186 results about "Multiple bonds" patented technology

An apparatus relating generally to a substrate is disclosed. In such an apparatus, a first bond via array has first wires extending from a surface of the substrate. A second bond via array has second wires extending from the surface of the substrate. The first bond via array is disposed at least partially within the second bond via array. The first wires of the first bond via array are of a first height. The second wires of the second bond via array are of a second height greater than the first height for coupling of at least one die to the first bond via array at least partially disposed within the second bond via array.

An electrically conductive silicone composition comprising an electrically conductive filler; organopolysiloxane mixture comprising a catalyst which promotes the addition of Si-bonded hydrogen onto alkenyl multiple bonds; an organopolysiloxane having at least two alkenyl groups per molecule; an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; optionally, a fluid organopolysiloxane having a viscosity less than about 1000 centipoise; and optionally, an organopolysiloxane gel formulation, the composition, when cured, having a Shore A Durometer hardness of less than or equal to about 60 measured according to ASTMD-2240 and an electrical resistivity of less than or equal to about 10−6 ohm-cm.

Apparatuses relating generally to a substrate are disclosed. In such an apparatus, first wire bond wires (“first wires”) extend from a surface of the substrate. Second wire bond wires (“second wires”) extend from the surface of the substrate. The first wires and the second wires are external to the substrate. The first wires are disposed at least partially within the second wires. The first wires are of a first height. The second wires are of a second height greater than the first height for coupling of at least one electronic component to the first wires at least partially disposed within the second wires.

A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and / or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.

Polyorganosiloxane compositions crosslinkable by addition of Si-bonded hydrogen to aliphatic carbon-carbon multiple bonds which have extended pot life or are preparable as storage stable one component compositions including latent catalysts of specific platinum complexes.

A compound selected from those of formula (I): in which:W represents N or C—R1; in which R1 is as defined in the description,X represents N or C—R2 in which R2 is as defined in the description,Y represents a group selected from oxygen, sulfur, —NH, and —Nalkyl,Z represents a group selected from oxygen, sulphur, —NR8 in which R8 is as defined in the description, and optionally carbon depending the definition of Y,n is an integer from 0 to 8 inclusive,Z1 represents a group —CR9R10 wherein R9 and R10, are as defined in the description, which group contains optionally multiple bonds or heteroatomes,A represents a cyclic group,m is an integer from 0 to 7 inclusive,the group(s) R4 is (are) as defined in the description,R3 represents a group selected from hydrogen, alkyl, alkenyl, alkynyl, and the group of formula: in which p, Z2, B, q, and R13 are as defined in the description,optionally, its racemic forms, isomers thereof, N-oxydes thereof, and its the pharmaceutically acceptable salts thereof, and medicinal products containing the same are useful as specific inhibitors of type-13 matrix mettaloprotease.

A resist composition for immersion exposure, including a base component that exhibits changed solubility in an alkali developing solution under action of acid, an acid generator component that generates acid upon exposure, and a fluorine-containing compound represented by a general formula (c-1) that is decomposable in an alkali developing solution:wherein R1 represents an organic group which may contain a polymerizable group, with the proviso that said polymerizable group has a carbon-carbon multiple bond, and the carbon atoms forming the multiple bond are not directly bonded to the carbon atom within the —C(═O)— group in general formula (c-1); and R2 represents an organic group having a fluorine atom.

The invention relates to defoamer formulations which comprise (A) siloxane-based antifoam agents and (B) polysiloxane copolymers which are obtainable by reacting, in a first step, organopolysiloxanes (1) which comprise at least one Si-bound hydrogen atom, preferably at least two Si-bound hydrogen atoms, per molecule, with the substantially linear oligomer or polymer compounds (2) of the general formula R<1>-(A-CnH2n)m-A<1>-H (I), wherein R<1> represents a monovalent optionally substituted hydrocarbon group to which Si-H groups can be attached in a hydrosilylation reaction, preferably a hydrocarbon group comprising an aliphatic C-C multiple bond, A represents a divalent, polar organic group selected from the group comprising -O-, -C(O)-O-, -O-C(O)-, -O-C(O)-O-, -C(O)-NH-, -NH-C(O)-, a urethane group and a urea group, preferably an oxygen atom -O-, A<1> represents a divalent, polar organic group selected from the group comprising -O-, -NH- and -NR'- (whereby R' represents a monovalent hydrocarbon group with 1 to 18 carbon atoms), n is an integer from 1 to 20 and m is a positive integer, and, in a second step, reacting the intermediate products (4) so obtained which comprise H-A<1> groups with organic compounds (5) having at least two isocyanate groups per molecule, with the proviso that the water content of the compounds (1) and (2) used for producing the polysiloxane copolymers is less than 2000 % ppm, based on the total weight of compounds (1) and (2) .