Device and method for improving screen printing precise alignment by using contact photoetching machine

Abstract

The invention provides a device and a method for improving screen printing precise alignment by using a contact photoetching machine. The method comprises the following steps: when photoetching, inserting a positioning jig frame provided with a screen printing mask image into the contact photoetching machine, adjusting brightness through an auxiliary spacer, setting compressed air to upwards move a spacer bearing platform, realizing X-Y-Z photoetching pre-positioning through sensor induction, aligning the screen printing image with a silicon wafer image on the spacer bearing platform through a microscopical alignment system, putting printing paint on a silk screen, and printing the image with a scraper blade, and when the spacer bearing platform moves downwards to the original position, taking the silicon wafer out. The device and the method have the following advantages that: the screen printing alignment precision is improved to +/-3 mum of the microelectronic technology from 10 to 15 mum of the common thick film technology; coating and alignment of substrates of a plurality of layers of stacked silicon wafers, which have different thicknesses, are realized; and application range is obviously widened. The device has simple structure, method and operation, is easily integrated and popularized, and realizes the substitution of a contact photoetching mask plate with the screen printing mask image.

Description

technical field [0001] The invention relates to a device and method for improving the precise alignment of screen printing by using a contact photolithography machine, which belongs to large-scale integrated circuits, printing and other technologies that require screen printing to achieve micron-level alignment accuracy of microelectronics field. Background technique [0002] Traditional screen printing technology has simple equipment, convenient operation, simple printing and plate making, low cost, and strong adaptability. It has been widely used in large-scale integrated circuits, printing and other fields. As satellite, communication, aviation, aerospace and other systems require electronic systems to be small in size, high in reliability and low in cost, especially the rapid development of MEMS and NEMS manufacturing technology and their integration, the original planar technology has been extended to three-dimensional or Multi-layer stacking integrates ICs with differ...

AI Technical Summary

Problems solved by technology

At present, there is no relevant report on the method of improving the al

Images