12results about How to "Reduce interface stress" patented technology

The invention relates to the technical field of batteries, in particular to a composite buffer structure for a battery and a preparation method and application thereof. A composite buffer structure for a battery comprises a polymer matrix layer and a reinforcement phase located in the polymer matrix layer, the reinforcement phase comprises a shape memory alloy fiber layer, and the shape memory alloy fiber layer is of a three-dimensional network structure; and the volume fraction of the shape memory alloy fiber layer in the composite buffer structure for the battery is 10%-60%. According to the composite buffer structure for the battery, the polymer matrix layer serves as a continuous phase, the shape memory alloy fiber layer serves as a reinforcing phase, and the polymer matrix layer and the shape memory alloy fiber layer are mutually staggered in the polymer matrix layer to form a three-dimensional network structure; the shape memory alloy fiber layer with a proper volume fraction is adopted, can actively adapt to the volume change of a battery cell, shows superelasticity at the working temperature of the battery, provides high and stable recovery stress, and is excellent in fatigue resistance, so that long-term stable contact of a battery interface is effectively maintained.

The invention discloses a dynamic stable shielding signal cable and a preparation method thereof. The cable comprises a conductor, an insulating layer wrapping the conductor and a multi-layer shielding structure wrapping the insulating layer. The multi-layer shielding structure comprises an inner shielding layer and a composite shielding layer; the composite shielding layer is a multi-layer composite belt and comprises a metal conductive layer and at least two polymer bonding layers; a melt blending interface is arranged between the inner shielding layer and the composite shielding layer, and the melt blending interface is formed by combining the polymer bonding layer located in the inner side area with the back face of the inner shielding layer in a molten state and solidifying the polymer bonding layer and the back face of the inner shielding layer. According to the invention, the multiple shielding layers form an integrated structure with cooperative deformation, so that the shielding effectiveness maintaining capability of the cable under a dynamic bending working condition is remarkably improved.

This invention belongs to the field of metal coating technology, specifically relating to a gradient composite coating, its preparation method, and its application. The composite coating of this invention comprises a multilayer Al3BC / Al composite material coating, wherein the Al3BC content in the Al3BC / Al composite material is 0 wt.% to 80 wt.%, and the Al3BC content increases or decreases sequentially from the inside to the outside of the multilayer coating, wherein the multilayer comprises at least three layers. The gradient Al3BC / Al composite coating of this invention balances high reflectivity, ablation resistance, lateral heat dissipation, longitudinal heat insulation, and low internal stress in laser protection scenarios, as well as high surface hardness, low interfacial stress, and high bonding strength in wear-resistant scenarios. Furthermore, the preparation method of the gradient Al3BC / Al composite coating is simple, with controllable parameters, and suitable for mass production. This invention also provides applications of this coating in the fields of laser protection coatings and wear-resistant coatings.

The invention discloses a preparation method of a ZnO window layer film with Mo as a buffer layer, and belongs to the technical field of film preparation. The method sequentially comprises the steps of substrate pretreatment, Mo buffer layer magnetron sputtering deposition, ZnO window layer radio frequency magnetron sputtering deposition and annealing post-treatment. Through precise regulation and control of process parameters, lattice transition matching is realized by means of characteristics of Mo and ZnO. The method effectively solves the problems of weak binding force between the ZnO film and the substrate, poor crystallization quality, high defect density, high energy consumption and the like in the prior art, is high in process compatibility and controllable in parameter, is suitable for large-scale preparation of the high-performance ZnO film, and can be widely applied to the photoelectron fields of solar cells, display devices and the like.

