36results about How to "Improve bending durability" patented technology

For miniaturizing a power supply structure to absorb slack of a wire harness and improving bending durability, a continuous electric power supply device 1 includes a wire harness 3 formed to have a loop portion 4, an elastic member 6 along the loop portion 4, the elastic member energizing the loop portion to expand in a radial direction. The loop portion 4 and the elastic member 6 are disposed in a protector 2. The protector has a opening 13 for leading the harness and a guide portion 7 for supporting the loop portion 4 at a position opposite to the opening 13. The elastic member, flat spring 6 can have a length forming a loop shape to intersect itself.

A power-supply wiring device, which protects electric wires between a sliding and fixed structures, and absorbs wire length change by sliding motion of the sliding structure, and a harness layout structure with the power-supply wiring device are provided. The power-supply wiring device includes a first case 5 for receiving a wire harness 4 folded into a U-shape, a moving portion 7, a harness holding member 8 disposed rotatably at the moving portion 7, a second case 44 receiving the harness holding member 8 freely to be swung. In the harness layout structure, the first case 5 and the second case 44 are mounted respectively on the sliding structure and the fixed structure, and the harness holding member 8 connects between the fixed and sliding structures.

A cable includes an inclusion containing stranded wire conductor that includes a plurality of stranded wires formed by twisting a plurality of conductor wires, and a plurality of thin diameter inclusions having an external diameter thinner than that of each of the stranded wires. The inclusion containing stranded wire conductor is formed by together twisting a plurality of the stranded wires and a plurality of the thin diameter inclusions so as to allow one of the thin diameter inclusions to be located between adjacent stranded wires of a plurality of the stranded wires.

For miniaturizing a power supply structure to absorb slack of a wire harness and improving bending durability, a continuous electric power supply device 1 includes a wire harness 3 formed to have a loop portion 4, an elastic member 6 along the loop portion 4, the elastic member energizing the loop portion to expand in a radial direction. The loop portion 4 and the elastic member 6 are disposed in a protector 2. The protector has a opening 13 for leading the harness and a guide portion 7 for supporting the loop portion 4 at a position opposite to the opening 13. The elastic member, flat spring 6 can have a length forming a loop shape to intersect itself.

A shielded cable includes a core comprising an insulated wire including an inner conductor and an insulation layer formed on an outer periphery of the inner conductor, a shield layer formed on an outer periphery of the core, and a jacket layer formed on an outer periphery of the shield layer. The shield layer includes a stranded conductor shield layer including a stranded conductor spirally wound around the core, and the stranded conductor includes a plurality of conductor strands stranded together. The shield layer may further include a tinsel copper braided shield layer or a metal plated strand braided shield layer that is formed between the core and the stranded conductor shield layer.

A flexible display device includes a flexible display panel and a heat dissipating layer. The flexible display panel includes a bending region and a non-bending region. The heat dissipating layer includes a first heat dissipating sublayer and a second heat dissipating sublayer. The first heat dissipating sublayer is disposed on the non-bending region and the second heat dissipating sublayer is disposed on the first heat dissipating sublayer.

Provided are a flexible circuit board having enhanced bending durability and a method for preparing same. A method for preparing a flexible circuit board having enhanced bending durability, according to the present invention, comprises the steps of: (a) forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on the bottom side of the first dielectric body; (b) preparing a second dielectric body; (c) preparing a first bonding sheet and a first protective sheet which is connected to one end of the first boding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; (d) bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; (e) forming a via hole such that the first ground layer and second ground layer can be conducted; and (f) cutting in the width direction the second dielectric body placed on the first protective sheet.

A highly-flexible electric wire includes: a conductor; and an insulator layer covering the conductor and further includes a liquid lubricant interposed between the conductor and insulator layer. The lubricant contains at least one selected from the group consisting of polyethylene glycol, polypropylene glycol, and fluorine lubricants. Such a configuration enables the conductor and insulator layer to slide smoothly on each other, therefore increasing the flexibility.

A security laminate precursor comprising a plurality of lamellae and layers, wherein at least one of the outermost lamellae is an axially stretched linear polyester film and the security laminate precursor comprises a touch-detectable relief structure on a side of the security laminate precursor having as outermost lamella the axially stretched linear polyester film, the relief structure being associated with a viewable non-surface image which is a pattern made up of micro-perforations. A security laminate and a process for preparing a security laminate are also disclosed.

This invention relates to a polymer / inorganic multi-layer encapsulation film, and more particularly, to a multi-layer encapsulation film, which includes a plasma polymer thin film layer formed using a cross-shaped precursor having Si—O bonding and an inorganic thin film layer, and ensures flexibility and has improved encapsulation.

An optical transmission module has an optical transmission path in which optical transmission is performed between a first circuit board and a second circuit board disposed opposite the first circuit board. The optical transmission path has a folded structure having a bending radius. A circumferential portion drawn by the bending radius is provided substantially perpendicular to board surfaces of the first circuit board and the second circuit board.

