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5results about How to "Reduce interface stress" patented technology

Gradient composite coating, and preparation method and application thereof

PendingCN122279453AAvoid wear and peeling failureReduce interface stressMetal coatingMetallic materials
This invention belongs to the field of metal coating technology, specifically relating to a gradient composite coating, its preparation method, and its application. The composite coating of this invention comprises a multilayer Al3BC / Al composite material coating, wherein the Al3BC content in the Al3BC / Al composite material is 0 wt.% to 80 wt.%, and the Al3BC content increases or decreases sequentially from the inside to the outside of the multilayer coating, wherein the multilayer comprises at least three layers. The gradient Al3BC / Al composite coating of this invention balances high reflectivity, ablation resistance, lateral heat dissipation, longitudinal heat insulation, and low internal stress in laser protection scenarios, as well as high surface hardness, low interfacial stress, and high bonding strength in wear-resistant scenarios. Furthermore, the preparation method of the gradient Al3BC / Al composite coating is simple, with controllable parameters, and suitable for mass production. This invention also provides applications of this coating in the fields of laser protection coatings and wear-resistant coatings.
Owner:SHANDONG UNIV OF TECH +1

A multi-structure heterogeneous coating, its preparation method and application

This invention discloses a multi-structured coating, its preparation method, and its application. The coating comprises a TiAlN substrate, an AlTiN gradient layer with increasing Al content, an AlTiN / TiSiN nanolayer, and a TiSiN nanocomposite layer, sequentially connected. The substrate is connected to the substrate. The AlTiN gradient layer with increasing Al content is immediately connected to the TiAlN substrate. The AlTiN / TiSiN nanolayer is a nano-multilayer structure composed of alternating AlTiN and TiSiN layers. The TiSiN layer is a nanocomposite structure composed of nanocrystalline embedded amorphous substrate. The total thickness of the coating is controlled between 1.0 and 6.0 μm. The multi-structured coating exhibits a bonding strength of 65–120 N with the substrate, a nanohardness of 32–35 GPa, and a fracture toughness of 5.9–10 MPa·m. 1 / 2 It has strong toughness and corrosion resistance, and high bonding strength. Its coated tools have a cutting life that is much longer than that of traditional AlTiN coated tools.
Owner:GUANGDONG NICHOLAS NEW MATERIAL TECH CO LTD

Method for forming a composite material flange and die therefor

ActiveCN121946890BQuite a compaction effectContinuous arrangementFiberAviation
The application discloses a forming method of a composite material flange and a die thereof in the technical field of aviation structure connecting piece manufacturing, and comprises die pretreatment, layered paving design, twisted filament core material preparation and soft die auxiliary forming. The fiber arrangement is optimized by arranging the R area gradient paving and the flexible gasket in a spaced mode, and the structure stability is ensured by combining the tooth groove locking edge packaging. A step type heat sealing and pressing curing process is adopted, and the R area and the plane area are synchronously compacted by cooperating with the air bag pressurization. The process covers core material filling verification, vacuum pre-pressing and temperature control demolding, and finally a high-precision flange component is obtained. Through the synergistic process of the gradual pre-compaction and the step type heat sealing and pressing curing, the application effectively solves the problems of poor fiber adhesion, uneven pressure and stress concentration of the R area of the composite material flange, realizes the continuous arrangement of the fiber of the complex curved surface, significantly reduces the internal stress of the interface, and finally obtains a high-quality flange component with a compact structure and uniform performance.
Owner:JIANGSU XINYANG NEW MATERIALS CO LTD

A Ti-containing spraying powder and its preparation method

This invention belongs to the field of thermal spraying preparation technology, specifically relating to a Ti-containing spraying powder and its preparation method. The preparation method of the Ti-containing spraying powder provided by this invention includes the following steps: mixing TiC powder and WC powder to obtain a mixture; subjecting the mixture to high-temperature chemical treatment, then ball milling and sieving to obtain a chemically treated powder; mixing the chemically treated powder, nickel powder, cobalt powder, a forming agent, and water, and then wet ball milling; spray-drying the ball-milled slurry and sieving to obtain a spray-dried material; and sintering the spray-dried material to obtain the Ti-containing spraying powder. The Ti-containing spraying powder provided by this invention can effectively reduce internal defects in the coating, achieve low porosity and high density, effectively improve the wear resistance of the coating, and also possess excellent bonding strength.
Owner:ZHUZHOU HONGRI NEW MATERIAL TECH LTD CO

A differential pressure sensor package

ActiveCN224286178UAvoid Zero DriftProtection from external mechanical shockTelevision system detailsImpedence networksThermal dilatationThermal deformation
This invention relates to the field of pressure sensor packaging technology and discloses a micro differential pressure sensor packaging structure, including a PCB board. A MEMS chip is bonded to the inside of a mounting slot using conductive adhesive. Gold wires are mounted at one end of both the ASIC chip and the MEMS chip, with the other end of the gold wires mounted on the upper surface of the PCB board. Gold wires are also installed between the ASIC chip and the MEMS chip. A cover is mounted on the upper surface of the PCB board. A limiting structure is provided at the upper end of the substrate, and the MEMS chip is positioned in the middle of the limiting structure. This invention utilizes the fact that the thermal expansion coefficient of the substrate is between that of the MEMS chip and the PCB board, forming a gradient transition. This reduces interfacial stress caused by material expansion differences during temperature changes. The highly thermally conductive ceramic can quickly disperse the working heat of the MEMS chip, reducing the temperature gradient and avoiding piezoresistive bridge imbalance caused by local thermal deformation, thus preventing zero-point drift of the MEMS chip. Simultaneously, the high hardness and Young's modulus of the ceramic suppress the transmission of energy from PCB board bending or vibration, protecting the MEMS chip from external mechanical impacts.
Owner:JIANGSU UNIONWAFER SEMICON CO LTD