Method for preparing cathode material of tin - copper - nickel alloy in use for batteries
A negative electrode material and alloy negative electrode technology, which is applied in the field of preparation of tin-copper-nickel alloy negative electrode materials, can solve the problems of large irreversible capacity, large volume expansion rate, and large capacity attenuation, and achieve excellent discharge performance, simple preparation process, and low raw material cost. low effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0017] The adopted technical scheme consists of electroplating steps and vacuum treatment steps.
[0018] (1) Preparation of electroplating and electroplating solution (weight to volume ratio)
[0019] Disodium edetate 50g
[0020] Sodium Potassium Tartrate 10g
[0021] Potassium pyrophosphate 100g
[0024] Distilled water 700mL
[0025] The acidity of the bath was adjusted to pH9 with concentrated ammonia water. Put the copper film in the plating solution with a temperature of 30°C, at 0.2A / dm 2 Electroplating for 30 minutes under the direct current of the negative cathode, the copper film electrode coated with tin-nickel alloy is prepared.
[0026] (2) vacuum treatment
[0027] The copper film electrode coated with tin-nickel alloy was placed in a vacuum drying oven, treated at 100° C. for 5 hours in a vacuum degree of 760 mm Hg, and kept for 24 hours. Naturally cooling to room temperature with the furnace tem...
Embodiment 2
[0029] The adopted technical scheme consists of electroplating steps and vacuum treatment steps.
[0030] (1) Preparation of electroplating and electroplating solution (weight to volume ratio)
[0031] Disodium edetate 85g
[0032] Sodium Potassium Tartrate 53g
[0033] Potassium pyrophosphate 250g
[0035] Sodium stannate 60g
[0036] Distilled water 800mL
[0037] Adjust the acidity of the plating solution to pH 12.5 with a NaOH solution with a concentration of 0.1 mol / L. Put the copper film in the plating solution with a temperature of 75°C, at 1.0A / dm 2 Electroplating was performed for 0.2 minutes under the direct current of the cathode, and a copper film electrode coated with a tin-nickel alloy was prepared.
[0038] (2) vacuum treatment
[0039] The copper film electrode coated with tin-nickel alloy was placed in a vacuum drying oven, treated at 180° C. for 1 hour in a vacuum degree of 760 mm Hg, and kept for 24 hours. Naturally cooli...
Embodiment 3
[0041] The adopted technical scheme consists of electroplating steps and vacuum treatment steps.
[0042] (1) Preparation of electroplating and electroplating solution (weight to volume ratio)
[0043] Disodium edetate 65g
[0044] Sodium Potassium Tartrate 35g
[0045] Potassium pyrophosphate 200g
[0047]Sodium stannate 35g
[0048] Distilled water 800mL
[0049] use CH 3 COONa saturated solution adjusts the acidity of the plating solution from 4 to pH11, and then places the copper film in the plating solution at a temperature of 50°C at 0.5A / dm 2 Electroplating for 10 minutes under the negative direct current of the cathode, the copper film electrode coated with tin-nickel alloy is prepared.
[0050] (2) vacuum treatment
[0051] The copper film electrode coated with tin-nickel alloy was placed in a vacuum drying oven, treated at 150° C. for 3 hours in a vacuum degree of 580 mm Hg, and kept for 24 hours. Naturally cooling to room tempera...
PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com