The present invention provides a thin-film transistor and a fabrication method thereof, and an array substrate. The thin-film transistor includes a separation layer (5) arranged between the source electrode (4) and the drain electrode (6). An oxide semiconductor channel layer (7) is arranged on one side of the separation layer (5) and the drain electrode (6) to contact a portion of an upper surface of the drain electrode (6), a side surface of the drain electrode (6) and the organic separation layer (5), and a portion of an upper surface of the source electrode (4) to serve as a vertical channel, of which a channel length corresponds to a thickness of the separation layer (5). Varying the thickness of the separation layer to reduce the length of the vertical channel to a sub-micrometer order would greatly reduce the size of the thin-film transistor and reduce the area of a pixel. The vertical channel does not cause a short channel effect so as to improve electrical performance of the thin-film transistor. Using a multiple-layered hexagonal boron nitride film to make a moisture / oxygen barrier layer (2) and using a double-layered graphene film to make the source electrode (4) and the drain electrode (6) help significantly improve bending durability of the thin-film transistor.

A touch screen and a display device are provided. The touch screen includes a substrate, source and drain layers, a planarization layer, an anode layer, a pixel defining layer, and a touch electrode layer stacked in sequence. The touch screen further includes via holes, and the via hole includes a first via hole and a second via hole. The first via hole is defined on the planarization layer, the anode layer is electrically connected to the source and drain layer through the first via hole. The second via hole is defined on the pixel defining layer, and the touch electrode layer is connected to the anode layer through the second via hole.

A thermal conductive strip with a power supply terminal includes: a carbon fiber unit including a carbon fiber connecting end; a plastic envelope which encapsulates the carbon fiber unit and has a length smaller than a length of the carbon fiber connecting end, and further includes a broken portion which covers a part of the carbon fiber connecting end; and the power supply terminal sleeved onto the broken portion and the carbon fiber connecting end, and including a clamping section for clamping the broken portion, and an electrically conductive section for contacting the carbon fiber connecting end. The power supply terminal is partially clamped on the plastic envelope and partially eclectically connected to the carbon fiber, which improves the yield rate and the bending durability of the thermal conductive strip of the present invention.

A flexible display device includes a flexible display panel and a heat dissipating layer. The flexible display panel includes a bending region and a non-bending region. The heat dissipating layer includes a first heat dissipating sublayer and a second heat dissipating sublayer. The first heat dissipating sublayer is disposed on the non-bending region and the second heat dissipating sublayer is disposed on the first heat dissipating sublayer.

The present invention provides a thin-film transistor and a fabrication method thereof, and an array substrate. The thin-film transistor includes a separation layer (5) arranged between the source electrode (4) and the drain electrode (6). An oxide semiconductor channel layer (7) is arranged on one side of the separation layer (5) and the drain electrode (6) to contact a portion of an upper surface of the drain electrode (6), a side surface of the drain electrode (6) and the organic separation layer (5), and a portion of an upper surface of the source electrode (4) to serve as a vertical channel, of which a channel length corresponds to a thickness of the separation layer (5). Varying the thickness of the separation layer to reduce the length of the vertical channel to a sub-micrometer order would greatly reduce the size of the thin-film transistor and reduce the area of a pixel. The vertical channel does not cause a short channel effect so as to improve electrical performance of the thin-film transistor. Using a multiple-layered hexagonal boron nitride film to make a moisture / oxygen barrier layer (2) and using a double-layered graphene film to make the source electrode (4) and the drain electrode (6) help significantly improve bending durability of the thin-film transistor.

The invention discloses a semi-flexible component carrier (100). The semi-flexible component carrier comprises stack (102) comprising at least one electrically insulating layer structure (106) and / orat least one electrically conductive layer structure (104), wherein the stack (102) defines at least one rigid portion (108) and at least one semi-flexible portion (110); at least one electrically insulating layer structure (106') of the at least one electrically insulating layer structure (106) forming at least a portion of the semi-flexible portion (110) comprises a material having an elongationgreater than 3% and a Young's modulus less than 5 GPa. The invention also relates to a manufacturing method of the semi-flexible component carrier.

The present invention relates to a vane member for a paper sheet conveyance impeller in which at least one vane member is disposed so as to protrude from the external peripheral surface of a rotatable cylindrical member, the vane member being provided with: a vane member body comprising a thermosetting polyurethane elastomer; and a plurality of core wires which comprise polyester fibers and are arranged along the axial direction of a rotary shaft of the cylindrical member. At least a portion of the core wires being embedded within the vane member body.

An adhesive layer is formed by curing an adhesive composition [I] containing an acrylic resin (X), and has an adhesive strength (α) of not less than 25 N / 25 mm, a bending durability (β) of not less than 100,000 times, and a moist heat haze resistance (γ) of not greater than 1.0% as measured under predetermined conditions. The adhesive layer has excellent adhesive strength to adherends, excellent bending durability, and excellent moist heat haze resistance.

An optical transmission module has an optical transmission path in which optical transmission is performed between a first circuit board and a second circuit board disposed opposite the first circuit board. The optical transmission path has a folded structure having a bending radius. A circumferential portion drawn by the bending radius is provided substantially perpendicular to board surfaces of the first circuit board and the second circuit board.

According to one aspect of the present invention, a silver nanowire mesh (Ag NW-mesh) electrode and a fabricating method thereof. The Ag NW-mesh electrode includes a flexible substrate; and a mesh pattern layer which is disposed on the flexible substrate and in which a plurality of first meal lines and a plurality of second metal lines are composed of Ag NWs and intersect each other in an orthogonal or diagonal direction to form a grid pattern, wherein the first metal lines and the second metal lines of the mesh pattern layer form an angle of 35 degrees to 55 degrees with respect to a bending direction.