A kind of thinning method of lithium niobate wafer
A lithium niobate and wafer technology is applied in the thinning field of lithium niobate wafers, which can solve the problems of easy occurrence of brittle failure, low processing thickness of lithium niobate hardness, deep subsurface damage layer, etc., so as to improve reliability. , reduce the risk of splintering, improve the quality of the effect
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[0036] DBG (Dicing Before Grinding, cutting before grinding) is a commonly used process for thinning and cutting the back of the wafer. The cutting process before grinding is to reverse the original process of cutting after grinding (Dicing After Grinding, cutting after grinding). That is, the technology of half-cutting the wafer first, and then dividing the wafer into chips by back grinding. By using this technology, it is possible to minimize backside cracking and wafer breakage that occur during chip dicing, enabling smooth dicing of chips from large-sized wafers. Since the chipping on the back side of the wafer is greatly reduced, it is possible to perform ultra-thin processing on the wafer while maintaining a high flexural strength, thereby enabling the production of high-strength chips. In addition, since the chip is separated by the grinding process of the grinder, the risk of damage to the thin wafer during transportation can be effectively avoided. The pre-grinding d...
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