Method for preparing static-suppressor functional slurry cured at low temperature

Abstract

The invention discloses a method for preparing static-suppressor functional slurry cured at low temperature. The slurry is composed by adding solid constituents using low-temperature-cured organic matter as a carrier. The carrier consists of a resin, a diluent, a curing agent and a curing accelerator at a certain mass ratio, wherein the resin includes epoxy resin and phenolic resin; the diluent is a mixture of dimethyl glutarate, dimethyl adipate and dimethyl succinate; the curing agent is dicyandiamide; and the curing accelerator is organic carbamide. The solid constituents are composed of talcum powder, silica and aluminium powder at a certain mass ratio. According to the invention, the static-suppressor slurry is suitable for a thick-film technology platform and is used to prepare a chip-type static suppressor. Stronger adhesive force is realized between the cured slurry and an alumina ceramic substrate. The slurry has characteristics of great mechanical strength itself, damp and heat resistance, low trigger voltage, and good consistency.

Description

Technical field [0001] The invention relates to an overvoltage protection component material against static electricity, in particular to a preparation method of a low-temperature curing electrostatic suppressor functional slurry. Background technique [0002] Static electricity is usually generated by the friction between two poor conductors, which causes electrons to migrate from one poor conductor to another. The electrostatic voltage can reach thousands of volts. For many electronic devices, the number of insertions and removals between the input and output interfaces and external electronic storage devices is very large, which often causes static electricity to be applied to the input and output connected electronic components. When the generated static electricity is discharged by the voltage-sensitive electronic components At this time, it can cause damage to electronic components, thereby destroying the entire electronic circuit. [0003] The electronic components and circ...

AI Technical Summary

Problems solved by technology

[0006] However, the polymer material used in the functional layer of the above-mentioned polymer electrostatic suppressor is a thermoplastic resin, and the functional layer after curing has a certain degree of plasticity and cannot be subjected to pressure.

Therefore, the material system has certain defects in high temperature resistance and mechanical properties, which will reduce the reliability of the material and cause poor consistency of trigger voltage.

[0007] In addition, there is another problem in this material system. The resin material used to uniformly disperse and isolate the metal particles has poor heat resistance and oxidation resistance. Repeated application of static electricity will cause resin deterioration and lead to static electricity. The decline in performance, for example, when the resin deteriorates and loses its bonding ability, it will cause the metal particles to be connected to each other, resulting in an increase in leakage current under normal operating voltage, which will affect the normal operation of the entire electronic circuit