Soldering process

A brazing method and soldering technology, applied in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of high process conditions, high working temperature, and high equipment requirements, and achieve high quality and less welding defects. , the effect of high reliability

Active Publication Date: 2007-06-27
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method can realize the reliable connection of copper plate and aluminum plate, but it needs high temperature insulation in vacuum state, has the disadvantages of high process conditions and high working temperature, and at the same time has high requirements for equipment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Brazing between a copper plate with a diameter of Φ320mm and a groove depth of 4mm and a high-purity aluminum target with a diameter of Φ319mm and a thickness of 16.3mm, where the material of the aluminum target is AL-1%Si-0.5%Cu.

[0020] Prepare the solder bar before the brazing operation, use the solder bar with the composition of SN-Pb-Ag, the proportion of Ag is 0.2%, and the temperature of the welding device is raised to 270 °C.

[0021] The first step is to prepare the welding process of the copper backplane before welding. The copper backplane should be fully polished with #180 or #230 sandpaper on its joint surface to remove the anti-rust material. The oil and other impurities on the joint surface need to be dipped in alcohol cloth to erase.

[0022] The second step is to preheat and solder the copper backplane. The copper backplane is heated on the electric heating plate, and the temperature of the copper backplane is measured with a surface thermometer, and t...

Embodiment 2

[0027] Brazing between a copper plate with a diameter of Φ320mm and a groove depth of 4mm and a high-purity aluminum target with a diameter of Φ319mm and a thickness of 16.3mm, where the material of the aluminum target is AL-1%Si-0.5%Cu.

[0028] Prepare the solder bar before the brazing operation, use the solder bar with the composition of SN-Pb-Ag, the proportion of Ag is 0.2%, and the temperature of the welding device is raised to 300 °C.

[0029] The first step is to prepare the welding process of the copper backplane before welding. The copper backplane should be fully polished with #180 or #230 sandpaper on its joint surface to remove the anti-rust material. The oil and other impurities on the joint surface need to be dipped in alcohol cloth to erase.

[0030] The second step is to preheat and solder the copper backplane. The copper backplane is heated on the electric heating plate, and the temperature of the copper backplane is measured with a surface thermometer, and t...

Embodiment 3

[0035] Brazing between a copper plate with a diameter of Φ320mm and a groove depth of 4mm and a high-purity aluminum target with a diameter of Φ319mm and a thickness of 16.3mm, where the material of the aluminum target is AL-1%Si-0.5%Cu.

[0036] Prepare the solder bar before the brazing operation, use the solder bar with the composition of SN-Pb-Ag, the proportion of Ag is 0.2%, and the temperature of the welding device is raised to 250 °C.

[0037] The first step is to prepare the welding process of the copper backplane before welding. The copper backplane should be fully polished with #180 or #230 sandpaper on its joint surface to remove the anti-rust material. The oil and other impurities on the joint surface need to be dipped in alcohol cloth to erase.

[0038] The second step is to preheat and solder the copper backplane. The copper backplane is heated on the electric heating plate, and the temperature of the copper backplane is measured with a surface thermometer, and the...

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PUM

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Abstract

The brazing process includes the following steps: preparing the copper back board, pre-heating the copper back board and soldering tin, pre-heating the aluminum target and soldering tin, combining copper back board and the aluminum target, and maintaining pressure and circular cooling water. Thus brazed hetero metal assembly has excellent heat transferring performance and sufficient mechanical binding strength, and the brazing process is simple, practical and reliable.

Description

technical field [0001] The invention relates to a welding method, in particular to a brazing method suitable for welding large-area dissimilar metals. Background technique [0002] In the field of sputtering targets, the welding structure of ultra-high-purity aluminum targets and copper backplanes is widely used because of its good thermal conductivity and high mechanical bonding strength. However, copper, aluminum and its aluminum alloy materials have high thermal conductivity, narrow plastic temperature zone, and poor metallurgical compatibility between copper and aluminum, especially aluminum is easy to oxidize during the welding process and forms an oxide film on the surface. The reason makes the reliability welding of copper and aluminum materials more difficult. In particular, the welded joints of copper and aluminum materials are prone to inhomogeneity in structure and performance, many welding defects, and high tensile residual stress, which often make the welded jo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/00B23K1/20B23K1/06B23K1/19B23K35/26
Inventor 姚力军潘杰
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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