40results about How to "Reduced risk of splintering" patented technology

The invention relates to an elastic buffering decorating plate in building plates. The elastic buffering decorating plate comprises a decorating plate body and an adhering plate body, and a groove cavity for allowing the adhering plate body to be slidably embedded into and being matched with the adhering plate body in a telescopic mode is formed in the reverse side of the decorating plate. At least one plate edge of the adhering plate body and the corresponding groove inner edge in the groove cavity of the decorating plate body are slidably limited through a limiting sliding block, and the plate edges of the adhering plate body are provided with limiting sliding grooves slidably matched with the limiting sliding blocks. The ends, close to the reverse side of the adhering plate body, of the limiting sliding grooves are provided with assembling groove bodies with the depths being larger than the depths of the limiting sliding grooves. When the limiting sliding blocks are located in the limiting sliding grooves, part of each limiting sliding block protrudes out of the corresponding plate edge of the adhering plate body. When the limiting sliding blocks are located in the assembling groove bodies, the limiting sliding blocks are not exposed relative to the plate edges of the adhering plate body correspondingly. The groove inner edges, corresponding to the plate edges, in a recessed cavity of the decorating plate body are provided with positioning grooves for positioning the limiting sliding blocks, and the parts, protruding out of the plate edges of the adhering plate body when the limiting sliding blocks are located in the limiting sliding grooves, of the limiting sliding blocks are positioned by the positioning grooves. The recessed cavity of the decorating plate body is internally provided with buffering springs abutting against the decorating plate body and the adhering plate body. The elastic buffering decorating plate has the advantages that buffering is achieved, and replacement is easy.

The present invention provides an LED manufacturing process, comprising providing a substrate, sequentially forming a buffer layer, a first semiconductor layer, a transition layer, a light-emitting layer, and a second semiconductor layer on the substrate; forming the first semiconductor layer During the process, the pressure of the reaction chamber is maintained at the first pressure, and during the process of forming the light-emitting layer, the pressure of the reaction chamber is maintained at the second pressure, and the second pressure is lower than the first pressure. During the formation of the transition layer, the pressure of the reaction chamber is The starting pressure of the body is equal to the first pressure, and the ending pressure is equal to the second pressure. In the present invention, by introducing a transition layer between the first semiconductor layer and the light-emitting layer, the continuous growth is maintained during the pressure change process at this stage, and the interfacial stress is reduced through the transition layer, so that the growth of the first semiconductor layer under high pressure conditions can be realized, and the growth rate can be increased. , due to the gradual reduction of pressure during the formation of the transition layer, the surface tensile stress of the first semiconductor layer gradually decreases, reducing the risk of cracks in the process.

The present disclosure provides a droplet ejection device and related methods. The droplet ejection device comprises: a piezoelectric chip, an interdigital transducer arranged on the upper surface of the piezoelectric chip; the ratio of the thickness of the piezoelectric chip to the period of the interdigital transducer is 1 to 3 ; The interdigital transducer excites surface acoustic waves and bulk acoustic waves in the piezoelectric chip under the drive of radio frequency signals, and the surface acoustic waves and the bulk acoustic waves are reflected on the upper and lower surfaces of the piezoelectric chip to generate recombination Acoustic waves, to drive the liquid to be driven on the liquid attachment area to stretch along the direction perpendicular to the surface of the piezoelectric chip to form a liquid column, so that the liquid column will have a droplet pinch-off effect at the end, and a single droplet will be ejected; the liquid The attachment area is located on the upper surface and / or the lower surface of the piezoelectric chip corresponding to the area covered by the propagation of the surface acoustic wave generated by the interdigital transducer along the surface of the piezoelectric chip. It solves the problems of complicated device structure, high cost, low efficiency, and inconvenient realization of on-demand injection.