615results about How to "Guaranteed bonding" patented technology

The invention relates to a gold-plating method of a high silicon-aluminum composite material. According to a second zinc immersion treatment method of conventional aluminum alloy electroplating, pre-treatment of the method comprises the following six steps: cleaning and oil removing; alkaline etching; bright dipping; primary zinc immersion; zinc annealing; secondary zinc immersion. The gold-plating method subsequently comprises the following steps: I, preplating chemical nickel in a chemical nickel-plating liquid; II, plating nickel for the first time according to a conventional nickel-plating method, wherein the nickel layer is 2-3 microns thick; III, performing aging treatment; IV, performing activating treatment; V, plating nickel for the second time according to a conventional nickel-plating method, wherein the nickel layer is 2-3 microns thick; VI, taking a pure gold plate or a platinum titanium mesh as an anode and the high silicon-aluminum composite material as a cathode according to a conventional pure gold-plating method, wherein the gold layer is 2-3 microns thick; VII, detecting the binding force of the plating layer. The plating layer observed under tenfold amplifying glass is free from peeling and bubbling phenomena and good in binding force. The binding force of the gold-plating plating layer and a high silicon-aluminum base material adopted by the method provided by the invention is firm and reaches the standard of appendix A of GJB1420 General Specification of Semiconductor Integrated Circuit Shell.

The invention discloses a Light-Emitting Diode (LED) high heat conduction ceramic bonding copper heat dissipation circuit board characterized in that a copper foil is compounded on both sides of a ceramic chip, a copper-aluminum spinelle eutectic interface is between the copper foil and the ceramic substrate; a circuit formed by two faces of copper foils of the ceramic substrate are interconnected and guided through a sintered via hole. The invention employs the process principle that the low temperature thermal oxidized copper foil and the ceramic can form the eutectic interface. At 1060 DEG C-1080 DEG C, the copper and an oxide film form a trace amount of copper-cuprous oxide eutectic liquid phase. The eutectic liquid phase and aluminum, magnesium, zirconium and oxygen elements in the ceramic form the copper-aluminum spinelle eutectic interface and the copper foil and the ceramic substrate form a firm compound structure. The invention has excellent performance of high heat conduction, strong conduction ability, high adhesive force and low interconnection via hole resistance, and obviously improves the operation life and reliability by applying to the LED chip package.

The invention relates to a high-density phase change memory cell structure, a 3D circuit design layout and the manufacture process of phase change random access memory (PCRAM) chip. The invention can achieve a high-density memory array of the PCRAM chip by arranging a peripheral circuit based on CMOS (complementary metal oxide semiconductor) process below the memory array by the 3D layout design, wherein the peripheral circuit chip is planarized by CMP (chemical mechanical polishing) process. A P- or N-type silicon wafer is subjected to epitaxial technology to form an N/P (or P/N) junction, and the silicon wafer is bonded with a CMOS silicon wafer at low temperature by an alignment device. An integrated N/P (or P/N) junction on the CMOS wafer can be achieved by employing wafer stripping or back-thinning technology, a reversible phase change resistor is then prepared by the integral N/P (or P/N) junction and interconnected with the junction through copper, and the common package technology is adopted to achieve the entire chip, thus integrally achieving the three-dimensional 1R1D chip structure.

The invention relates to a pressure sintering furnace used for producing hard alloys. The pressure sintering furnace comprises a furnace shell, a vacuum system, an air distribution system, a heating and thermal-insulating device, a compression system, a cooling system and a decompression device. The pressure sintering furnace is characterized in that the furnace shell is a horizontal cylinder provided with a double-wall water jacket, the furnace door on the furnace shell has a quick-opening hydraulic side-rotating structure, the furnace door of the furnace shell comprises a thermal-insulating door on the external layer of the furnace and a graphite door on the internal side of the furnace, the opening of the furnace door is controlled by a hydraulic locking device with a door-closing air cylinder, the door-closing air cylinder is provided with an elastic coupling device, and the thermal-insulating door of the furnace door is a boss thermal-insulating door. The pressure sintering furnace has stable performance and low cost and safety production can be realized by using the pressure sintering furnace, thus the uniformity of temperature field distribution in the furnace can be effectively improved and the qualification rate of products can be more than 90%.

