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Manufacturing method of copper-aluminum composite board

A copper-aluminum clad plate and manufacturing method technology, applied in the direction of roll speed control, temperature control, metal rolling, etc., can solve the problems of low copper-aluminum bonding strength, danger, complicated process, etc., to avoid surface oxidation and increase surface activity. energy effect

Inactive Publication Date: 2009-10-21
上海新东蒸发器有限公司
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AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of complex or dangerous process, high cost, and low copper-aluminum bonding strength in the prior art, the purpose of the present invention is to provide a method for manufacturing copper-aluminum composite panels to achieve low-cost, high-quality, mass production Copper-aluminum composite panel

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  • Manufacturing method of copper-aluminum composite board
  • Manufacturing method of copper-aluminum composite board

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Embodiment Construction

[0017] Preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings.

[0018] The invention discloses a method for manufacturing a copper-aluminum composite panel. The method comprises the following steps:

[0019] Step 1, pre-processing;

[0020] Hang the soft pure copper plate of δ0.7×430×360 on the pre-treatment line for degreasing and degreasing treatment; including: degreasing tank-hot water tank-cold water tank-neutralization tank-cold water tank-drying tunnel Dry process processing.

[0021] Put the soft pure aluminum plate of δ3.0×430×360 into a box furnace, heat it to 350-420 degrees, and carry out degreasing treatment for half an hour.

[0022] Raw materials used in this embodiment: industrial pure copper plate (soft state) with Cu≥99.9%, industrial pure plate (soft state) with Al≥99.6%. According to the different thickness of the required product, the thickness of the raw material is selected: copper Cu is 0...

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Abstract

The invention discloses a manufacturing method of a copper-aluminum composite board, comprising the following steps: 1. removing oil for preliminary treatment; 2. grinding a junction surface; 3. heating an aluminum board, not heating a copper board and performing inreversible and isodromic rolling in one pass; 4. adopting a common leveler with fifteen rollers to carry out twice leveling; and 5. cutting to form into finished products. The invention solves the problem that the bonding strength of copper and aluminum is lower and achieves the beneficial effects of producing the high-quality copper-aluminum composite boards in batch with low cost.

Description

technical field [0001] The invention relates to a method for manufacturing a multilayer metal composite board, in particular to a method for manufacturing a copper-aluminum composite board. Background technique [0002] As more and more aluminum materials replace copper materials in power system equipment, there are many copper-aluminum contacts. Corrosion of these copper-aluminum contact positions leads to bad conditions such as poor contact, heat generation, sparking, and increased resistance. This increases the number of repairs, affects the safe operation of the equipment, and even causes equipment accidents. Copper-aluminum transition joints can effectively solve these problems. Because the copper-aluminum transition joint is metallurgically bonded inside, the performance is very stable. At the same time, our country is relatively short of copper resources, so it is of great practical significance to develop a new method to prepare copper-aluminum composite panels. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P17/04B21B1/38B21D1/02B21B37/46B21B37/48B21B37/74
Inventor 赵子军杨启胜沈伟民刁玉萍
Owner 上海新东蒸发器有限公司
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