Multilayer circuit board and manufacturing method thereof

Abstract

The invention discloses a multilayer circuit board and a manufacturing method thereof, relating to the technical field of multilayer circuit board manufacturing and aiming to improve the quality of multilayer circuit boards. The multilayer circuit board comprises multiple circuit layers overlapping with each other, wherein an insulating layer is arranged between two adjacent circuit layers; each circuit layer comprises a power wire layer, a ground wire layer and a signal wire layer; the insulating layers comprise at least a resin slice insulating layer and at least a prepreg insulating layer containing glass fiber cloths; the wiring density of the signal wire layer is greater than that of the power wire layer and / or the ground wire layer; and the resin slice insulating layer is arranged adjacent to the signal wire layer. The manufacturing method can be used for manufacturing the multilayer circuit board.

Description

technical field [0001] The invention relates to the field of manufacturing multilayer circuit boards, in particular to a multilayer circuit board and a manufacturing method thereof. Background technique [0002] Multi-layer circuit board is the product of the development of electronic technology in the direction of high speed, multi-function, large capacity and small volume. A multilayer circuit board generally includes more than two circuit layers, wherein the wiring density on the outer or sub-outer circuit layer is generally higher, and the wiring density on the inner circuit layer is relatively small. An insulating layer is provided between two adjacent circuit layers, and circuit layers of different layers can be connected through conductive columns. In a multi-layer circuit board, the insulating layer is also called a dielectric layer. At present, most of the materials used to make the insulating layer are prepreg materials containing glass fiber cloth. [0003] In t...

AI Technical Summary

Problems solved by technology

However, when the wiring density of one or more circuit layers in the manufactured multilayer circuit board is very high, the exposed glass fiber on the prepreg insulation layer will have a greater impact on the bonding force of the circuit layer established on it, thus The reliability of the prepreg insulation layer retaining the circuit layer is reduced, which in turn reduces the quality of the multilayer circuit board

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