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Heating and cooling device

A technology of cooling equipment and cooling section, applied in metal processing equipment, welding equipment, welding equipment and other directions, can solve the problems of lack of cooling device, poor efficiency, time-consuming and other problems, to shorten processing time, efficient heating and cooling, improve The effect of heating and cooling efficiency

Active Publication Date: 2017-08-29
FUJI ELECTRIC CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0014] However, the devices of Patent Documents 1 to 3 have the following problems: no cooling device is provided, the cooling of the soldered member after heating is natural cooling, it takes time until the solder solidifies, and the efficiency is poor

Method used

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Embodiment Construction

[0060] Below, refer to figure 1 One embodiment of the heating and cooling equipment according to the present invention will be described.

[0061] figure 1 A schematic structural diagram of the heating and cooling device 100 is shown in . The heating and cooling equipment 100 is equipped with: an airtight processing chamber 4, which has an opening and closing mechanism that can take out and put in the processed member 1; the cooling part 3a of the cooling device 3, which is arranged below the processed member 1; The induction heating coil 2a of device 2, it is arranged in the below of cooling part 3a; Mobile device 15, it is used to change the distance between processed member 1 and cooling part 3a; Temperature sensor 5, it is used to measure processed member 1 the temperature; the control device 6, which controls the induction heating device 2 and the cooling device 3 based on the measured temperature; and the input device 7, which is used to input a signal to the control...

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Abstract

Provided is a heating and cooling device which is capable of performing heating and cooling processes within an airtight processing chamber, and which enables size reduction of the device, while increasing the heating and cooling efficiency. This heating and cooling device 100 is provided with: an airtight processing chamber 4; an induction heating device 2 that is composed of an induction heating coil 2a which heats a member to be processed 1; a cooling device 3 that cools the member to be processed 1; a temperature sensor 5 for measuring the temperature of the member to be processed 1; and a control device 6 that controls the induction heating device 2 and the cooling device 3. This heating and cooling device 100 is also provided with a move device 15 that moves at least one of the members to be processed 1 and a cooling unit 3a of the cooling device 3, thereby changing the distance between the member to be processed 1 and the cooling unit 3a.

Description

technical field [0001] The present invention relates to a heating and cooling device, and more specifically, for example, to a heating and cooling device suitable for soldering a semiconductor element to a substrate. Background technique [0002] As a conventional soldering device, there is known a continuous conveyance type reflow furnace (reflow furnace), which mounts a soldered component on a conveyor and sequentially passes through a preliminary heating zone, a main heating zone, and a cooling zone to align the components. Perform reflow soldering. Generally, such reflow ovens are open to the atmosphere. [0003] However, in recent years, in power semiconductor modules used as switching devices for power conversion, etc., the use environment conditions are severe, and semiconductor chips such as IGBTs (Insulated Gate Bipolar Transistors) and FWD ( Free Wheeling Diode (Free Wheeling Diode) and other electronic components and the insulating substrate or the insulating su...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/52B23K1/00B23K1/002B23K1/008B23K3/04B23K31/02H05K3/34
CPCH01L21/67109H01L21/67115H01L21/67248B23K3/085H05K3/3494B23K2101/40B23K1/002H01L24/75H01L2224/75265H01L2224/97H01L2224/83222H01L2224/7598H01L2224/75501H01L2224/83075H01L2224/751H01L24/83H01L24/97H01L2224/32225H01L2224/291H01L2224/83H01L2924/014H01L21/67103H01L21/67144B23K1/008B23K3/0475B23K31/02H05K3/34H01L2224/75101H01L2224/7565H01L2224/759
Inventor 横山胜治松下毅中原浩昭竹内正树和田刚典菊池昌宏五十岚嘉男成瀬光洋百瀬政弘
Owner FUJI ELECTRIC CO LTD
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