Non-ammonia type plating solution for chemical nickel plating

A technology for electroless nickel plating and plating solution, applied in the field of electroless plating solution, can solve the problems of influence of plating solution performance, decrease in plating rate, decrease in production efficiency, etc., and achieve cost reduction of plating solution, strong corrosion resistance, and uniform plating performance strong effect

Inactive Publication Date: 2008-12-03
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the ammonia water used in the coating preparation process is very volatile, causing environmental pollution, and does not meet the requirements of clean production; at the same time, the content of ammonia water in the plating solution decreases a lot with the increase of time, which has a certain impact on the perfo

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Add 3.5g of copper sulfate and 13g of tartaric acid into a small amount of water to dissolve, then dissolve 4.0g of bismuth nitrate and 4.5g of zinc sulfate with sulfuric acid, and finally mix the two, add ammonia and put them into a beaker filled with 1L of deionized water. Stir with a magnetic stirrer until clear to obtain 1 L of brightener solution.

[0037] Put 4g of sodium tungstate, 3g of imidazole, and 17g of EDTA·2Na into a beaker filled with deionized water, stir with high-speed magnetic force until they are completely dissolved, and dilute the volume to 1L with deionized water to obtain a stabilizer solution.

[0038] Put 28g of nickel sulfate hexahydrate, 24g of hypophosphorous acid, 10g of ammonium acetate, 3g of tartaric acid, 10mL of lactic acid, 5mL of propionic acid, 1.0mL of stabilizer solution, and 1.5mL of brightener into a beaker filled with deionized water. Stir until completely dissolved, adjust the pH value of the solution to 5.3 with sodium hydro...

Embodiment 2

[0041] Dissolve 4.5g of copper chloride and 15g of tartaric acid in a small amount of water, then dissolve 4g of stannous chloride and 3g of bismuth nitrate with sulfuric acid, and finally mix the two, add ammonia and put them into a beaker containing 1L of deionized water. Stir with a magnetic stirrer until clear to obtain 1 L of brightener solution.

[0042] Put 5g of sodium tungstate, 3g of imidazole, and 15g of EDTA·2Na into a beaker filled with deionized water, stir it with high-speed magnetic force until it is completely dissolved, and dilute the volume to 1L with deionized water to obtain a stabilizer solution.

[0043] Put 25g of nickel chloride, 27g of sodium hypophosphite, 12g of ammonium acetate, 1.8g of malic acid, 11mL (12g) of lactic acid, 4mL (6g) of propionic acid, 1.2mL of stabilizer solution, and 1.8mL of brightener In the beaker of ionized water, high-speed magnetic stirring is until all dissolve, and the pH value of solution is modulated 5.5 with potassium ...

Embodiment 3

[0046] Add 3.5g of copper sulfate and 20g of tartaric acid into a small amount of water to dissolve, then dissolve 4.0g of bismuth nitrate and 4.5g of zinc sulfate with sulfuric acid, and finally mix the two, add ammonia and put them into a beaker filled with 1L of deionized water. Stir with a magnetic stirrer until clear to obtain 1 L of brightener solution.

[0047] Put 7g of sodium tungstate, 2g of imidazole, and 18g of EDTA into a beaker filled with deionized water, stir with high-speed magnetic force until they are all dissolved, and dilute the volume to 1L with deionized water to obtain a stabilizer solution.

[0048] Put 29g of nickel sulfate hexahydrate, 23g of sodium borohydride, 5.5mL of glacial acetic acid, 4g of citric acid, 13mL of lactic acid, 4mL of propionic acid, 1.4mL of stabilizer solution, and 2.2mL of brightener into a beaker filled with deionized water. High-speed magnetic stirring until completely dissolved, the pH value of the solution is adjusted to 5.6 ...

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PUM

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Abstract

The invention discloses an ammonia-free chemical nickel plating bath which adopts an ammonia-free pH modifying agent to regulate the pH value of the bath. Each liter of the bath contains the components that nickel salt is 24 to 30g, reducing agent is 24 to 33g, buffering agent is 10 to 18g, complexing agent is 20 to 30g, stabilizing agent is 0.5 to 1.5mL, brightener is 1.5 to 3.0mL, and others are water. In the ammonia-free chemical nickel plating bath, the ammonia-free pH modifying agent is selected from one or the mixture of sodium hydroxide, and potassium hydroxide or potassium carbonate. All materials in the ammonia-free chemical nickel plating bath do not contain heavy metal, ammonia water is not utilized to regulate the pH value, the problems of environment pollution, invalidation caused by overlong storing time of the bath, etc. are not caused, and the obtained chemical plating bath is friendly to the environment, in addition, the luminance brightness of the made plating layer can be full-bright. The bath has wide application prospect.

Description

technical field [0001] The invention relates to an electroless plating solution, in particular to an ammonia-free electroless nickel plating solution. Background technique [0002] Common electroless plating solutions use ammonia water to provide alkalinity to adjust the pH value of the plating solution and provide complexation to complex nickel ions in the plating solution. The complexing ability of ammonia water can make the plating solution more stable, and the alkalinity and weak complexing ability provided by ammonia water can maintain the plating speed of the plating solution at a relatively high level. However, the ammonia water used in the coating preparation process is very volatile, causing environmental pollution, and does not meet the requirements of clean production; at the same time, the content of ammonia water in the plating solution decreases a lot with the increase of time, which has a certain impact on the performance of the plating solution. Ammonia must...

Claims

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Application Information

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IPC IPC(8): C23C18/36
Inventor 崔国峰丁坤
Owner SUN YAT SEN UNIV
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