Method for chemical plating metal for non-metal substrate surface and pretreatment system used thereof

Abstract

The present invention discloses new activating process and activating solution with non-noble metal for chemical plating of metal onto the surface of non-metal base material. The activating solution is alkaline organic metal complex solution comprising water soluble salt of bivalent Ni, Cu or Co ion, organic alkane complexing agent and pH regulator. The new activating process and activating solution of the present invention may be used to replace available process and solution with noble metal for wide use in the chemical plating of metal material onto the surface of non-metal base material, such as chemically plating nickel, chemically plating copper, chemically plating cobalt, etc. The activating solution of the present invention is stable, simple in technological process and low in cost, and the present invention makes it possible to save noble metal resource effectively and is ideal technology to replace available one.

Description

technical field [0001] The invention relates to a method for metallizing the surface of a non-metallic substrate, in particular to a method for activating the surface of a non-metallic substrate by using a non-precious metal pretreatment system, and then chemically plating metal after reduction treatment and the method used. Activation agent. technical background [0002] Electroless metal plating is a commonly used metal coating method. Can be performed on metallic and non-metallic substrates. When implementing non-metallic electroless plating, a process called "activation" must be implemented as a pretreatment for electroless plating. The traditional activation process includes the use of .SnCl 2 Sensitization and PdCl 2 There are two steps of activation. Although this process has the characteristics of good activation effect and simple process, it has disadvantages such as high cost, complicated process, and easy contamination of the plating solution by precious metals...

AI Technical Summary

Problems solved by technology

When implementing non-metallic electroless plating, a process called "activation" must be implemented as a pretreatment for electroless plating. The traditional activation process includes the use of .SnCl 2 Sensitization and PdCl 2 There are two steps of activation. Although this process has the characteristics of good activation effect and simple process, it has disadvantages such as high cost, complicated process, and easy contamination of the plating solution by precious metals, resulting in easy decomposition of the electroless plating bath.

Although it has been proposed that various methods of using silane coupling agents to make precious metals such as Pd supported on the treated surface (Japanese Patent Publication No.S59-52701, Japanese Patent Application Publication No.S60-181294, Japanese Patent Application Publication No.S61-194183, Japanese Patent Publication No.H03-44149, CN1406288A), but these methods are difficult to form adhesion good on nonmetallic materials such as polyurethane sponge, non-woven fabric, cotton cloth, chemical fiber fabric, fiber net, fiber cloth The uniform film layer will affect the effect of subsequent electroless plating and make it difficult to popularize and use

[0003] In recent years, someone has proposed a new activation process using non-precious metals. Gao Deshu et al. (Research on Colloidal Activation Solution for Non-metallic Plating [J], Surface Technology, 1993, 22) impregnated the ABS plastic substrate with nickel and copper hydroxide colloidal solutions. , with NaBH 4 Reducing divalent nickel and copper to a metallic state, and then electroless plating, has achieved certain results, but the bonding force of the coating is poor, the activity is much lower than that of the activator made of palladium salt, and it is difficult to achieve complete coverage

There are also reports (research on the activation process of electroless nickel plating on non-metallic materials, material protection, volume 34, phase 2, February 2001) to activate ceramics or sodium glass with high concentration ammonia nickel salt, and then at a temperature above 200 ℃ Under this condition, the adsorbed nickel salt is pyrolyzed into a substance with high catalytic activity, and then electroless plating is performed, and a good electroless plating effect can also be received, but its high pyrolysis temperature cannot be used for polyurethane sponges, non-woven fabrics, Cotton cloth, chemical fiber fabric, fiber mesh, fiber cloth and other substrates with low thermal degradation temperature, the application range is limited