Ribbon bonding in an electronic package

a technology of electronic packaging and bonding, which is applied in the direction of manufacturing tools, non-electric welding apparatus, and capacitors, etc., can solve the problems of increasing the thickness of metalized parts, increasing the cost by decreasing the throughput of wafer/die manufacturing process, and limited wires, so as to reduce processing steps and time to produce the connection, reduce the overall volume of the connection, and increase the cross section and contact area
US20050269694A1Inactive Publication Date: 2005-12-08LUECHINGER CHRISTOPH B
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
LUECHINGER CHRISTOPH B
Publication Date
2005-12-08
Estimated Expiration
Not applicable · inactive patent

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Abstract

A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and / or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.
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Description

CROSS REFERENCE TO RELATED APPLICATIONS

[0001] This is a divisional application of U.S. patent application Ser. No. 10 / 429,128, entitled “Ribbon Bonding”, filed May 2, 2003.BACKGROUND

[0002] 1. Field of the Invention

[0003] The present invention relates to semiconductor devices, and in particular, to interconnecting a semiconductor die to a terminal lead in a semiconductor package.

[0004] 2. Related Art

[0005] In the manufacture of semiconductor devices, active elements in a semiconductor device, such as drain and / or source regions in a semiconductor die, are electrically connected to other devices or electronic components, such as on a printed circuit board. However, since semiconductor devices can be susceptible to environmental conditions, such as dust, moisture, and sudden impact, which can damage or otherwise interfere with the proper operation of the device, the device is typically protected by a die package. The die package both protects the die and allows the die to electric...

Claims

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