131results about How to "Reduced Risk of Fragmentation" patented technology

The invention discloses a method and a device for removing high-concentration dust in flue gas of a glass kiln and belongs to the field of environmental protection. The method comprises the following steps: receiving high-temperature flue gas exhausted by the glass kiln by using a waste heat boiler; adding tempering substances for tempering and dedusting the high-temperature flue gas; adding a reducing agent in the dedusted high-temperature flue gas and performing denitration treatment on the high-temperature flue gas, enabling the high-temperature flue gas subjected to denitration treatment to return to the waste heat boiler, and cooling the high-temperature flue gas to form low-temperature flue gas; performing desulfurization treatment on the low-temperature flue gas by a wet flue gas desulfurization process or a semi-dry desulfurization process; performing dedusting treatment on the low-temperature flue gas and exhausting the treated gas by a chimney. The waste heat boiler in the device comprises a high temperature side and a low temperature side, wherein the high temperature side is divided into an area A and an area B; the area A, an electric precipitator, a mechanical pre-trapping device, denitration equipment, the area B, the low temperature side, a draught fan, desulfurization equipment, a wet electric precipitator and the chimney are sequentially connected. The low discharge of pollutants in the flue gas of the glass kiln is realized, so that high requirement of people on the environment quality is met.

The invention provides a display screen assembly. The display screen assembly comprises a display screen, an adhesive layer and a screen cover plate, wherein the adhesive layer is adhered between thedisplay screen and the screen cover plate; the screen cover plate comprises at least two composite board layers, and the materials of the composite board layers comprise at least two amorphous crystalline polymers, so that the strength and the hardness of the screen cover plate are improved, the screen cover plate can effectively protect the display screen, and the risk that the screen cover plateis broken due to falling or collision is reduced. The invention further provides a mobile terminal comprising the display screen assembly.

The invention discloses a method for bonding preparation of Ge-on-insulator (GOI) through a Ge film, and relates to GOI. The method comprises the following steps: performing ion implantation on a Ge sheet to form a defect plane; binding PDMS with the processed Ge sheet by use of light cured glue; applying a cutting force parallel to a peeling plane on a processed flexible support substrate, and tearing a surface Ge film from a body Ge substrate along the defect plane to obtain a flexible Ge film; then obtaining the Ge film through polishing, then cleaning the Ge film and an SiO2/Si wafer, performing bumping with the surface of the wafer by use of plasma, and at the same time, performing activation processing on the surface; attaching the processed Ge film to the SiO2/Si wafer; fully discharging air of an interface by use of a rolling method; and performing pre-bonding on a sample after processing, afterwards, peeling the flexible susbtrate from a GOI structure, and performing annealing so as to enhance bonding surface energy and improve the bonding intensity.

The invention relates to an image pickup module. The image pickup module comprises a lens, a lens holder, a light filter, an imaging assembly and a driving device; the lens holder is located under thelens; the light filter is supported on the lens holder and located under the lens; the imaging assembly is located below the light filter and is fixedly connected with the lens holder; the driving device is used for driving the lens to perform focusing; the lens holder includes a connecting portion and a supporting portion for supporting the light filter; a through hole is formed in the supporting portion; and the thickness of the supporting portion ranges from 0.09 to 0.14 mm. Since the thickness of the supporting portion is set to range from 0.09 to 0.14 mm, the total thickness of the supporting portion and the light filter is decreased. The overall strength of the supporting portion is effectively ensured, so that the deformation of the supporting portion can be prevented. The supporting portion can sufficiently maintain a stable supporting effect for the light filter.

