Preparation method of metal surface copper-nickel alloy
A metal surface, copper-nickel alloy technology, applied in the field of metal surface anti-corrosion, can solve the problems of complex equipment, high temperature, film holes, etc., and achieve the effects of simple preparation method, excellent corrosion resistance and low cost
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0033] Example 1 Copper-nickel alloy was deposited on the surface of copper substrate by constant current technique.
[0034] 1) Metal surface pretreatment. The metal surface is polished sequentially with metallographic sandpaper of different meshes. After polishing, it is degreased and cleaned to make electrodes for use.
[0035] 2) Preparation solution: nickel sulfate 0.3M, copper sulfate 0.06M, surfactant sodium dodecylbenzenesulfonate 0.01g, metal ion complexing agent sodium citrate 0.10M.
[0036] 3) Constant current deposition of copper-nickel alloy. The saturated calomel electrode was used as the reference electrode, the platinum electrode was used as the counter electrode, and the copper electrode was used as the cathode, and the film was formed at -10mA and -15mA for 900s.
[0037] 4) Vacuum heat treatment to make it dense. Sinter at 500°C and hold for 30 minutes to make it more compact and improve performance.
[0038] 5) Phase analysis. The prepared sample was ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com