Manufacturing technique for three-dimensional structure carrier of ceramic metal membrane

A 3-dimensional structure, ceramic metal technology, applied in the process of thick film product processing and production, in the field of ceramic metal thin film, can solve the problems of inability to meet the production and processing requirements of ceramic metal film, complex structure, etc.

Inactive Publication Date: 2008-02-27
CHONGQING PINJIAN TECH
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  • Abstract
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  • Application Information

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Problems solved by technology

However, with the advancement of communication technology and the increase in frequency of use, the size of devices and modules has become smaller and smaller, and the structure has become more and more complex. In the process of th

Method used

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  • Manufacturing technique for three-dimensional structure carrier of ceramic metal membrane
  • Manufacturing technique for three-dimensional structure carrier of ceramic metal membrane
  • Manufacturing technique for three-dimensional structure carrier of ceramic metal membrane

Examples

Experimental program
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Embodiment Construction

[0007] Figure 2, if it is a thin film process, the required plane pattern is lithographically etched with a designed lithography plate on a ceramic substrate with a thickness of less than or equal to 1 mm that has been metallized. 1 is a ceramic substrate, 2 is a metal film pattern. If it is a thick film process, the metal film pattern is directly printed on the ceramic substrate with a screen with a pattern and gold paste; The gold paste pattern is printed on the fixture; the gold paste is sintered and solidified in a high temperature furnace at about 800°C.

[0008] Figure 3, use a grinding wheel dicing machine to cut according to the designed line, the direction indicated by 1 is not pierced, and one-third of the thickness of the substrate is retained, and the other direction needs to be pierced, and the ceramic substrate is cut into long strips.

[0009] Figure 4. According to the design requirements, the strips after being divided should face up the specific side of the ...

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Abstract

The invention is about processing technology field in the production of ceramic metal film thick film products. Commonly used production of ceramic membrane two-dimensional structure of metal products is implemented on the plane of the ceramic substrate. On the basis of one or two metallization of substrate, through one or two lithography or the print or sinter of the metal slurry, the design flat rectangular structure is cut to complete the production. This invention involves the production technology of the three-dimensional structure carrier of metal ceramic membrane, so it is much more complicated than that of the two-dimensional structure, but it is entirely suitable for the related products of two thick-films processing including the pottery film and ceramic film. Whether using film techniques, or using thick-film technology, the key point of production and processing of the metal ceramic with 3-D carrier structure in this invention, is as follows. Use the grinding wheel machine to cut ceramic galley proof with groovy and then complete the production of the front and side metal pattern, in this way, carrier three-dimensional structure of the ceramic metal film is obtained.

Description

technical field [0001] The invention belongs to the technical field of processing and production of ceramic metal thin films and thick film products. Background technique [0002] Materials such as heat sinks and transition carriers used for 2D structure of ceramic metal film for optoelectronic devices and optoelectronic modules, and substrates with 2D structure of ceramic metal film used for microwave module circuits have a long history of production and application. The process technology is also becoming more and more mature. However, with the advancement of communication technology and the increase of the frequency of use, the size of devices and modules is getting smaller and the structure is getting more and more complex. Some process technologies have been unable to meet the production and processing requirements of ceramic metal films with a thickness of ceramic substrates less than or equal to 1 mm. SUMMARY OF THE INVENTION [0003] At present, the processing of...

Claims

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Application Information

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IPC IPC(8): H01L21/48H05K3/00
Inventor 张健陈其林
Owner CHONGQING PINJIAN TECH
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