The invention discloses water-based paper and plastic laminating/peelable adhesive and a method for manufacturing the same. The water-based paper and plastic laminating/peelable adhesive comprises, by mass, 35-45 parts of wax emulsion, 45-55 parts of water-based polyurethane emulsion, 1-20 parts of tackifying resin, 1-5 parts of additives, 1-5 parts of coupling agents, 0.2-0.5 part of defoamers and 0.2-0.5 part of thickeners. The water-based paper and plastic laminating/peelable adhesive and the method have the advantages that the wax emulsion, the water-based polyurethane emulsion, the additives, the tackifying resin, the coupling agents, the thickeners and the defoamers are compounded with one another to finally manufacture the water-based paper and plastic laminating/peelable adhesive, the water-based paper and plastic laminating/peelable adhesive is high-temperature-resistant and is high in initial adhesion, permanent adhesion and peel strength when used for laminating paper and plastics, the paper cannot be torn by an adhesion surface of a film when separated from the plastics, and is prevented from being damaged, and the adhesion surface is not sticky after the paper is separated from the plastics.

The invention relates to a bath solution preparing method and a low-concentration weakly alkaline cyanide-free copper plating which can ensure that the bonding force exists between a plating layer and a matrix, the plating solution has best stability, better dispersing capacity and deep plating capacity and simple process maintenance. The low-concentration weakly alkaline cyanide-free copper plating comprises a main salt, a conductive salt, a main complexing agent and a secondary complexing agent, wherein the main salt is copper chloride, the conductive salt comprises a mixture of sodium chloride, potassium chloride and ammonium chloride, the main complexing agent is a mixture of tartrate, citrate, nitrilotris(methylene)]tris-phosphonic acid salt, (1-Hydroxyethylidene)bis-phosphonic acid tetrasodium salt and ethylenediamine tetra(methylenephosphonic acid) salt; and the secondary complexing agent is a mixture of ortho-hydroxybenzoic acid, succinimide and derivatives thereof and dimethyl hydantoin. The invention has the advantages of capability of ensuring the bonding force of the plating and the matrix, best stability and better dispersing capacity and deep plating capacity and simple process maintenance.

The invention relates to a technology for electroplating quaternary alloy at the inner surface of a bearing, comprising the steps of ultrasonic oil removal, chemical oil removal, electrochemical oil removal, electrolysis pickling, pickling, electronickelling of grid, recovery, electroplating of Pb-Sn-Cu alloy, electroplating of indium layer; washing with hot water, drying, heat diffusion treatment, etc., the bearing quaternary alloy formed by four metallic chemical elements including lead, tin, copper and indium has firm bonding with substrate, good fatigue strength, carrying capacity and abrasive resistance, long service life, strong corrosive resistance and surface performance and high added value, and is widely used as a surface treatment technology for the bearing on aircraft engine, high-performance car, ship and heavy-duty vehicle engine.

Production equipment and a method of a self-adhesive layer band. A base material is treated by a base material unfolding machine, a head-tail-overlapping machine, a base material buffering adjusting bracket and a base material dryer successively, enters into a gluing pool for gluing, then enters a dryer for drying; the dried base material is rolled with an isolated film on a surface thereof by a mulch applicator, cooled by a self-adhesive layer buffering adjusting bracket and adjusted by an automatic error correcting controller; then the base material can be packaged by a product winder and finally cut into dimensions required by production specifications by a cutting machine. After gluing, the base material is dried and returns to the gluing pool for a second gluing; and base material enters into the dryer again for drying after the second gluing, so as to increase peeling intensity of a self-adhesive waterproof coiled material and bonding strength of the material with a base, accelerate drying speed and increase product quality. According to the invention, base material treatment, gluing, drying, coating, cooling, rolling and packaging can be finished in a line, so as to realizeflexible operation, high degree of automation and good product quality.

The invention discloses a catalyst for Fischer-Tropsch synthesis by using heteroatom hybridization mesoporous carbon to load cobalt base. The catalyst is characterized by comprising the following materials in percentage by weight: 10-20% of metal cobalt and 80-90% of heteroatom hybridization mesoporous carbon carrier. The catalyst disclosed by the invention has the advantages of high activity and good stability.

The invention discloses a multilayer circuit board and a manufacturing method thereof, relating to the technical field of multilayer circuit board manufacturing and aiming to improve the quality of multilayer circuit boards. The multilayer circuit board comprises multiple circuit layers overlapping with each other, wherein an insulating layer is arranged between two adjacent circuit layers; each circuit layer comprises a power wire layer, a ground wire layer and a signal wire layer; the insulating layers comprise at least a resin slice insulating layer and at least a prepreg insulating layer containing glass fiber cloths; the wiring density of the signal wire layer is greater than that of the power wire layer and/or the ground wire layer; and the resin slice insulating layer is arranged adjacent to the signal wire layer. The manufacturing method can be used for manufacturing the multilayer circuit board.

