Method for chemical plating metal for non-metal substrate surface and pretreatment system used thereof

A substrate surface, non-metal technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve problems such as application scope limitation, precious metal pollution, unusability, etc., to overcome the bottleneck of cost reduction, The effect of saving precious metal resources and reducing production costs

Inactive Publication Date: 2005-07-20
HUNAN CORUN NEW ENERGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When implementing non-metallic electroless plating, a process called "activation" must be implemented as a pretreatment for electroless plating. The traditional activation process includes the use of .SnCl 2 Sensitization and PdCl 2 There are two steps of activation. Although this process has the characteristics of good activation effect and simple process, it has disadvantages such as high cost, complicated process, and easy contamination of the plating solution by precious metals, resulting in easy decomposition of the electroless plating bath.
Although it has been proposed that various methods of using silane coupling agents to make precious metals such as Pd supported on the treated surface (Japanese Patent Publication No.S59-52701, Japanese Patent Application Publication No.S60-181294, Japanese Patent Application Publication No.S61-194183, Japanese Patent Publication No.H03-44149, CN1406288A), but these methods are difficult to form adhesion good on nonmetallic materials such as polyurethane sponge, non-woven fabric, cotton cloth, chemical fiber fabric, fiber net, fiber cloth The uniform film layer will affect the effect of subsequent electroless plating and make it difficult to popularize and use
[0003] In recent years, someone has proposed a new activation process...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Soak the polyurethane sponge in the degreasing solution at 30°C for 3 minutes; take it out and wash it, roughen it in the roughening solution at 30°C for 4 minutes, take it out and wash it, and soak it in the film removal solution for 3 minutes; take it out and wash it, and put it in the 50°C Activate in the activation solution for 1-2 minutes; take it out and wash it, and then reduce it in the reducing solution at 50°C for 1-2 minutes. Rinse the reduced polyurethane sponge, put it into the electroless nickel plating system and react at 50°C for 2 to 5 minutes to complete the electroless nickel plating process. The composition of each solution is as follows:

[0030] a Degreasing solution Sodium hydroxide 0.7~0.9 mol / L

[0031]b Coarsening solution Potassium permanganate 0.6~0.8 g / L

[0032] Sulfuric acid 0.12~0.15 g / L

[0033] pH 2.3~2.8

[0034] c Remove film solution Oxalic acid 10~14 g / L

[0035] d Activation solution Triethano...

Embodiment 2

[0048] Soak the polyester cloth in the degreasing solution at 95°C for 25 minutes; take it out and wash it, put it in the activation solution at 25°C for 4-6 minutes; take it out and wash it, and restore it in the reducing solution at 25°C for 4-6 minutes. Rinse the restored polyester cloth, put it into the electroless copper plating system and react at 20°C for 2-5 minutes to complete the electroless copper plating process. The composition of each solution is as follows:

[0049] a Degreasing solution Sodium hydroxide 100 g / L

[0050] b Activation solution Triethanolamine 0.008~0.015 mol / L

[0051] Copper Sulfate (CuSO 4 ·5H 2 O) 0.004~0.006 mol / L

[0052] Ammonia amount

[0053] pH 11~12

[0054] c reducing solution Potassium borohydride 5~6 g / L

[0055] Ammonium Sulfate-Sodium Hydroxide Appropriate amount

[0056] pH 10.3~10.8

[0057] d electroless copper plating solution copper sulfa...

Embodiment 3

[0063] Soak ABS plastic in degreasing solution at 60°C for 10 minutes; take it out and wash it, roughen it in roughening solution at 60-70°C for 20 minutes, take it out and wash it, and soak it in film removal solution for 3 minutes; take it out and wash it, put Put it into the activation solution for activation at 65°C for 6-8 minutes; take it out and wash it, and restore it in the reduction solution for 6-8 minutes at 75°C. Rinse the reduced polyester cloth, put it into the electroless cobalt plating system and react at 40°C for 2-5 minutes to complete the electroless cobalt plating process. The composition of each solution is as follows:

[0064] a Degreasing solution Sodium hydroxide 40 g / L

[0065] b Coarsening solution Chromic anhydride 400~430 g / L

[0066] Sulfuric acid 330~405 g / L

[0067] c Film removal solution Hydrochloric acid 100~200 ml / L

[0068] dActivation solution N-methyldiethanolamine 0.40~0.50 mol / L

[0069] Cobalt Chlorid...

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PUM

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Abstract

The present invention discloses new activating process and activating solution with non-noble metal for chemical plating of metal onto the surface of non-metal base material. The activating solution is alkaline organic metal complex solution comprising water soluble salt of bivalent Ni, Cu or Co ion, organic alkane complexing agent and pH regulator. The new activating process and activating solution of the present invention may be used to replace available process and solution with noble metal for wide use in the chemical plating of metal material onto the surface of non-metal base material, such as chemically plating nickel, chemically plating copper, chemically plating cobalt, etc. The activating solution of the present invention is stable, simple in technological process and low in cost, and the present invention makes it possible to save noble metal resource effectively and is ideal technology to replace available one.

Description

technical field [0001] The invention relates to a method for metallizing the surface of a non-metallic substrate, in particular to a method for activating the surface of a non-metallic substrate by using a non-precious metal pretreatment system, and then chemically plating metal after reduction treatment and the method used. Activation agent. technical background [0002] Electroless metal plating is a commonly used metal coating method. Can be performed on metallic and non-metallic substrates. When implementing non-metallic electroless plating, a process called "activation" must be implemented as a pretreatment for electroless plating. The traditional activation process includes the use of .SnCl 2 Sensitization and PdCl 2 There are two steps of activation. Although this process has the characteristics of good activation effect and simple process, it has disadvantages such as high cost, complicated process, and easy contamination of the plating solution by precious metals...

Claims

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Application Information

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IPC IPC(8): C23C18/30
Inventor 陶维正刘畅贺持缓何亚登蒋素斌陈晓智庄文良邓美华戴桂中周小平
Owner HUNAN CORUN NEW ENERGY CO LTD
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