The invention relates to the technical field of evaporating plating, and provides an evaporating plating device and an OLED panel evaporating plating method. The evaporating plating device comprises aheating crucible which is used for heating evaporating plating materials to enable the evaporating plating materials to be evaporated; and further comprises a magnetic plate which is positioned abovethe heating crucible, provided with magnetism and used for fixing a target substrate which is going to receive the evaporating plating. More than two magnetic objects are arranged in the magnetic plate, wherein the magnetism of the magnetic plate is gradually decreased from the middle to the edge. According to the technical scheme, the magnetism of the magnetic plate in the evaporating plating device is gradually decreased from the middle to the edge, so that the attraction force on the middle part of the target substrate is larger than the attraction force on the edge, the slippage of the target substrate and wrinkles on a metal mask are reduced, and the bonding degree of the metal mask and the substrate can be improved; and the phenomenon that an evaporating plating organic film patternis abnormal can be avoided, the debris risk of the target substrate can be reduced and the service life of the metal mask can be prolonged, so that the production efficiency is effectively improved,and the quality and the production progress of products are ensured.

The invention relates to an elastic buffering decorating plate in building plates. The elastic buffering decorating plate comprises a decorating plate body and an adhering plate body, and a groove cavity for allowing the adhering plate body to be slidably embedded into and being matched with the adhering plate body in a telescopic mode is formed in the reverse side of the decorating plate. At least one plate edge of the adhering plate body and the corresponding groove inner edge in the groove cavity of the decorating plate body are slidably limited through a limiting sliding block, and the plate edges of the adhering plate body are provided with limiting sliding grooves slidably matched with the limiting sliding blocks. The ends, close to the reverse side of the adhering plate body, of the limiting sliding grooves are provided with assembling groove bodies with the depths being larger than the depths of the limiting sliding grooves. When the limiting sliding blocks are located in the limiting sliding grooves, part of each limiting sliding block protrudes out of the corresponding plate edge of the adhering plate body. When the limiting sliding blocks are located in the assembling groove bodies, the limiting sliding blocks are not exposed relative to the plate edges of the adhering plate body correspondingly. The groove inner edges, corresponding to the plate edges, in a recessed cavity of the decorating plate body are provided with positioning grooves for positioning the limiting sliding blocks, and the parts, protruding out of the plate edges of the adhering plate body when the limiting sliding blocks are located in the limiting sliding grooves, of the limiting sliding blocks are positioned by the positioning grooves. The recessed cavity of the decorating plate body is internally provided with buffering springs abutting against the decorating plate body and the adhering plate body. The elastic buffering decorating plate has the advantages that buffering is achieved, and replacement is easy.

The invention discloses a preparation method of a flexible display panel. The preparation method comprises the following steps: forming a first stress relief layer on one side of a rigid substrate; forming a second stress relief layer on the other opposite side of the rigid substrate; forming a flexible substrate on the first stress relief layer; and forming a display device on the flexible substrate. The stress relieving layers are prepared on the two opposite sides of the rigid substrate respectively, acting force on the rigid substrate is counteracted by means of the fact that materials onthe two sides are the same in deformation quantity and opposite in deformation direction, stress borne by the rigid substrate is reduced, and therefore the warping problem of the rigid substrate is solved. Besides, when the stress relief layer is made of organic materials, the problems of warping of the rigid substrate and difficult tape-out of a machine in the manufacturing process can be solved,meanwhile, the organic layer can protect the rigid substrate, and the risk of tape-out breakage is reduced.

The invention provides a liquid crystal display panel and a liquid crystal display device. The liquid crystal display panel includes a color filter (1), a thin film transistor array substrate (2) facing the color filter (1), a liquid crystal arranged between the color filter (1) and the thin film transistor array substrate (2), and a plurality of light resistance spacing columns (4) which are supported between the color filter (1) and the thin film transistor array substrate (2) in a zone between the color filter (1) and the thin film transistor array substrate (2); and the light resistance spacing columns (4) are made of a glue material, one ends of the light resistance spacing columns (4) are fixedly attached on the color filter (1), and the other ends of the light resistance spacing columns (4) are fixedly attached on the thin film transistor array substrate (2). The liquid crystal display panel has high mechanical strength, can lower fracture risk, can allow even thickness of the liquid crystal, and can improve the product yield.

