Device chip carriers, modules, and methods of forming thereof

a chip carrier and module technology, applied in the direction of printed circuit manufacturing, printed circuit aspects, basic electric elements, etc., can solve the problems of not being existing technology or materials may not be able to withstand high heat applications, and printed circuit board designs are typically formed

Active Publication Date: 2008-02-14
DU PONT CHINA LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing technology or materials may not be able to withstand high heat applications, especially during processing.
For example, printed circuit board designs are typically formed with such organic materials and cannot withstand the high temperatures necessary for high heat applications.
However, they all presented problems related to various functions, manufacturability, and cost.

Method used

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  • Device chip carriers, modules, and methods of forming thereof
  • Device chip carriers, modules, and methods of forming thereof

Examples

Experimental program
Comparison scheme
Effect test

examples

[0043]The present invention will be described in further detail by giving practical examples. The scope of the invention, however, is not limited in any way by these practical examples.

examples 1 through 17

[0044]The purpose of these experiments was to evaluate two separate DuPont experimental thick film compositions provided by E.I. du Pont de Nemours and Company, Dielectric A and Dielectric B, on anodized aluminum substrates (base material with an anodized aluminum upper surface). These dielectric compositions were thick film dielectric paste compositions. Each Dielectric A and B was tested with 4 different conductive layers (i.e., Silver A, B, C, and D). Additionally, each dielectric, Dielectric A and B, were once fired and twice fired, then both the once fired and twice fired dielectrics were tested with each of the 4 different conductive layers, thus giving 16 Examples total. A control, Example 17, with no dielectric layer was also conducted.

[0045]The substrates were cut 1″×1″, 40 mil thick anodized aluminum supplied by Nimet Industries, Inc. This anodized aluminum base material comprised an anodic film upper surface layer (i.e., an anodized aluminum surface). The anodic film was ...

examples 18-27

[0054]Hardcoat Anodized Al-3003 [Oxidized Al—This is same anodized substrate as used in previous experiments, Examples 1-16, above.]

[0055]Judgment of good and bad compositions were determined by looking at the Overall Cosmetics (mudcracking, roughness, blistering, etc) with special emphasis on mudcracking and blistering or bubbling. “Bubbling” is defined herein as an outgassing phenomenon and / or sintering phenomenon wherein a void or porous pocket is left in the fired film and leaves the film susceptible to low breakdown voltage and shorts. Another cosmetic dielectric is dewetting of the composition on the oxide layer. Any of these cosmetic defects were evaluated and if present were used to eliminate a dielectric composition candidate even before further electrical testing (shorting and breakdown voltage) was evaluated.

[0056]With the Hardcoat anodized Al-3003 (thickness of 40 mils) several compositions, did not succeed. The compositions listed in the following table did not give pro...

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Abstract

The present invention provides novel methods of forming component carriers, component modules, and the carriers and modules formed therefrom which utilize thick film technology. In some embodiments, these methods are used to form lighting device chip carriers and modules. In further embodiments, these lighting device chip carriers and modules are used in LED applications.

Description

FIELD OF INVENTION[0001]This invention is related to the formation of a thermally efficient chip carrier and module. In particular, this invention is related to dielectric thick film compositions and the use of said compositions in the formation of chip carriers and modules. Some embodiments of the invention are related to Light Emitting Diode (LED) chip carriers and modules for various lighting applications including, but not limited to, LED backlights, Liquid Crystal Display (LCD) lighting, display-related light sources, automotive lighting, decorative lighting, signage and advertisement lighting, and information display applications.TECHNICAL BACKGROUND OF THE INVENTION[0002]Solid state electronic devices can be fabricated with conjugated organic polymer layers. Conjugated polymer-based diodes and particularly light emitting diodes (LEDs) and light-detecting diodes are especially attractive due to their potential for use in display and sensor technology. This class of devices has...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L33/00H01L21/00
CPCH01L21/4867H01L23/3736H01L2224/73265H01L2924/09701H01L2924/12044H05K1/053H05K1/092H05K3/246H05K2201/017H05K2201/0347H05K2201/10106H05K2203/0315H01L2224/48091H01L2924/00014
Inventor SLUTSKY, JOELVEEDER, BRIAN D.LIN, THOMAS
Owner DU PONT CHINA LTD
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