124results about How to "Improve cutting quality" patented technology

The invention discloses a high-efficiency cutting method for crystalline silicon blocks in the field of solar energy application. The high-efficiency cutting method comprises the following steps of 1)diamond wire and cutting liquid selection, wherein a single-polycrystalline mixed sand electroplating diamond wire (the diamond wire diameter ranges from 50 micrometers to 70 micrometers is adopted,the cutting fluid is selected from a low COD coolant and pure water mixture; 2) guide wheel processing; 3) process parameter setting, wherein the diamond wire, the cutting fluid and a guide wheel arematched, after a cutting machine is assembled, the feeding speed of the working table is adjusted to be 800-3000micrometers per minute, the cutting fluid process flow is 110-180 KG/Min, the cutting liquid cooling temperature is 17-23 DEG C; 4) automatic cutting, wherein after the machine is started for warming up by 5-10 minutes, when it is known that the parameters are normal through spot check,automatic cutting starts; and 5) ending of cutting, wherein a rod is lifted to complete silicon block cutting. The high-efficiency cutting method effectively improves the cutting speed and the cuttingefficiency, improves the yield rate, reduces the cost of auxiliary materials like the diamond wire consumption, improves the slice profitability, and can be used for silicon wafer production.

The invention discloses a dicing device for seafood processing. The dicing device includes a workbench. Supporting plates are installed on the two sides of the workbench, the supporting plates are internally provided with sliding grooves, and sliding blocks are slidably embedded in the sliding grooves. A screw is rotatably installed between the sliding blocks on the two sides, and a screw sleeve spirally sleeves the screw. A shearing-forking mechanism is connected between the spirally sleeve and a fixed block. A guide rod is horizontally fixed between the sliding blocks on the two sides. A sliding sleeve connected with the shearing-forking mechanism slidably sleeves on the guide rod, and a cutter is installed at the bottom of the sliding sleeve. Lifting mechanisms are further arranged above the supporting plates. The dicing device for seafood processing can adjust the spacing of cutting blades to meet the needs of different cutting block sizes, while the spacing between adjacent cutting blades is always ensured to be same, so that the sizes of cut blocks are equal, and the uniformity of the cut blocks is guaranteed, so that the quality of the cut blocks is improved.

The invention provides a composite diamond ultra-thin nickel-base blade and a preparing method thereof. The method comprises the steps that 0.1-4 g/L of 1-8um diamond particles are added into every 1 L of nickel-base electroplating solution in a plating tank, electric stirring vanes arranged on the bottom of the plating tank are stirred without stop, and therefore 1-8um diamonds can be distributed in the nickel-base electroplating solution in the plating tank uniformly; qualified base bodies prepared through machining are added into a clamp to be subjected to pretreatment, after pretreatment is completed, the base bodies are placed into the electroplating tank, 1.5A currents are adopted for carrying out electroplating, in the electroplating process, 0.1-1 g/L of 10-50um diamond particles are added every one hour, the electric stirring vanes carry out high-speed stirring, electroplating is carried out for 4 hours, and therefore the 1-8um diamond particles and the 10-50um diamond particles adhere to the surfaces of the base bodies to form diamonds and nickel-base plated layers. The fine diamond particles and the coarse diamond particles are prepared according to the different proportions, the cutting strength, and the rigidity and the cutting quality of the blade are improved greatly to meet cutting requirements of the different materials.

The invention relates to an animal husbandry forage grass cutting device, in particular to a double-eccentric-gear type forage grass cutting device for animal husbandry, and aims to solve the technical problem of providing a double-eccentric-gear type forage grass cutting device which is high in cutting efficiency, rapid in cutting speed and convenient to operate for animal husbandry. To solve the technical problem, the invention provides the double-eccentric-gear type forage grass cutting device for animal husbandry. The double-eccentric-gear type forage grass cutting device comprises a bottom plate, a left rack, a first sliding track, a first sliding block, a moving frame, a second sliding block, a cutting frame, a second sliding track, a right rack, a mounting base, a first belt pulley and the like, wherein the left rack, the first sliding track, the second sliding track and the right rack are sequentially arranged at the top of the bottom plate from left to right; the first sliding block is arranged on the first sliding track in a sliding manner. The double-eccentric-gear type forage grass cutting device has the effects of being high in cutting efficiency, rapid in cutting speed and convenient to operate, and is long in service life, high in production efficiency, excellent in cutting quality and favorably increased in overall levels such as overall properties.

