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Method and device for manufacturing single-side nickel-plated sheet

A single-sided, electro-nickel technology, which is applied in chemical/electrolytic methods to remove conductive materials, electrical components, printed circuits, etc., can solve the problems of high production cost, achieve low production cost, solve the problem of beautiful appearance and precise hole position Effect

Inactive Publication Date: 2010-02-03
SHENZHEN SUN & LYNN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] In the third existing method for making single-sided electro-nickel-gold plates, due to the use of double-sided dry film and the method of exposing film on the surface of the light substrate, the production cost is relatively high

Method used

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  • Method and device for manufacturing single-side nickel-plated sheet
  • Method and device for manufacturing single-side nickel-plated sheet
  • Method and device for manufacturing single-side nickel-plated sheet

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Embodiment Construction

[0042] The present invention provides a method and equipment for manufacturing single-sided electro-nickel-gold plates, which are applied to the technical field of printed circuit boards. The basic idea is: Compared with the prior art, the present invention mainly adjusts the order of drilling holes. After the hole is adjusted to the step of electroplating copper, nickel and gold, the technical problem of the metal circle produced by electroplating is solved. At the same time, in order not to affect the accuracy of drilling, the target hole is designed on the side of the line film process. Punch out the target hole. The drilled target hole is used for drilling positioning, which makes the hole position more precise, thus solving the technical problem of blind holes and solving the problem of crossover of liquid during electroplating which affects the appearance of the gold surface The technical problem of aesthetics: Compared with dry film and film, the present invention only us...

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Abstract

The invention discloses a method and a device for manufacturing a single-side nickel-plated sheet. The method comprises the following steps: manufacturing a circuit, punching target position holes; knocking out target position holes and drilling holes; manufacturing electric resistance welding (characters); and shaping. In the invention, a drilling hole step is adjusted to be behind a copper-nickel alloy plating step so as to solve the technical problem of metal rings generated in plating. In the invention, the target position holes are arranged on a circuit pholin technological edge, and thetarget position holes are knocked out before the holes are drilled for not influencing the accuracy of the drilling holes; the punched target position holes are used for positioning the drilling holesso as to enable the holes to be more accurate and solve the technical problem of blind holes and the technical problem that the attractive appearance of the alloy surface is influenced by liquid medicine cross easily occurring in the plating. Compared with a dry film and a pholin, the invention has lower manufacture cost except for using a little more drilling tip.

Description

Technical field [0001] The invention relates to the technical field of printed circuit boards, and in particular to a method and equipment for manufacturing single-sided electric nickel-gold boards. Background technique [0002] As people know, printed circuit boards (PCBs) are used in almost all electronic devices we can see, from electronic watches and calculators to computers, electronic communication equipment, military weapon systems, etc., as long as there are integrated circuits For electronic components, the electrical interconnection between them requires PCB. Printed circuit boards are formed by providing conductive patterns for electrical connections between electronic components on an insulating substrate. [0003] Electric nickel-gold board refers to one side of the printed circuit board used for the gold finger on the side of the board as a contact purpose, which can complete instant conduction under low voltage such as 2.5 volts, and can also be another type of repl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/06
Inventor 沈进伟
Owner SHENZHEN SUN & LYNN CIRCUITS
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