The embodiment of the invention provides a fitting roller, a fitting jig and a fitting method of a flexible screen and a curved cover plate. The fitting roller comprises a roller cylinder and a fitting part. The fitting part is made of an elastic material and provided with a first bottom surface, a second bottom surface and a peripheral surface. The second bottom surface is attached to the surfaceof the roller cylinder. The first bottom surface comprises a main fitting surface and an end fitting surface. The main fitting surface is parallel to the second bottom surface and is used for being matched with a bottom surface main body of the curved cover plate. The end fitting surface is used for being matched with the bottom surface end angle of the curved cover plate and protrudes out of themain fitting surface. The peripheral surface is connected with the first bottom surface and the second bottom surface and is used for being matched with the curved surface of the curved cover plate.By means of the embodiment of the fitting roller, the fitting jig and the fitting method, roller press fit is adopted, the local fitting sequence of the flexible screen is optimized, and the stress condition of the flexible screen is improved, so that the sufficient fit of the flexible screen and the curved cover plate can be achieved.

The invention discloses a beam splitting laser cutting method for silicon carbide based wafers, and the method is used for cutting silicon carbide based wafers into independent chips. The beam splitting laser cutting method for silicon carbide based wafers is characterized by comprising the following steps: pretreatment step; diffraction light splitting step: using an optical grating device (106)to split single-beam laser (105) into multi-beam laser (108) and forming beam patterns; beam splitting cutting step: using a laser cutter to cut silicon carbide based wafers; and after treatment step.The beam splitting laser cutting method for silicon carbide based wafers achieves the technical effects of improving the cutting rate of wafers and at the same time improving the cutting quality of wafers.

The invention discloses a beam splitting laser cutting method for a silicon-based wafer. The beam splitting laser cutting method for the silicon-based wafer is used for cutting the silicon-based waferinto independent chips, and is characterized by comprising the following steps of a pretreatment step; a diffraction light splitting step, wherein a single beam laser (105) is split into a pluralityof beams of laser (108) through a grating device (106) and a light beam pattern is formed; a beam splitting cutting step, wherein a laser cutter of the style is used for cutting the silicon-based wafer; and a postprocessing step. The beam splitting laser cutting method for the silicon-based wafer achieves the technical effects that the wafer cutting speed is increased, and meanwhile the cutting quality of the wafer is improved.

The invention provides a display panel, comprising a display module, wherein the display module comprises a thin film transistor array substrate; a display unit arranged on the thin film transistor array substrate; a packaging cover plate arranged on the display unit; a packaging material disposed between the thin film transistor array substrate and the packaging cover plate and surrounding the display unit; a protective cover plate arranged on the packaging cover plate of the display module; a bonding layer arranged between the display module and the protective cover plate; and a buffer partdisposed on a side of the thin film transistor array substrate deviating from the display unit and extending along a side surface of the display module toward the packaging material to be at least higher than the packaging material. The attachment method of the buffer part in the display panel not only enhances the packaging effect of the packaging area of the packaging material, but also plays abuffering role on the side surface and the bottom surface of the display panel, the strength of the display panel is effectively improved and the service life of the display panel is prolonged.

The invention discloses a fan-out type chip packaging structure, comprising: a glass substrate; A conductive through hole arranged inside the glass substrate; A chip arranged on the front face of theglass substrate, the chip is electrically connected to the conductive via hole; A plastic encapsulation layer positioned on the front surface of the glass substrate and covering the chip; A first relayout wiring layer disposed on a back surface of the glass substrate, the first relayout wiring layer being electrically connected to the conductive via; And an external solder ball arranged on the back surface of the glass substrate.

The invention discloses a marking machine and an aligning method thereof. The marking machine comprises a carrying table, a plurality of image collectors, a judging module and an alarming module, wherein the periphery of a display substrate located on the carrying table correspond to the multiple image collectors used for collecting images; the numbers of the image collectors corresponding to the two opposite sides of the display substrate are equal, the image collectors corresponding to the two opposite sides of the display substrate correspond in a one-to-one mode, and thus a double-sided alignment system can be formed; image data collected by the image collectors on the two sides are measured together, the alignment values of the two sides are obtained correspondingly, and then whether alignment is abnormal or not is judged according to the fed back comparison of the double-sided alignment values and standard data. Compared with single-sided alignment judgment in the prior art, alignment abnormality can be judged more accurately through the double-sided alignment judgment, so that alignment alarms are controlled more effectively, and the equipment activation is improved; and the frequency of false alignment alarms caused by factors such as poor processes and deviated lenses of the image collectors can be greatly lowered, and the equipment activation is improved effectively.

