The invention discloses a high-efficiency
cutting method for
crystalline silicon blocks in the field of
solar energy application. The high-efficiency
cutting method comprises the following steps of 1)
diamond wire and
cutting liquid selection, wherein a single-polycrystalline mixed sand
electroplating diamond wire (the
diamond wire
diameter ranges from 50 micrometers to 70 micrometers is adopted,the
cutting fluid is selected from a low COD
coolant and pure water mixture; 2) guide wheel
processing; 3) process parameter setting, wherein the diamond wire, the
cutting fluid and a guide wheel arematched, after a cutting
machine is assembled, the feeding speed of the working table is adjusted to be 800-3000micrometers per minute, the
cutting fluid process flow is 110-180 KG / Min, the cutting liquid
cooling temperature is 17-23 DEG C; 4) automatic cutting, wherein after the
machine is started for
warming up by 5-10 minutes, when it is known that the parameters are normal through spot check,automatic cutting starts; and 5) ending of cutting, wherein a rod is lifted to complete
silicon block cutting. The high-efficiency cutting method effectively improves the cutting speed and the cuttingefficiency, improves the
yield rate, reduces the cost of auxiliary materials like the diamond wire consumption, improves the slice profitability, and can be used for
silicon wafer production.