182 results about "Multiple bonds" patented technology

In the present invention, Ar gas for plasma generation is supplied to a plasma generation region and butyne gas having a multiple bond is supplied to a film formation region at a substrate side as source gas, inside of a process vessel in an insulating film forming apparatus. A microwave is supplied inside of the process vessel from a radial line slot antenna under a state in which a bias voltage is not applied to a substrate W. A plasma is thereby generated in the plasma generation region, the butyne gas in the film formation region is activated by the plasma, and an insulating film of amorphous carbon is formed on the substrate.

A resist composition for immersion exposure, including a base component (A) that exhibits changed solubility in an alkali developing solution under action of acid, an acid generator component (B) that generates acid upon exposure, and a fluorine-containing compound (C) represented by a general formula (c-1) shown below that is decomposable in an alkali developing solution:

wherein R¹ represents an organic group which may contain a polymerizable group, with the proviso that said polymerizable group has a carbon-carbon multiple bond, and the carbon atoms forming the multiple bond are not directly bonded to the carbon atom within the —C(═O)— group in general formula (c-1); and R² represents an organic group having a fluorine atom.

A communications system employs the use of both synchronous CDMA and FDMA to provide a variable bandwidth waveform with multiple bonded transmitters and receivers that are agile in both frequency and PN code to permit a variable bandwidth and variable rate multiple access system. In a first aspect the teachings provide the use of both CDMA and FDMA together to enable an improved concentration efficiency by making a larger pool of bandwidth available to each user. In a second aspect these teachings enable channel bonding across both code space and frequency space, thus making the system capable of operating within a variable (not necessarily contiguous) bandwidth and at a finely variable rate.

The present invention provides a biologically active combination for agricultural applications, comprising A) at least one biocidal, agriculturally acceptable active compound and B) a bioactivator for the active substance according to A) and C) if appropriate, customary auxiliaries and additives, which comprises the use, as bioactivator B), at least one compound of the formula (I)

R—C(O)NH—(CH₂)_a—N⁺(R¹,R²)—(CH₂)_b—COO—  (I)

in which R is a hydrocarbon radical having 6 to 22 carbon atoms, preferably 8 to 18 and in particular 10 to 14 carbon atoms, which is optionally branched and/or contains multiple bonds and/or functional groups,

• [0001]
  • R¹, R² independently of one another are C_1-4-alkyl radicals, in particular —CH₃, a is 1 to 5, preferably 2 or 3, b is 1 or 2, in an effective concentration.

A three-terminal device includes first electrode, second electrode, gate electrode and an active channel coupling the first and second electrodes. The active channel has a layer of organic molecules with conjugated multiple bonds. The delocalized pi-orbitals associated with the conjugated multiple bonds extend normal to the layer.

An apparatus relating generally to a substrate is disclosed. In such an apparatus, a first bond via array has first wires extending from a surface of the substrate. A second bond via array has second wires extending from the surface of the substrate. The first bond via array is disposed at least partially within the second bond via array. The first wires of the first bond via array are of a first height. The second wires of the second bond via array are of a second height greater than the first height for coupling of at least one die to the first bond via array at least partially disposed within the second bond via array.

The invention relates to a medical product having a surface at least partially covered by a polymer layer. The polymer layer is preferably formed by autopolymerization. Polymerization of substances containing at least one heavy bond, especially unsaturated fatty acids containing alkyl chains consisting preferably of 7 to 50 carbon atoms. Other substances that do not participate in polymerization may be added to the substances that participate in the polymerization reaction. The substances are preferably saturated fatty acids and fatty acid derivatives. The invention also relates to a method of manufacturing said medical product and its use.

Apparatuses relating generally to a substrate are disclosed. In such an apparatus, first wire bond wires (“first wires”) extend from a surface of the substrate. Second wire bond wires (“second wires”) extend from the surface of the substrate. The first wires and the second wires are external to the substrate. The first wires are disposed at least partially within the second wires. The first wires are of a first height. The second wires are of a second height greater than the first height for coupling of at least one electronic component to the first wires at least partially disposed within the second wires.

A ball grid array package and its packaging process is described. A thermal dissipation substrate has a first surface and a second surface. An insulating layer and a copper foil are built up sequentially on the second surface. The copper foil is patterned to form multiple of conducting wire traces, and then a solder resist is coated on the surfaces of both the conducting wire traces and the insulating layer. Afterwards, part of the surfaces of the conducting wire traces is exposed to form multiple bonding fingers and multiple ball pads. Moreover, an aperture is formed at the center of the thermal dissipation substrate and insulating layer to penetrate through the thermal dissipation substrate and the insulating layer. Furthermore, a chip having its active surface bound to the first surface and has multiple bonding wires passing through the aperture to electrically connect the bonding pads to bonding fingers. Finally, encapsulating material is employed to encapsulate the chip, the bonding wires and the bonding fingers, and the solder balls are placed on the respective ball pads.

The present invention relates to substances, crosslinkable by attachment of an Si-bonded hydrogen atom to an aliphatic multiple bond, which comprise at least one compound of the formula

R³P(O)(OH)₂  (III)

and/or the derivatives thereof,

R³ being an optionally substituted hydrocarbon radical which can be interrupted by heteroatoms.

Silicone coatings and moldings are produced from a photocrosslinkable silicone mixture which contains

• (A) a polyorganosiloxane containing at least two carbon-carbon multiple bonds,
• (B) an organosilicon compound containing at least two SiH functions, and
• (C) a cyclopentadienyl-platinum complex catalyst be activatable by light of 200 to 500 nm,

wherein the mixture is heated to 40° C. to 250° C., and then irradiated with light of 200 to 500 nm wavelength.

This method relates to the preparation by ALD of a thin film of formula MY_x, x being in the range from 1.5 to 3.1.

According to this method, MY_x is deposited by ALD on a substrate, from at least one precursor of metal M, and at least one precursor of element Y;

• • M being tungsten and/or molybdenum;
  • the degree of oxidation of metal M in the precursor of metal M being in the range from 3 to 6;
  • the metal of the precursor of metal M only including simple or multiple bonds M-Z and/or M-M with Z=C, N, H, and any combination of these atoms;
  • Y being sulfur and/or selenium;
  • the substrate temperature being lower than or equal to 350° C.

A solderable bar bond connector establishes a primary interconnect between a substrate and a high current terminal of an IC chip mounted on the substrate, and one or more secondary interconnects between the substrate and low current terminals of the IC chip. The bar bond connector includes a plate portion soldered to the high current terminal of the IC chip and a plurality of leg elements extending from the plate portion to multiple bond sites on the substrate. The underside of at least one leg element is provided with a secondary circuit including a conductor that is electrically isolated from the respective leg element. The conductor of the secondary circuit is soldered to both the substrate and a low current terminal of the IC chip for establishing a secondary interconnect in addition to the primary interconnect established by the plate portion and the other leg elements.

Disclosed are a composition including a silane-based organic/inorganic hybrid material having a multiple bond and one or more organic metal compounds and/or one or more organic polymers, an organic insulator including the composition, an organic thin film transistor (OTFT) including the organic insulator and an electronic device including the OTFT. The organic insulator including the composition for preparing an organic insulator has increased charge mobility and an increased on/off current ratio, thus exhibiting improved properties, and the organic thin film transistor manifests uniform properties due to the absence of hysteresis.