The invention discloses a laser cutting method and equipment for electronic paper. The laser cutting equipment for the electronic paper comprises a working platform used for bearing the electronic paper, a laser cutting head which can do longitudinal and lateral movement relative to the working platform, a clamping system which can clamp the electronic paper, and a control system which coordinates all the parts to act. When the electronic paper is cut, the electronic paper is placed on the working platform, clamped and positioned, the laser cutting head cuts the electronic paper under the instruction of the control system, and a ratio of the cutting power to the cutting rate is kept constant in the process of cutting. Therefore, laser cutting of the electronic paper is realized, the defect that the conventional die cutting equipment damages the internal structure of the electronic paper in the production process is overcome, the yield is improved, and the production cost is lowered. Meanwhile, semi-cutting operation can be performed on the electronic paper, and the quality of cutting complex parts such as chamfers is greatly improved.

The invention relates to a laser cutting device with a workpiece bottom immersed in liquid level, comprising a liquid container, a workpiece fixing part, a laser generating part and a circulation system, wherein the liquid container is used for accommodating liquid; the workpiece fixing part is used for fixing a workpiece and comprises a first surface and a second surface, wherein the first surface of the workpiece is immersed into the liquid; the laser generating part is used for generating a laser beam to the second surface of the workpiece in order to cut the workpiece; the circulation system comprises an inlet, a circulation drive part, a circulation filter part and an outlet, wherein the inlet and the outlet are connected with the liquid container, the circulation drive part is used for driving the liquid to flow into the circulation system from the inlet, and the liquid back flows into the liquid container from the outlet after being filtered by the circulation filter part. The invention has the advantages of high cutting quality, good cooling effect, and the like.

The invention provides a bidirectional wire arranging device of a multi-wire cutting machine and a control method of the bidirectional wire arranging device, belongs to the technical field of machinery and solves the problem that cut wires are easy to break due to the fact that wires of existing multi-wire cutting machines are not arranged in place. Two bidirectional wire arranging devices of the multi-wire cutting machine are arranged between a winding and pay-off reel and a tension control pulley, and each of the two bidirectional wire arranging devices is provided with a mounting support, a driving mechanism, a wire arranging guide mechanism, two detecting wheels and a controller, wherein the two detecting wheels are arranged on the mounting support side by side and arranged on two sides of a cutting line, and each detecting wheel is provided with a pressure sensor connected with the controller. By sensing the position of the cutting line through the pressure sensor and adjusting speed of the driving mechanism through the controller, in-place wire arrangement is guaranteed. Besides, the bidirectional wire arranging device is simple in structure, convenient to control and high in accuracy.

The invention relates to a laser cutting method. Before cutting, a cutting head is accelerated to reach an end point to be cut, and does not emit laser at accelerating sections; after the cutting head reaches the end point to be cut, the laser begins emitting, and the cutting head cuts one side of a rectangle at a uniform speed; and after the cutting of the side is finished, a motor decelerates to drive the cutting head for running, and the laser does not emit at decelerating sections, thereby ensuring that the cutting of rectangular sides is finished under uniform speed state, completely removing angular points, simultaneously reducing carbonization, and improving the cutting quality.

The present invention relates to a method for manufacturing a cutting edge used for cutting a silicon ingot which is grown as a single or poly crystal, especially for an endless cutting wire of a new mechanism which forms a loop without interruption and cuts the ingot while rotating at high speed on a pulley. The method comprises: preparing at least seven wire strands each of which is made by twisting dozens of thin and small-diameter wires to a uniform thickness and then binding and twisting the prepared strand wires into a single wire rope of larger diameter so that the twist-start point and the opposite twist-end point of the wire strands start and end at different positions, putting each wire strand in the center of other wire strands being twisted when twisting the wire strands, and also putting the twist-end point of each wire strand in the center of other wire strands being twisted. Therefore, an integrated endless cutting wire without a weak portion like a cutoff or knot is manufactured.

The invention relates to a cutting cooling device. The cutting cooling device comprises a workbench and a cutter blade, wherein the workbench is used for placing a product to be cut; the cutter blade is used for cutting the product on the workbench; a spray mechanism positioned on the same level as the cutter blade is arranged on the workbench, and comprises a water tank and a spray nozzle; the spray nozzle is arranged on the water tank, faces the cutting feed direction when the cutter blade is in cutting, and sprays cylindrical water columns toward the cutter blade. According to the cutting cooling device, the spray nozzle sprays the cylindrical water columns towards the contact point where the cutter blade cuts the product, a cutting feed opening of the cutter blade can be quickly cooled down, the cooling effect of the cutter blade is ensured, and the cutting quality of the product is greatly improved.

The invention discloses a beam splitting laser cutting method for a silicon-based wafer. The beam splitting laser cutting method for the silicon-based wafer is used for cutting the silicon-based waferinto independent chips, and is characterized by comprising the following steps of a pretreatment step; a diffraction light splitting step, wherein a single beam laser (105) is split into a pluralityof beams of laser (108) through a grating device (106) and a light beam pattern is formed; a beam splitting cutting step, wherein a laser cutter of the style is used for cutting the silicon-based wafer; and a postprocessing step. The beam splitting laser cutting method for the silicon-based wafer achieves the technical effects that the wafer cutting speed is increased, and meanwhile the cutting quality of the wafer is improved.

The invention discloses a laser cutting and positioning tool, comprising a worktable. The laser cutting and positioning tool is characterized by further comprising a plurality of unequal-height supporting blocks and a mark-shaped positioning bracket, wherein rectangular grid lines are machined on the worktable; the unequal-height supporting blocks are arranged on the corresponding grid lines; clamping parts are arranged at the tops of the unequal-height supporting blocks; and the mark-shaped positioning bracket is placed at the clamping parts of the corresponding supporting blocks to be clamped and positioned. According to the laser cutting and positioning tool, the problems in the prior art that a positioning manner is complicated when a work piece is cut, the machining speed is influenced, the positioning precision is worse, and the machining quality is influenced are solved. The invention provides the laser cutting and positioning tool which can rapidly and accurately position the work piece and is suitable for all mould manufacturers and work piece manufacturing enterprises.

The invention discloses an LED chip and a cutting method thereof. The cutting method of the LED chip provided by the invention is characterized in that after a cutting grinding material is prepared, the cutting grinding material is pressurized to form high-pressure cutting jet through a pressurization system in a waterjet cutting machine, so that the high-pressure cutting jet acts on the surface of an LED wafer, so that the goal of cutting the LED wafer is achieved. The LED chip cutting method provided by the invention is a cold cutting mode, so that the heat influence cannot be generated in the cutting process; melts similar to that in laser cutting cannot be generated, so that the condition that the LED chip leaks electricity or is shielded by the melts is effectively avoided; the LED lateral wall light outlet is favorably realized; the luminous efficiency of the LED chip is improved. In addition, the high pressure jet effect is fluid stress and is not mechanical stress, so that thephenomenon of edge crack in the chip cutting process is avoided; the qualification rate of the LED chip is improved.

In a method for laser material processing a workpiece (2), in particular for laser cutting or laser welding, wherein by means of a laser beam (1) at least a part of the workpiece (2) is melted and/or vaporized and an irradiation front (3) is formed by adding a relative movement between the laser beam (1) and workpiece (2), according to the invention the surface structure of the irradiation front (3) is adjusted in accordance with a desired processing result. The surface structure of the irradiation front (3) can be adjusted, for example, by suitably selecting beam properties of the laser beam (1), in particular the polarization and/or beam profile.

The invention discloses a damage-free high-quality sheet material machining production line. The production line comprises a sheet material transverse cutting unit, a direction turning conveying unitand a sheet material longitudinal cutting unit, wherein the direction turning conveying unit is provided with a direction turning table, and a rolling wheel assembly is arranged on the direction turning table; the rolling wheel assembly comprises a rolling wheel lifting frame, and the rolling wheel lifting frame is switched between an ascending state and a descending state; and the sheet materiallongitudinal cutting unit comprises a cutter body, the cutter body comprises a shell body, a saw blade, a first rotating shaft and a fore-leading cutter, the fore-leading cutter is installed on the shell body and located right ahead of a saw blade cutting path so as to form a cutting-up groove in a lower plane of wood before the saw blade is cut into the wood. According to the production line, a wood plank is conveyed to the sheet material longitudinal cutting unit through the aid of longitudinal rolling wheels, a direction turning process is changed from sliding friction to rolling friction,so that the abrasion of the friction resistance to the surface of the sheet material is greatly reduced, and the cutting-up groove is formed in the lower surface of the sheet material in advance by the fore-leading cutter after the direction turning is carried out, and the saw blade is used for carrying out subsequent cutting on the sheet material along the cutting-up groove so as to effectively prevent the sheet material from cracking.

The invention discloses a silicon carbide crystal rapid orientation method. By utilizing a pre-cutting orientation fixture, the silicon carbide crystal bar bonded with a glass rod is directly fixed onthe platform of the pre-cutting fixture through glue, and then screws on the pre-cutting fixture, a worm wheel and a worm are combined to realize the movement of the platform on the pre-cutting fixture in the horizontal and vertical directions, so that the angle measurement and the orientation of the silicon carbide crystal bar in the horizontal and vertical directions can be realized, and the problems of complex operability, low precision, long time consumption of the orientation of the silicon carbide crystal bar before cutting can be solved, and the method is advantageous in that the operation is simple, the time consumption is short, the efficiency is high, the operation requirement for personnel is low, the precision is high, the glass rod is not needed to be grinded on a grinding machine, and the cost is low.

