrate 5g / L, formaldehyde 2g / L, sodium hydroxide 10g / L, methanol 0.001g / L, and sodium silicate 0.1g / L; the pH of the copper plating solution is 12; the anode material for electroplating is a copper plate with a phosphorus content of 2‰;
[0062] B. Adhesive: Hang the copper-plated roller body 1, and put a round film on the outside of the roller body 1. The round film is c...
Example Embodiment
[0073] Example 2
[0074] A manufacturing process of a plate roller for laser paper printing, including the following steps:
[0075] A. Copper plating: Put the roller body 1 into an electroplating tank containing a copper plating solution for electroplating. The current density is 17ASF, the plating temperature is 40°C, the plating time is 45min, and the Vickers hardness is 195. The copper layer is plated. The thickness is 12um; in the step A, the copper plating solution is composed of the following raw materials: copper sulfate 12g / L, disodium ethylenediaminetetraacetic acid 20g / L, potassium sodium tartrate 12g / L, formaldehyde 3.5g / L, hydroxide Sodium 12.5g / L, methanol 0.05g / L, and sodium silicate 1g / L; the pH of the copper plating solution is 12.5; the anode material for electroplating is a copper plate with a phosphorus content of 3‰;
[0076] B. Adhesive: Hang up the copper-plated roller body 1, and put a round film on the outside of the roller body 1. The round film is connect...
Example Embodiment
[0087] Example 3
[0088] A manufacturing process of a plate roller for laser paper printing, including the following steps:
[0089] A. Copper plating: Put the roller body 1 into an electroplating tank containing a copper plating solution for electroplating. The current density is 18ASF, the plating temperature is 50°C, the plating time is 60min, and the Vickers hardness is 210. The copper layer is plated. The thickness is 14um; in the step A, the copper plating solution is composed of the following raw materials: copper sulfate 20g / L, disodium ethylenediaminetetraacetic acid 30g / L, potassium sodium tartrate 20g / L, formaldehyde 5g / L, sodium hydroxide 15g / L, methanol 0.1g / L, and sodium silicate 2g / L; the pH of the copper plating solution is 13; the anode material for electroplating is a copper plate with a phosphorus content of 5‰;
[0090] B. Adhesive: Hang the copper-plated roller body 1, and put a round film on the outside of the roller body 1. The round film is connected with a ...
PUM
Property | Measurement | Unit |
---|---|---|
Depth | aaaaa | aaaaa |
Depth | aaaaa | aaaaa |
Depth | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap