The invention discloses a high-efficiency 
cutting method for 
crystalline silicon blocks in the field of 
solar energy application. The high-efficiency 
cutting method comprises the following steps of 1)
diamond wire and 
cutting liquid selection, wherein a single-polycrystalline mixed sand 
electroplating diamond wire (the 
diamond wire 
diameter ranges from 50 micrometers to 70 micrometers is adopted,the 
cutting fluid is selected from a low COD 
coolant and pure water mixture; 2) guide wheel 
processing; 3) process parameter setting, wherein the diamond wire, the 
cutting fluid and a guide wheel arematched, after a cutting 
machine is assembled, the feeding speed of the working table is adjusted to be 800-3000micrometers per minute, the 
cutting fluid process flow is 110-180 KG / Min, the cutting liquid 
cooling temperature is 17-23 DEG C; 4) automatic cutting, wherein after the 
machine is started for 
warming up by 5-10 minutes, when it is known that the parameters are normal through spot check,automatic cutting starts; and 5) ending of cutting, wherein a rod is lifted to complete 
silicon block cutting. The high-efficiency cutting method effectively improves the cutting speed and the cuttingefficiency, improves the 
yield rate, reduces the cost of auxiliary materials like the diamond wire consumption, improves the slice profitability, and can be used for 
silicon wafer production.