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LED high heat conduction ceramic copper coating heat radiation circuit board

A technology of high thermal conductivity ceramics and circuit boards. It is applied in the manufacture of circuits, printed circuits, and printed circuits. It can solve the problems of large differences in thermal expansion coefficients between chips and substrate materials, poor thermal conductivity, and poor welding reliability. It achieves interconnected via resistance. Low, strong electrical conductivity, improved working life and reliability

Inactive Publication Date: 2009-07-15
宋立峰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the above-mentioned deficiencies in the prior art, and provide a LED ceramic copper-clad heat dissipation circuit board, which solves the problems of large differences in thermal expansion coefficient between the chip and the substrate material, poor welding reliability, and poor thermal conductivity when the LED chip is packaged with a metal substrate. question

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] An LED ceramic copper-clad heat dissipation circuit board of the present invention is compounded with copper foil on both sides of the ceramic sheet, and there is a copper-aluminum spinel eutectic interface between the copper foil and the ceramic substrate, and the circuit formed by the copper foil on both sides of the ceramic substrate passes through sintering The formed via holes are interconnected and conducted. Its manufacturing process embodiment 1 is as follows:

[0019] (1) Heat the 20-micron copper foil with hot air at 200°C for 10 minutes to form a uniform and dense oxide film on the surface of the copper foil, and then cool it for later use;

[0020] (2) Place the side of the copper foil with the oxide film down on the ceramic substrate, and the ceramic substrate must be cleaned and dried by ultrasonic waves in advance;

[0021] (3) Sintering, using nitrogen to protect the mesh belt sintering furnace, the initial heating temperature of the heating section is ...

Embodiment 2

[0025] Its manufacturing process embodiment 2 is as follows:

[0026] (1) Heat the 80-micron copper foil with hot air at 350°C for 6 minutes to form a uniform and dense oxide film on the surface of the copper foil, then cool it down for later use.

[0027] (2) Place the side of the copper foil with the oxide film down on the ceramic substrate, and the ceramic substrate must be cleaned and dried by ultrasonic waves in advance;

[0028] (3) Sintering, using nitrogen to protect the mesh belt sintering furnace, the initial heating temperature of the heating section is 300°C, the peak temperature reaches 1080°C, the sintering cycle is 45-70 minutes, and the oxygen content in the furnace is 30-200ppm;

[0029] (4) Etch the circuit pattern, and process the conductor circuit according to the PCB process;

[0030] (5) Laser processing ceramic through holes, laser shape and through hole processing with small holes;

[0031] (6) Make interconnection vias with copper thick film paste. ...

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Abstract

The invention discloses a Light-Emitting Diode (LED) high heat conduction ceramic bonding copper heat dissipation circuit board characterized in that a copper foil is compounded on both sides of a ceramic chip, a copper-aluminum spinelle eutectic interface is between the copper foil and the ceramic substrate; a circuit formed by two faces of copper foils of the ceramic substrate are interconnected and guided through a sintered via hole. The invention employs the process principle that the low temperature thermal oxidized copper foil and the ceramic can form the eutectic interface. At 1060 DEG C-1080 DEG C, the copper and an oxide film form a trace amount of copper-cuprous oxide eutectic liquid phase. The eutectic liquid phase and aluminum, magnesium, zirconium and oxygen elements in the ceramic form the copper-aluminum spinelle eutectic interface and the copper foil and the ceramic substrate form a firm compound structure. The invention has excellent performance of high heat conduction, strong conduction ability, high adhesive force and low interconnection via hole resistance, and obviously improves the operation life and reliability by applying to the LED chip package.

Description

Technical field [0001] The invention belongs to electronic devices, in particular to a high thermal conductivity ceramic heat dissipation substrate formed by metallization of LED ceramic circuit boards. Background technique [0002] In the prior art, when high-power LED chips are packaged, the thermal conductivity of the substrate, the linear expansion coefficient, and the adhesion strength of the conductor pattern have a great impact on the quality, life, and reliability of the product. At present, commonly used aluminum substrates, pcb boards, etc. cannot meet the requirements of high-quality LEDs, and there are ceramic circuit boards manufactured by thin film and thick film technology, because it mainly uses a printing process to print a layer of silver-palladium alloy paste on the ceramic surface. material, and then sintered at a low temperature below 500°C, resulting in poor bonding, poor solderability, and poor electrical and thermal conductivity. Contents of the inv...

Claims

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Application Information

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IPC IPC(8): H01L33/00H05K1/00H05K3/00H05K7/20
Inventor 宋立峰陈玉胜高相起
Owner 宋立峰
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