The invention discloses a hard and brittle material micro cutting processing system under the ultrasonic effect. The system is formed by connecting an integrated machine-detection mechanism and a control mechanism through a drag chain a and a drag chain b. The system solves the problem that micro cutting processing is difficult to carry out on the plastic region of the hard and brittle material.

The invention discloses a negative pressure type paper cutting machine for paper making. The negative pressure type paper cutting machine comprises a box body. A discharging opening is formed in the bottom of one side of the box body. A discharging box is arranged at one side of the bottom of the inner wall of the box body. A guiding plate is fixedly connected to the other side of the bottom of the inner wall of the box body. One end of the guiding plate is fixedly connected with the inner wall of the box body. The upper surface of the guiding plate is provided with air inlets. An exhaust fanis fixedly mounted at the position, located below the guiding plate, of the inner wall of the box body. Air outlets are formed in the other side of the box body. A support table is fixedly connected to one side of the upper surface of the box body. A first motor is fixedly mounted on the upper surface of the support table. A first rotating shaft is fixedly connected to the output end of the firstmotor through a coupling. The negative pressure type paper cutting machine for paper making is provided with the exhaust fan and the guiding plate, so that when the exhaust fan is started, the negative pressure is generated inside the box body; a paper product is adsorbed onto the guiding plate to be fixed, and thus the problem that the paper product cannot be fixed is effectively solved; and paper cutting quality is improved.

The invention provides a cutting cooling device which comprises a cooling wall and a fan. The cooling wall is a hollow cavity, fixed to a workbench and parallel to a blade. A plurality of water spraying openings communicated with the cavity are formed in the surface, close to the blade, of the cooling wall, a water inlet communicated with the cavity is formed in the bottom of the side face of the cooling wall, and a switch is arranged at the water inlet. The fan is arranged on the workbench and located on the same horizontal line with the blade, and an air nozzle facing the blade feeding direction in the blade cutting process is arranged on the fan and blows out an air column to the blade. The dual-cooling mode adopting air cooling and water cooling is adopted, not only can the blade be cooled, but also the blade can be washed.

The invention discloses a medicinal solid screening device for removing metal powder. The medicinal solid screening device comprises a device body, wherein a cavity is formed in the device body, a third-stage screening mechanism is arranged in the cavity, the three-stage screening mechanism moves up and down in the cavity through a transmission mechanism, the third-stage screening mechanism is used in cooperation with the transmission mechanism, and the transmission mechanism can drive the three-stage screening mechanism to move up and down, so that the manual shaking action of a professionalpharmacist is simulated, and the discharging quality of the three-stage screening mechanism is high; and first openings are formed in the two sides of a surrounding frame plate in a penetrating mode,and the left end and the right end of a first pharmacopeia screen are respectively inserted into the two first openings, a second pharmacopeia screen is arranged below the first pharmacopeia screen, and after being screened, coarse materials are located on the first pharmacopeia screen, medium materials are located on the second pharmacopeia screen, and fine materials are located in a material receiving tray, and the first pharmacopeia screen, the second pharmacopeia screen and the material receiving tray form a three-stage material distribution.

The invention provides a coating cutter shaft with a diamond abrasive grain layer. The coating cutter comprises a cutter shaft body and a diamond grinding grain layer fixedly arranged on the surface of the cutter shaft body, the coating cutter shaft has higher holding force to the cutter flywheel, relative to the common metal cutter shaft, the coating cutter shaft with the diamond abrasive grain layer is good in wear resistance, the service life is long, and the cutter flywheel installed by using the coating cutter shaft is more stable in glass cutting. The invention further provides a methodfor manufacturing the coating cutter shaft, and specifically, a braze welding sub-layer is brazed to the surface of a cutter shaft body, and then a titanium carbide sub-layer is deposited on the brazing sub-layer in a physical vapor deposition mode, raw materials used by the method are wide in source, the diamond abrasive particles can be uniformly brazed on the surface of the cutter shaft body byusing the method, and a titanium carbide sub-layer can be uniformly arranged on the surface of the brazing sub-layer. The method is simple and convenient, the conditions are mild, the diamond abrasive particles are firmly and stably arranged in the brazing sub-layer and the titanium carbide sub-layer.