The invention discloses a back contact forming method of a passivated emitter and rear contact solar cell. The back contact forming method of the passivated emitter and rear contact solar cell comprises the following steps that (1) a light trapping mechanism is formed on the obverse side of a cell substrate of a first conduction type; (2) doping of a second conduction type is carried out on the obverse side of the cell substrate; (3) an antireflection layer is formed on the obverse side of the cell substrate in a deposition mode; (4) a mask plate is arranged on the top of the back side of the cell substrate; (5) a back passivating dielectric layer is formed on the back side of the cell substrate, and an exposed area, without the passivating dielectric layer, of the back side is formed at the same time; (6) electrode patterns are formed on the back side and the obverse side of the cell substrate respectively, and ohmic contact between electrode metal and silicon is formed in a high-temperature sintering mode. According to the back contact forming method of the passivated emitter and rear contact solar cell, damage caused by laser windowing in the preparation process of the passivated emitter and rear contact solar cell can be eliminated, conversion efficiency of the passivated emitter and rear contact solar cell is improved, the preparation cost of the passivated emitter and rear contact solar cell is reduced, and the risk of the fragmentation rate of module preparation is reduced.

The invention discloses a connecting device and semiconductor machining equipment. An upper connecting element is arranged on the outer circumferential wall of a quartz tube by the connecting device in asleeving mode, and therefore a supporting element is fixedly connected with the bottom of the quartz tube and is arranged in a lower connecting element to support the upper connecting element, andthe lower connecting element fixedly connected with the upper connecting element is fixedly connected with a rotating lifting mechanism, so that the quartz tube is fixedly connected with the rotatinglifting mechanism. In this way, a cavity outer cover does not need to be additionally arranged, high accuracy requirements of mounting the quartz tube, a quartz shaft sleeve and the cavity outer coverare achieved, machining and mounting difficulty of parts is reduced; and the quartz tube is not subjected to radial-direction stress when used, and therefore the risk of quartz tube cracking is lowered.

The invention relates to a mobile terminal, a flexible display screen, a glass cover plate and a processing method thereof. The processing method of the glass cover plate comprises the following steps: providing ultra-thin glass; pasting the ultra-thin glass on the base material, and shielding the area, where the ultra-thin glass is not attached, of the base material; frosting the surface of one side, back to the base material, of the ultra-thin glass; carrying out polishing treatment on the frosted surface of the ultra-thin glass; and stripping the polished ultrathin glass from the base material to obtain the glass cover plate. According to the mobile terminal, the flexible display screen, the glass cover plate and the processing method thereof, the glass cover plate prepared by utilizing the processing method of the glass cover plate not only has good bending performance, but also has a relatively good anti-dazzle effect, so that the folding performance and the display effect can be effectively ensured when the glass cover plate is applied to the flexible display screen and the mobile terminal.

The embodiment of the invention provides a display device, wherein a spacer structure is arranged in a first gap between a first substrate and a second substrate, and the surface of the spacer structure towards the second substrate is flush with the surface of a color film substrate towards the second substrate, so that the spacer structure in the first gap between the first substrate and the second substrate has the same supporting force as the color film substrate, the shape variable of the substrate in the display device is reduced when the press test is carried out and the complete machineis assembled so as to reduce the risk of fragmentation and further improve the yield of the display device.

The invention provides an OLED display panel. The pixel definition layer in the OLED display panel is provided with an opening area and a non-opening area; the opening area and the pixel unit are oppositely arranged, and the non-opening area is provided with a lightproof layer surrounding the pixel unit. The non-opening area is provided with a transparent layer corresponding to a circuit layer, thereby ensuring that the light-emitting surface of the OLED display panel can directly see the repairing effect of the metal wiring in the circuit layer without turning over, reducing the repairing difficulty and reducing the fragment risk caused by turning over the OLED display panel.