Gold finger manufacturing method and gold finger

Abstract

The invention provides a gold finger manufacturing method and a gold finger. The gold finger manufacturing method comprises: forming a gold finger index wire between adjacent gold fingers on a PCB; performing anti-electroplating treatment on the gold finger index wire; electrifying the gold finger index wire, and performing gold plating treatment on the surface of a gold finger; and etching to remove the gold finger index wire. According to the manufacturing method, the gold finger index wire is manufactured between adjacent gold fingers; when gold plating treatment is completed and the gold finger index wire is etched, lateral erosion appears on the side of a gold finger, and the rear end of the gold finger is still electroplated with a nickel-gold layer, and does not generate suspended nickel; and moreover, the gold finger is plugged at a client, avoiding the short circuit defect caused when the nickel-gold layer at the rear end of the gold finger is jointed to adjacent gold fingers, and thereby guaranteeing the structure and function stability of a prepared product.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a gold finger manufacturing method and the gold finger. Background technique [0002] On the printed circuit board near the edge of the board, there are many rectangular metal contacts arranged in rows, and the metal contacts are formed by electroplating a layer of nickel gold on the copper surface of the printed circuit board. These metal contacts are part of the printed circuit board and are called gold fingers because of their nickel-gold-plated surface and their shape resembling fingers. Gold fingers are used for connection between printed circuit boards, capable of connecting circuits and transmitting signals. The nickel-gold layer on the surface of the gold finger can improve the insertion resistance, conductivity and oxidation resistance of this part. Cheats are generally divided into equal-length cheats, graded cheats and segmented cheats. The design of graded and ...

AI Technical Summary

Problems solved by technology

However, in the process of etching, due to the defects of the etching process itself, the phenomenon of side etching will inevitably occur, that is, as the depth increases, the part that starts to be etched is etched for a long time, and the depth of etching to both sides is also large. Furthermore, the nickel-gold layer 6' protruding from the end of the gold finger appears to be a hanging nickel problem

During the process of plugging and unplugging, the nickel-gold layer 6' at the nickel-hanging position will lift up and touch the nearby gold finger 2' due to the problem of nickel suspension at the end of the gold finger after processing the finished gold finger on the client side. phenomenon, resulting in a short circuit

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