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Novel environment-friendly soldering flux for low-silver SnAgCu unleaded soldering paste

A lead-free solder paste, environmentally friendly technology, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., to achieve good activity, long storage and service life, and less residue after welding

Inactive Publication Date: 2009-10-28
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, there are few domestic researches on flux suitable for low-silver SnAgCu lead-free solder paste. The present invention aims at the preparation of low-silver SnAgCu lead-free solder paste and develops a new type of rosin-type halogen-free no-clean flux.

Method used

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  • Novel environment-friendly soldering flux for low-silver SnAgCu unleaded soldering paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The active agents selected are succinic acid, salicylic acid and DL-malic acid, the solvent is glycerol and diethylene glycol monoethyl ether, the corrosion inhibitor is triethylamine, the thixotropic agent is hydrogenated castor oil, and the ointment is polyethylene glycol. Ethylene glycol 1000, the stabilizer is paraffin, the surfactant is octylphenol polyoxyethylene ether, and the modified rosin is polymerized rosin and hydrogenated rosin; the mass percentage (wt %) of each component is:

[0031] Succinic acid 1.5

[0032] Salicylic acid 1.5

[0033] DL-Malic Acid 2.0

[0034] Glycerol 14.0

[0035] Diethylene glycol monoethyl ether 18.0

[0036] Triethylamine 0.8

[0037] Hydrogenated castor oil 4.2

[0038] Polyethylene glycol 1000 6.0

[0039] Paraffin 2.5

[0040] Octylphenol ethoxylate 3.5

[0041] polymerized rosin 24.0

[0042] Hydrogenated rosin 22.0

Embodiment 2

[0044] The active agents selected are glutaric acid, salicylic acid and citric acid, the solvents are diethylene glycol and diethylene glycol monobutyl ether, the corrosion inhibitor is triethanolamine, the thixotropic agent is hydrogenated castor oil, and the ointment is polyethylene glycol. Alcohol 1000, stabilizer is paraffin, surfactant is octylphenol polyoxyethylene ether, and modified rosin is polymerized rosin and water-white rosin; the mass percentage (wt %) of each component is:

[0045] Glutaric acid 2.0

[0046] Salicylic acid 2.5

[0047] Citric acid 3.0

[0048] Diethylene glycol 18.0

[0049] Diethylene glycol monobutyl ether 18.0

[0050] Triethanolamine 1.5

[0051] Hydrogenated Castor Oil 1.0

[0052] Polyethylene glycol 1000 4.4

[0053] Paraffin 0.3

[0054]Octylphenol ethoxylate 1.3

[0055] polymerized rosin 24.0

[0056] Water white rosin 24.0

Embodiment 3

[0058] The active agents selected are adipic acid, succinic acid and DL-malic acid, the solvents are glycerol and ethylene glycol monomethyl ether, the corrosion inhibitors are triethylamine and triethanolamine, and the thixotropic agent is hydrogenated castor oil. The ointment is polyethylene glycol 2000, the stabilizer is paraffin, the surfactant is isooctylphenol polyoxyethylene ether, and the modified rosin is perhydrogenated rosin and water-white rosin; the mass percentage (wt%) of each component for:

[0059] Adipic acid 1.5

[0060] Succinic acid 3.0

[0061] DL-malic acid 4.5

[0062] Glycerol 16.0

[0063] Ethylene glycol monomethyl ether 20.0

[0064] Triethylamine 3.0

[0065] Triethanolamine 2.0

[0066] Hydrogenated Castor Oil 6.0

[0067] Polyethylene glycol 2000 2.0

[0068] Paraffin 1.0

[0069] Isooctylphenol ethoxylate 1.0

[0070] Fully hydrogenated rosin 20.0

[0071] Water white rosin 20.0

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Abstract

The invention relates to a novel environment-friendly soldering flux for low-silver SnAgCu unleaded soldering paste, belonging to the field of unleaded solder soldering flux. The invention aims at providing a soldering flux suitable for the low-silver SnAgCu unleaded soldering paste. The soldering flux comprises the following components: 5.0-13.0% of activator, 32.0-41.0% of solvent, 0.8-5.0% of corrosion inhibitors, 1.0-6.0% of thixotropic agent, 2.0 -9.0% of paste forming agent, 0.3-2.5% of stabilizer, 0.5-5.0% of surfactant and 35.0-48.0% of modified rosin. The activator is the compound of a plurality of organic acids, has wide boiling point distribution space, can achieve good activation effect in the whole soldering process, can be mostly volatilized, sublimated or decomposed at the brazing temperature and ensures no corrosion after the soldering. The soldering flux has the advantages of no halogen content, good soldering aiding property, few and hard-film-shaped residuals after the soldering, high insulation resistance, and the like.

Description

technical field [0001] The invention belongs to the field of lead-free solder flux, in particular to a flux, in particular to a flux suitable for low-silver SnAgCu lead-free solder paste. Background technique [0002] In recent years, the lead-free requirements of electronic packaging and surface mount technology have promoted the rapid development of lead-free solder research. Among the many researched lead-free solders, SnAgCu solder is regarded as one of the ideal substitutes for SnPb solder because of its better comprehensive properties. However, due to the large melting temperature range of the low-silver SnAgCu lead-free solder alloy, the melting point is high and deviates from the eutectic point, which increases the brazing temperature and poses a greater challenge to the reflow soldering process. Therefore, lead-free soldering also puts forward higher requirements on the performance of the flux. Changes in the chemical composition of the solder paste at higher proc...

Claims

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Application Information

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IPC IPC(8): B23K35/363
Inventor 雷永平祝蕾林健夏志东杨晓军郭福史耀武符寒光
Owner BEIJING UNIV OF TECH
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