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Substrate for heating, heating plate, humidifier and machining methods of substrate and heating plate

A processing method and heating plate technology, applied in the processing of substrates and heating plates, and in the field of humidifiers, can solve the problems of easy aging of heating film materials, low resistance consistency, and damage to heating structures, so as to improve temperature control accuracy and response Excellent speed, good resistance to cold and heat shock, and the effect of reducing temperature gradient

Pending Publication Date: 2018-03-23
RESGOOD MEDICAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of heating plate has the following problems: (1) the thermal conductivity of the insulating glue is extremely low, the heating efficiency is low and the thermal inertia is large, and the temperature cannot be precisely controlled; The substrate falls off, which seriously affects the use of the heating plate; (3) The heating film is made of flexible materials, and the internal resistance heating module is easily deformed and fails, which may cause the metal resistance to fail and cannot be heated by electricity
However, this kind of heating plate also has the following problems: (1) The thermal expansion coefficient of the commonly used dielectric heat-conducting film layer is inconsistent with that of the aluminum substrate, and the adhesion between the two is not enough, which may easily cause the dielectric heat-conducting film layer to crack or even peel off when heated , the heating circuit on the dielectric heat-conducting film layer will also be disconnected, and the heating structure will be destroyed, causing the heating plate to fail; (2) The thermal conductivity of the dielectric heat-conducting film layer is low, the heating efficiency is low and the thermal inertia is large, and the temperature cannot be accurately controlled (3) The resistance consistency of the resistance heating film layer manufactured by the thick film process is generally low, which affects the control accuracy of the temperature

Method used

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  • Substrate for heating, heating plate, humidifier and machining methods of substrate and heating plate
  • Substrate for heating, heating plate, humidifier and machining methods of substrate and heating plate
  • Substrate for heating, heating plate, humidifier and machining methods of substrate and heating plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0083] Substrate body material: 6061 aluminum alloy, polished surface, thickness about 1-2mm;

[0084] Process:

[0085] (1) Mechanical processing: forming the substrate body into the desired shape through punching, chamfering, stamping, etc.;

[0086] (2) Surface treatment of the substrate body: immerse the processed substrate body in an organic solvent such as ethanol, acetone, or NaOH solution, and ultrasonically clean the grease on the surface of the substrate body.

[0087] (3) Micro-arc oxidation: put the surface-treated substrate body into a micro-arc oxidation electrolytic cell for micro-arc oxidation, form an oxide ceramic layer on the substrate body, clean and dry, and obtain a Rockwell hardness of about 600 Oxide ceramic layer at -800HV; in micro-arc oxidation:

[0088] a) Electrolyte: base solution containing sodium silicate 10-15g / L, sodium hexametaphosphate 8-12g / L, ethylene glycol 0.1-1.0g / L and glycerol 0.1-0.6g / L, with KOH Solution Adjust the pH of the base...

Embodiment 2

[0103] Substrate body material: the same as in Embodiment 1;

[0104] processing, such as Figure 11 As shown,:

[0105] (1), mechanical processing: with embodiment one;

[0106] (2) The surface treatment of the substrate body: the same as in the first embodiment.

[0107] (3), micro-arc oxidation: with embodiment one; In micro-arc oxidation:

[0108] a) Electrolyte: containing sodium silicate 10-15g / L, sodium phosphate 8-12g / L, sodium citrate 0.1-0.6g / L, ethylene glycol 0.1-1.0g / L, glycerol 0.1-0.6g / L base solution, adjust the pH value of the base solution to 8-12 with KOH solution.

[0109] b) Micro-arc oxidation parameters:

[0110] Immerse the substrate body to be oxidized as the anode in the electrolyte, the electrolyte temperature: 20°C-30°C, constant temperature stirring

[0111] Current density: 5-15A / dm 2 ,

[0112] Voltage: 500-700V,

[0113] DC pulse frequency: 200-500Hz,

[0114] Duty cycle: 20%-50%,

[0115] Reaction time: 20-40min.

[0116] (4) Seali...

Embodiment 3

[0121] Substrate body material: the same as in Embodiment 1;

[0122] Process:

[0123] (1), mechanical processing: with embodiment one;

[0124] (1) Surface treatment of the substrate body: same as in Embodiment 1.

[0125] (3), micro-arc oxidation: with embodiment one; In micro-arc oxidation:

[0126] a) Electrolyte: containing sodium silicate 10-15g / L, sodium phosphate 8-12g / L, sodium citrate 0.1-0.6g / L, ethylene glycol 0.1-1.0g / L, glycerol 0.1-1.0g / L base liquid, use KOH solution to adjust the pH value of the base liquid to 8-12; then add 0.1-0.5g / L sealing agent nano-alumina powder with a particle size of 10-20nm and 0.1-0.6g / L The dispersant polyoxyethylene alkylphenol ether (APEO) or high-carbon aliphatic alcohol polyoxyethylene ether (AEO) completes the sealing of micropores in the process of forming the oxide ceramic layer.

[0127] b) Micro-arc oxidation parameters:

[0128]Immerse the substrate body to be oxidized as the anode in the electrolyte, the electroly...

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Abstract

The invention discloses a substrate for heating, a heating plate, a humidifier and machining method of the substrate and the heating plate. The substrate for heating comprises a substrate body, and anoxide ceramic layer which is obtained through surface ceramic treatment is arranged on the surface of the substrate body. According to the substrate for heating, a micro-arc oxidation technology is adopted to generate an aluminum oxide ceramic layer on the substrate in situ, metallurgical bonding is achieved between the ceramic layer and the aluminum substrate, the adhesive force is far larger than the adhesive force between a medium heat conduction film layer made through the thick film technology and the aluminum substrate, and the cold-proof and heat-roof impinge properties are excellent;and in addition, the thermal conductivity of the oxide ceramic layer is high, the heat loss of the interface between the substrate and the oxide ceramic layer is small, the temperature gradient is reduced, and the heating efficiency and the temperature control response speed of the heating plate are greatly improved.

Description

technical field [0001] The invention relates to the technical field of heating devices and their processing, in particular to a heating substrate, a heating plate using the substrate, a humidifier using the heating plate, and a processing method for the substrate and the heating plate. Background technique [0002] Due to its low density, good ductility and excellent thermal conductivity, aluminum alloy has become the material of choice for heating substrates in the medium and low temperature range. Among the existing heating plates, one is to paste a layer of heating film made of flexible material on the aluminum alloy substrate. The heating film is equipped with a resistance heating module, and the heating film and the aluminum alloy substrate are bonded by insulating glue. Together, the heat between the two is transferred through the insulating glue layer. This kind of heating plate has the following problems: (1) the thermal conductivity of the insulating glue is extrem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D11/06C25D11/24C23C14/06C23C14/32C23C28/04H05B3/20
CPCH05B3/20C23C14/0611C23C14/325C23C28/042C25D11/026C25D11/06C25D11/243C25D11/246H05B2203/017
Inventor 不公告发明人
Owner RESGOOD MEDICAL CO LTD
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