Manufacturing technique for three-dimensional structure carrier of ceramic metal membrane

Abstract

The invention is about processing technology field in the production of ceramic metal film thick film products. Commonly used production of ceramic membrane two-dimensional structure of metal products is implemented on the plane of the ceramic substrate. On the basis of one or two metallization of substrate, through one or two lithography or the print or sinter of the metal slurry, the design flat rectangular structure is cut to complete the production. This invention involves the production technology of the three-dimensional structure carrier of metal ceramic membrane, so it is much more complicated than that of the two-dimensional structure, but it is entirely suitable for the related products of two thick-films processing including the pottery film and ceramic film. Whether using film techniques, or using thick-film technology, the key point of production and processing of the metal ceramic with 3-D carrier structure in this invention, is as follows. Use the grinding wheel machine to cut ceramic galley proof with groovy and then complete the production of the front and side metal pattern, in this way, carrier three-dimensional structure of the ceramic metal film is obtained.

Description

technical field [0001] The invention belongs to the technical field of processing and production of ceramic metal thin films and thick film products. Background technique [0002] Materials such as heat sinks and transition carriers used for 2D structure of ceramic metal film for optoelectronic devices and optoelectronic modules, and substrates with 2D structure of ceramic metal film used for microwave module circuits have a long history of production and application. The process technology is also becoming more and more mature. However, with the advancement of communication technology and the increase of the frequency of use, the size of devices and modules is getting smaller and the structure is getting more and more complex. Some process technologies have been unable to meet the production and processing requirements of ceramic metal films with a thickness of ceramic substrates less than or equal to 1 mm. SUMMARY OF THE INVENTION [0003] At present, the processing of...

AI Technical Summary

Problems solved by technology

However, with the advancement of communication technology and the increase in frequency of use, the size of devices and modules has become smaller and smaller, and the structure has become more and more complex. In the process of the development of ceramic metal film products from 2D to 3D Some technologies have been unable to meet the production and processing requirements of the ceramic metal film with a ceramic substrate thickness less than or equal to 1mm

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