The invention relates to a combined method for producing an abrasive cloth flap disc automatically, aiming at overcoming the defects of low production efficiency and unstable product quality in the prior art. The technical scheme is as follows: an adopted device comprises a main rotating disc, a glue applying system, a pallet loading rotating disc, an abrasive cloth flap disc loading rotating disc, a supporting cover loading rotating disc, a manipulator I, a manipulator II, a material conveying mechanism, a piece planting device, a cutting device, a shaping device, a thickness measuring mechanism and a control system for controlling the operation of all the devices; when workers install a supporting cover and a pallet on the supporting cover loading rotating disc and the pallet loading rotating disc, the pallet is grabbed by the manipulator I and the manipulator II and is placed on the corresponding work station on the main rotating disc; and after thickness measurement, glue applying, piece planting, primary shaping and secondary shaping of the pallet are finished in sequence on the main rotating disc, the pallet is grabbed by the manipulators and is placed on the abrasive cloth flap disc loading rotating disc, so that rod penetration is finished. The combined method is mainly applied in automatic production of the abrasive cloth flap disc.

The invention discloses an electroplating method for electrically depositing Ni-Co-B alloy coatings on continuous casting crystallizer copper plates and belongs to the technical field of electroplating. An electroplating solution used by the method comprises the following components according to mass concentration: 170-350g/L of nickel salt, 5-50g/L of cobalt salt, 0.5-4g/L of sodium borohydride,20-60g/L of ethylenediamine and 30-50g/L of buffering agents. The Ni-Co-B alloy coatings prepared from the electroplating solution have high throwing power and excellent corrosion resistance performance; the micro hardness of the Ni-Co-B alloy coatings can reach 1000HV.

The invention discloses a production method of a double-sided flexible CCL (copper-clad plate). The production method comprises the following steps: (1) first copper foil, a first fluoropolymer film and a TPI (thermoplastic polyimide) film which are stacked sequentially are subjected to rolling pressing at a low temperature, and a first single-sided flexible CCL with a three-layer structure is obtained; (2) second copper foil and a second fluoropolymer film which are stacked sequentially are subjected to rolling pressing at a low temperature, and a second single-sided flexible CCL with a two-layer structure is obtained; (3) the first single-sided flexible CCL and the second single-sided flexible CCL are subjected to rolling pressing at a high temperature, and the double-sided flexible CCL is obtained, wherein the second fluoropolymer film is arranged on the TPI film. The double-sided flexible CCL obtained with the method has lower dielectric constant and dielectric loss, good heat resistance and excellent mechanical property. The invention further discloses the double-sided flexible CCL produced with the method.

The invention discloses a production method of non heat seal teabag paper. Final products can be obtained through a surface sizing process or a coating process in the existing production method of the non heat seal teabag paper, and a plurality of adhesives and additives are needed to add. The production method includes subjecting plant fibers to special processing, and reserving the length of fibers as far as possible during fully fibrillation; and adding appropriate thermosetting type reinforcing agent into the fiber after the special processing to obtain a body paper product through papermaking. The body paper product can be used directly without the surface sizing and the follow-up coating processing and can adapt to processing requirements for modern high-speed packing machines. According to the production method, the defect that final products can be obtained through the surface sizing or coating in the existing production method of the non heat seal teabag paper is overcome, the paper is formed once, the surface sizing or coating process is reduced, usage of chemical additives in the non heat seal teabag paper is reduced, obtained products are environment-friendly and good in processability, simultaneously, the production process is simplified, and the energy consumption and cost are reduced.

The invention discloses a copper steel composite material, an arc additive preparing method and application of the copper steel composite material and a tin bronze alloy. The composite material is composed of a copper alloy layer and a steel layer. The copper alloy layer is novel tin bronze and comprises the following components including, by weight percent, 5%-10% of Sn, 0.15%-0.35% of Al, 0.05%-0.2% of Si, smaller than 0.01% of Pb, smaller than 0.01% of Ni and the balance Cu. A preparing technology of the composite material includes the steps that firstly, casting of a novel tin bronze alloybar is conducted; secondly, the alloy bar is subjected to extruding and drawing technologies, and a wire with the diameter being 0.8 mm to 1.6 mm is prepared; and thirdly, the wire is arranged on thesurface of a steel plate in an arc additive manner, and the copper/steel composite material is obtained. The copper steel composite material is high in combination strength and has dendrite tissue which is compact, uniform and fine, and the wear reducing and resisting performance and the bearing performance are high.

