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Display panel

A display panel and display module technology, which is applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of AMOLED panel edge chipping, chipping angle, etc., to improve the strength, reduce the risk of fragmentation, prolong the The effect of service life

Inactive Publication Date: 2018-12-18
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to improve the shock resistance of the AMOLED panel, the current practice is to set the buffer foam (Rear Tape) 10' on the side of the display module 20 away from the light-emitting side. Edge collapse and corner collapse

Method used

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Embodiment Construction

[0040] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals denote the same or similar structures in the drawings, and thus their repeated descriptions will be omitted.

[0041] The words expressing position and direction described in the content of the present invention are all described by taking the accompanying drawings as an example, but changes can also be made according to needs, and all changes are included in the protection scope of the present invention. The "upper / lower / between" mentioned herein should be understood as including "upper / lower / between" in direct contact and "upper / lowe...

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Abstract

The invention provides a display panel, comprising a display module, wherein the display module comprises a thin film transistor array substrate; a display unit arranged on the thin film transistor array substrate; a packaging cover plate arranged on the display unit; a packaging material disposed between the thin film transistor array substrate and the packaging cover plate and surrounding the display unit; a protective cover plate arranged on the packaging cover plate of the display module; a bonding layer arranged between the display module and the protective cover plate; and a buffer partdisposed on a side of the thin film transistor array substrate deviating from the display unit and extending along a side surface of the display module toward the packaging material to be at least higher than the packaging material. The attachment method of the buffer part in the display panel not only enhances the packaging effect of the packaging area of the packaging material, but also plays abuffering role on the side surface and the bottom surface of the display panel, the strength of the display panel is effectively improved and the service life of the display panel is prolonged.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a display panel. Background technique [0002] Active matrix organic electroluminescent (AMOLED) panels are widely used due to their advantages of self-illumination, high brightness, and wide viewing angle. Glass glue (Frit glue) plays a role in isolating water vapor and oxygen in the AMOLED panel, thereby preventing water vapor, oxygen and organic materials in the AMOLED panel from chemically reacting to cause panel failure. At present, AMOLED panels are developing in the direction of thinner and narrower frames, and the width of glass glue is also becoming narrower and narrower. [0003] The narrow frame of the AMOLED panel is usually cut along the outer edge of the glass glue package. The process of glass glue packaging is a process of melting and re-solidifying. The edge is not easy to achieve smoothness, and the above factors will affect the packaging effect, whic...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L27/32
CPCH10K59/12H10K50/841H10K50/8426
Inventor 赵莹博刘邓辉
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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