Low-silver lead-free soft solder

A soft solder, solder technology, applied in welding/cutting medium/material, welding medium, metal processing equipment, etc., can solve the problems of poor oxidation resistance, high melting point, low tensile strength, etc., and achieve strong oxidation resistance , the effect of good comprehensive performance and low cost

Inactive Publication Date: 2012-10-03
ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention aims to solve the current low-silver lead-free solders with high melting point, low tensile strength, poor oxidation resistance, etc., and therefore provides a moderate melting point, low cost, good oxidation resistance, good mechanical properties, and moistening properties of the present invention. Low-silver lead-free solder with good wettability and low copper melting rate to facilitate practical and industrialization

Method used

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  • Low-silver lead-free soft solder

Examples

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Embodiment Construction

[0026] Lead-free solder of the present invention is based on its weight, and contained component and its content are provided by the embodiment of table 1, and test the tensile strength of embodiment and comparative example, melting point, extension rate and oxidation resistance performance.

[0027] The percentage components in the examples are fed in the form of master alloys, and Sn-Cu master alloys, Sn-Ag master alloys, Sn-Bi master alloys, Sn-Ni master alloys and Sn ingots are put into vacuum melting in proportion Furnace or non-vacuum melting furnace, melting at about 500°C for 0.5-1h, then adding Sn-P master alloy and Sn-X master alloy into the melting furnace, fully stirring, casting and solidifying to obtain solder alloy, which can also be processed into Solder bar, solder bar, solder wire, solder tab, solder ball, solder powder or solder paste.

[0028] Table 1 embodiment and comparative example technical index

[0029]

[0030] Note: ① The results in Table 1 ar...

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Abstract

The invention discloses a low-silver lead-free soft solder, which is moderate in melting point, strong in tensile strength and low in cost. Based on the total weight of the solder, the solder contains 0.1 to 0.7 weight percent of Ag, 0.1 to 1.0 weight percent of Cu, 0.01 to 5 weight percent of Bi, 0.01 to 3 weight percent of Sb, 0 to 0.5 weight percent of Ni, 0.001 to 0.1 weight percent of P, 0.001 to 0.1 weight percent of X and the balance of Sn, wherein X is any one or combination of Ga, Ge and misch metal. The low-silver lead-free soft solder is applied to wave soldering, reflow soldering and manual soldering in the field of electronic and microelectronic packaging.

Description

technical field [0001] The invention relates to a lead-free solder, which is especially suitable for wave soldering, reflow soldering and manual soldering in the field of electronic and microelectronic packaging. Background technique [0002] In order to meet the non-toxic and harmless requirements of electronic information products, lead-free solder has been widely used in the electronics and microelectronics industries in recent years. Among them, Sn(3.0-3.9)Ag(0.5-0.7)Cu lead-free solder with high silver content has been promoted in the industry because of its good comprehensive mechanical properties and process properties. However, with the in-depth implementation and advancement of green lead-free, the electronics industry has found that consumer electronics products are vulnerable to unexpected bumps, vibrations, collisions and drops during transportation and service, which introduce mechanical shocks in electronic assembly and interconnection. A new failure mechanism...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
Inventor 刘平顾小龙杨倡进钟海峰
Owner ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL
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