Gold-copper-nickel alloy, preparation method and application thereof
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A nickel alloy and gold-copper technology, applied in the field of gold-copper-nickel alloy and its preparation, can solve the problems of cracking and brittle fracture, the strength of brazing joints, and the difficulty of alloy processing and production, so as to prevent cracking, improve welding quality, and easily processing effect
Active Publication Date: 2011-07-06
BEIJING INST OF NONFERROUS METALS & RARE EARTH
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Problems solved by technology
When the Au-Cu alloy solder is slowly cooled from high temperature to below 400 °C, an ordered phase transition will occur, and the alloy will appear brittle ordered phase, which will bring difficulties to the processing and production of the alloy
During the brazing process, the volume change caused by the ordered phase transition and the appearance of a brittle ordered phase can lead to a decrease in the strength of the brazed joint or even crack and brittle fracture
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Embodiment 1
[0033] Adopt following preparation method to prepare gold-copper-nickel alloy, its composition and mass percentage are: Au: 81.5%, Cu: 15.5%, Ni: 3% (abbreviated as AuCu 15.5 Ni 3 ).
[0034] The preparation process is as follows:
[0035] a) Prepare raw materials: Purify gold 4N (99.99%) raw materials by electrolysis to remove impurity elements (mainly control Pb, Sb, In, Bi and rare earth elements), so that the purity of gold can reach more than 5N (>99.999%) ), purchased nickel (nickel with 4N purity is better) and oxygen-free copper raw materials; calculate and weigh according to the above-mentioned composition and mass percentage ratio.
[0036] b) putting the raw materials into the graphite crucible of the vacuum drawing casting furnace in turn;
[0037] c) Vacuumize until the degree of vacuum is 5Pa;
[0038] d) heating up, controlling the heating rate to be 20-25°C / min;
[0039] e) Control the temperature in the crucible at 1100°C-1150°C and refine for 3 to 5 minu...
Embodiment 2
[0047] Adopt the method described in embodiment 1 to prepare gold-copper-nickel alloy, its composition and mass percentage are: Au: %, Cu: 1.5%, Ni: 7.5% (being called for short AuCu 1.5 Ni 7.5 ), and control the continuous casting temperature at 1200-1250°C.
[0048] The gold-copper-nickel alloy prepared by the method described in Example 2 of the present invention is used as a light-load electrical contact material and winding material.
Embodiment 3
[0050] Adopt the method described in embodiment 1 to prepare gold-copper-nickel alloy, its composition and mass percentage are: Au: %, Cu: 15%, Ni: 10% (being called for short AuCu 15 Ni 10 ), and control the continuous casting temperature at 1100-1150°C.
[0051] The gold-copper-nickel alloy prepared by the method described in Example 3 of the present invention is used as a light-duty slip ring material.
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Abstract
The invention discloses a gold-copper-nickel alloy, a preparation method and applications thereof. The gold-copper-nickel alloy consists of, by weight, 15-60% of Cu, 1-5% of Ni, with the balance being Au. The preparation method comprises the following steps: in accordance with the above-mentioned weight percentage ranges, the high-purity gold, oxygen-free copper and high-purity nickel materials are weighed up; the raw materials are put in a graphite crucible in a vacuum continuous casting machine in order; the continuous casting machine is vacuumized, heated and filled with argon when all materials are melted, then the materials begin to be operated by drawing casting; the obtained wires by drawing casting have a diameter of 8mm; and the size of the finished product is achieved by further drawing operation. The gold-copper-nickel alloy in the invention is widely used as solder for an electric vacuum device, and can be used as light-load electrical contact material, winding material and slidding-ring material. Compared with the gold-copper alloy, nickel element is added in the gold-copper-nickel alloy in the invention, which avoids ordered phase transformation, enables the material to be easy to process, and raises the welding quality when the alloy used as solder.
Description
technical field [0001] The invention relates to a gold alloy and its preparation technology, especially to a gold-copper-nickel alloy and its preparation method and application, which are widely used as solder for electric vacuum devices, and can also be used as light-load electrical contact materials and precision winding materials and slip ring materials. Background technique [0002] Electrical contact materials are mainly used to connect or cut off various circuits, transmit electrical signals and convert electrical energy. Since a large number of electrical contact phenomena occur in the contact material during use, the electrical contact material must have multiple functions to withstand these electrical contact phenomena, the most important function of which is to maintain stable contact resistance and reliable mechanical contact. [0003] Therefore, it is required that the electrical contact material must have a low contact resistance (such as the contact resistance...
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