The invention relates to a fluorescence detection method for trace tetracycline antibiotics. According to the method, by utilizing the combined action of tetracycline antibiotics molecules and the specificity of an aptamer thereof, an amplification action of a rolling ring amplification signal and high selection action of a graphene molecular beacon as well as combining a fluorescence spectrophotometer, the fluorescence signal of the graphene molecular beacon is obtained, so that quantitative detection of trace tetracycline antibiotics can be realized. According to the method, a plurality of defects of the prior art such as complexity in detection are overcome, the sensitivity and selectivity are improved, and a new method is provided for detection of other small molecule substances or pollutants.

The invention relates to an improved type conductive marmite and a manufacturing method thereof. The improved type conductive marmite is characterized by sequentially comprising a marmite body ceramic, a glaze and a conductive metal aluminum layer, wherein the conductive metal aluminum layer is positioned at an outer bottom; the marmite body ceramic (1) comprises the following components in percentage by weight: 20%-27% of Suzhou No.1 clay, 12%-17% of camwood knots, 3%-8% of Zhangzhou clay, 35%-43% of spodumene and the balance of Gangxi talcum; the glaze (2) comprises the following components in percentage by weight: 25%-35% of the spodumene, 30%-45% of magnesium oxide, 6%-12% of zinc oxide, 3%-7% of Suzhou No.1 clay, 5%-8% of tin oxide,, 8%-15% of silicon micropowder and the balance of self-made fusion cakes; and the conductive metal aluminum layer (4) is completely covered at the bottom of a marmite body. The manufacturing method comprises the following steps of: weighing materials according to the formula of the marmite body ceramic; and stirring, mixing, adding water, vacuumizing, forming, drying, glazing, and finally burning. The improved type conductive marmite disclosed by the invention is possible to be hopeful in large-scale application on an electromagnetic cooker and has a good market prospect.

The invention belongs to the technical field of power system new energy information management, and discloses a wind power plant centralized control center SCADA system based on a CIM model, and the system collects real-time data in a wind power plant, and stores the related data in a real-time database; stores description information and static information of a real-time database, and performs information management; storeshistorical data. The loading method of the real-time database comprises the step of loading the information of the real-time database by reading the related information ofthe database and the relationship among the databases. The wind power plant CIM modeling method is adopted, the wind power plant CIM model is established into the corresponding database model, fusionof the wind power plant and system power system resources is achieved, and analysis and calculation of a wind turbine generator are achieved. According to the invention, weight calculation is carriedout on parameters of the variable pitch system, and convenience is provided for fault diagnosis. Meanwhile, the wind power is predicted according to historical data and weather forecast, and the prediction result is relatively accurate.

The invention relates to a preparation method of nano magnetic particles for detection and treatment of coronary heart diseases, which comprises the following steps: A, mixing transition layer molecules on the surfaces of magnetic nuclei, wherein the transition layer molecule are compounds which simultaneously contain amino groups, carboxyl groups or hydrosulfide groups and groups capable of reacting with hydroxyl groups; B, on the magnetic nuclei fixed with the transition layer molecules, fixing functional molecules capable of prolonging the residence time of nano particles in blood; and C, on the magnetic nuclei fixed with functional molecules, fixing specific recognition ligands of endothelial progenitor cells or diseased endothelial cells, thus obtaining the nano magnetic particles. The method can be used for preparing magnetic nano particles for early-stage detection and location of diseased endothelial cells of coronary heart diseases, and the detection is sensitive and reliable; the method can be also used for preparing magnetic nano particles for mid-late-stage treatment of coronary heart diseases; and good repairing and treatment effects on coronary heart diseases can be achieved.

The invention relates to a method for tucking an end (23) of a weft thread (19) into a selvedge (27) of a fabric (3) by means of a pneumatic tuck-in device (5) which blows an end (23) of an inserted and beaten up weft thread (19) extending past a selvedge (27) of the fabric (3) into a subsequent shed (1), whereby the tuck-in device (5) is moved back and forth along the selvedge (27) of the fabric(3) in synchronization with the reed (13) and blows in of this end (23) of the beaten-up weft thread (19) into a shed (1) while the tuck-in device (5) moves back and forth along the selvedge of the fabric.

The invention is applicable to the technical field of inorganic nano film materials and provides a preparation method of a molybdenum disulfide film, comprising: using a substrate of sapphire, and growing an MoS2 film on a surface of the substrate by means of CVD (chemical vapor deposition); the process of growing the MoS2 film includes: using sulfur powder and MoO3 as materials and high-purity argon as a carrier gas, depositing the MoS2 film on the substrate. The invention further provides the molybdenum disulfide film prepared by the method. According to the molybdenum disulfide film and the preparation method thereof provided by the invention, the molybdenum sulfide material used is highly bondable with the substrate material sapphire, the quality of the obtained MoS2 film is very high, and the requirements of the electronics field and optical field for the quality of nano film materials can be met.