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Gold-plating method of high silicon-aluminum composite material

A composite material, high-silicon-aluminum technology, applied in the direction of superimposed layer plating, metal material coating process, liquid chemical plating, etc., can solve the problem of affecting the welding performance and air tightness of the shell, the difficulty of surface plating, and the combination of plating Insufficient strength and other problems, to achieve the effect of releasing internal stress, clear transition interface, and improving the bonding force of the coating

Active Publication Date: 2014-01-29
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the special physical characteristics of this material, it is difficult to electroplate its surface. If the process is unreasonable, the coating is prone to low bonding strength, and the coating will have quality problems such as bubbling and peeling after welding or high and low temperature cycles, which seriously affect the shell. Body welding performance and airtightness

Method used

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  • Gold-plating method of high silicon-aluminum composite material
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  • Gold-plating method of high silicon-aluminum composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The specific operation steps of Si-50Al composite gold plating are as follows:

[0026] Preparation of gold plating solution: weigh potassium gold cyanide, citric acid, and potassium citrate according to the formula, inject one-third of deionized water into the plating solution, add the weighed potassium gold cyanide and make it fully dissolved; Dissolve the weighed citric acid and potassium citrate in deionized water separately and pour them into the plating tank, and replenish the deionized water to the working level. The composition and content of the prepared gold plating solution are: potassium gold cyanide 20 g / L, citric acid 12 g / L, and potassium citrate 30 g / L.

[0027] Prepare alkaline etching solution: weigh sodium hydroxide, sodium carbonate, and sodium phosphate according to the formula, and prepare a solution. The composition and content of the prepared alkaline etching solution are NaOH 5g / L, NaOH 5g / L, NaOH 2 CO 3 30g / L, Na 3 PO 4 40g / L and 1L of wa...

Embodiment 2

[0045] The specific operation steps of Si-50Al composite gold plating are as follows:

[0046] Preparation of gold plating solution: weigh potassium gold cyanide, citric acid, and potassium citrate according to the formula, inject one-third of deionized water into the plating solution, add the weighed potassium gold cyanide and make it fully dissolved; Dissolve the weighed citric acid and potassium citrate in deionized water separately and pour them into the plating tank, and replenish the deionized water to the working level. The composition and content of the prepared gold plating solution are: potassium gold cyanide 22 g / L, citric acid 11 g / L, and potassium citrate 32 g / L.

[0047] Preparation of alkali etching solution: weigh sodium hydroxide, sodium carbonate, and sodium phosphate according to the formula, and prepare a solution. The composition and content of the prepared alkali etching solution are NaOH 8g / L, NaOH 8g / L, NaOH 2 CO 3 35g / L, Na 3 PO 4 50g / L and 1L of...

Embodiment 3

[0063] The specific operation steps of Si50% silicon-aluminum composite material gold plating are as follows:

[0064] Preparation of gold plating solution: weigh potassium gold cyanide, citric acid, and potassium citrate according to the formula, inject one-third of deionized water into the plating solution, add the weighed potassium gold cyanide and make it fully dissolved; Dissolve the weighed citric acid and potassium citrate in deionized water separately and pour them into the plating tank, and replenish the deionized water to the working level. The composition and content of the prepared gold plating solution are: potassium gold cyanide 25 g / L, citric acid 10 g / L, and potassium citrate 35 g / L.

[0065] Prepare alkaline etching solution: weigh sodium hydroxide, sodium carbonate, and sodium phosphate according to the formula, and prepare a solution. The composition and content of the prepared alkaline etching solution are NaOH 6g / L, NaOH 6g / L, NaOH 2 CO 3 40g / L, Na 3 P...

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Abstract

The invention relates to a gold-plating method of a high silicon-aluminum composite material. According to a second zinc immersion treatment method of conventional aluminum alloy electroplating, pre-treatment of the method comprises the following six steps: cleaning and oil removing; alkaline etching; bright dipping; primary zinc immersion; zinc annealing; secondary zinc immersion. The gold-plating method subsequently comprises the following steps: I, preplating chemical nickel in a chemical nickel-plating liquid; II, plating nickel for the first time according to a conventional nickel-plating method, wherein the nickel layer is 2-3 microns thick; III, performing aging treatment; IV, performing activating treatment; V, plating nickel for the second time according to a conventional nickel-plating method, wherein the nickel layer is 2-3 microns thick; VI, taking a pure gold plate or a platinum titanium mesh as an anode and the high silicon-aluminum composite material as a cathode according to a conventional pure gold-plating method, wherein the gold layer is 2-3 microns thick; VII, detecting the binding force of the plating layer. The plating layer observed under tenfold amplifying glass is free from peeling and bubbling phenomena and good in binding force. The binding force of the gold-plating plating layer and a high silicon-aluminum base material adopted by the method provided by the invention is firm and reaches the standard of appendix A of GJB1420 General Specification of Semiconductor Integrated Circuit Shell.

Description

technical field [0001] The invention relates to a gold-plating method, in particular to a gold-plating method for Si-50Al, a high-silicon-aluminum composite material with a silicon content of 50%, which is mainly applied to the packaging shell of a multi-chip T / R component, and belongs to the engineering application field of electronic packaging materials . Background technique [0002] The controlled expansion coefficient (Controlled Expansion, CE) series of aluminum matrix composite materials with high silicon content is very suitable for airborne, elastic Packaging materials for T / R components in the field of on-board, space-borne and other fields. However, due to the special physical characteristics of this material, it is difficult to electroplate its surface. If the process is unreasonable, the coating is prone to low bonding strength, and the coating will have quality problems such as bubbling and peeling after welding or high and low temperature cycles, which serio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C28/02C23C18/36C25D3/48H01L21/768
Inventor 卢海燕朱春临周明智刘东光
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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