This invention discloses a multi-structured coating, its preparation method, and its application. The coating comprises a TiAlN substrate, an AlTiN gradient layer with increasing Al content, an AlTiN / TiSiN nanolayer, and a TiSiN nanocomposite layer, sequentially connected. The substrate is connected to the substrate. The AlTiN gradient layer with increasing Al content is immediately connected to the TiAlN substrate. The AlTiN / TiSiN nanolayer is a nano-multilayer structure composed of alternating AlTiN and TiSiN layers. The TiSiN layer is a nanocomposite structure composed of nanocrystalline embedded amorphous substrate. The total thickness of the coating is controlled between 1.0 and 6.0 μm. The multi-structured coating exhibits a bonding strength of 65–120 N with the substrate, a nanohardness of 32–35 GPa, and a fracture toughness of 5.9–10 MPa·m. 1 / 2 It has strong toughness and corrosion resistance, and high bonding strength. Its coated tools have a cutting life that is much longer than that of traditional AlTiN coated tools.

The application provides a low-resistance high-temperature-resistant conductive adhesive as well as a preparation method, a use method and a photovoltaic module thereof, and relates to the technical field of electronic packaging materials. The low-resistance high-temperature-resistant conductive adhesive comprises, calculated based on the total mass of raw materials of the low-resistance high-temperature-resistant conductive adhesive as 100%, 45-60% of silver-coated ceramic powder, 10-20% of nano silver wire, 1-2% of silicon carbide whisker, 20-30% of polyimide resin and 0.1-0.5% of antioxidant. The base material of the polyimide resin is acetylene-terminated polyimide. The antioxidant comprises BHT. The conductive adhesive provided by the application can enable the material to maintain stable conductive performance and mechanical strength after long-term high-temperature aging, and is suitable for application scenarios such as photovoltaic modules which have strict requirements on weather resistance.

The application discloses a forming method of a composite material flange and a die thereof in the technical field of aviation structure connecting piece manufacturing, and comprises die pretreatment, layered paving design, twisted filament core material preparation and soft die auxiliary forming. The fiber arrangement is optimized by arranging the R area gradient paving and the flexible gasket in a spaced mode, and the structure stability is ensured by combining the tooth groove locking edge packaging. A step type heat sealing and pressing curing process is adopted, and the R area and the plane area are synchronously compacted by cooperating with the air bag pressurization. The process covers core material filling verification, vacuum pre-pressing and temperature control demolding, and finally a high-precision flange component is obtained. Through the synergistic process of the gradual pre-compaction and the step type heat sealing and pressing curing, the application effectively solves the problems of poor fiber adhesion, uneven pressure and stress concentration of the R area of the composite material flange, realizes the continuous arrangement of the fiber of the complex curved surface, significantly reduces the internal stress of the interface, and finally obtains a high-quality flange component with a compact structure and uniform performance.

This invention belongs to the field of thermal spraying preparation technology, specifically relating to a Ti-containing spraying powder and its preparation method. The preparation method of the Ti-containing spraying powder provided by this invention includes the following steps: mixing TiC powder and WC powder to obtain a mixture; subjecting the mixture to high-temperature chemical treatment, then ball milling and sieving to obtain a chemically treated powder; mixing the chemically treated powder, nickel powder, cobalt powder, a forming agent, and water, and then wet ball milling; spray-drying the ball-milled slurry and sieving to obtain a spray-dried material; and sintering the spray-dried material to obtain the Ti-containing spraying powder. The Ti-containing spraying powder provided by this invention can effectively reduce internal defects in the coating, achieve low porosity and high density, effectively improve the wear resistance of the coating, and also possess excellent bonding strength.

The invention relates to the field of functional materials, and discloses a wear-resistant anti-corrosion material and a preparation method thereof, a wear-resistant anti-corrosion plunger rod and a preparation method and application of the wear-resistant anti-corrosion plunger rod. Wherein the wear-resistant anti-corrosion coating sequentially comprises a Si interface layer, a nano TiCN layer and a nano SiC layer from the inner interface of the coating to the outer surface of the coating. The wear-resistant and corrosion-resistant material and the wear-resistant and corrosion-resistant plunger rod provided by the invention have excellent wear resistance and corrosion resistance.

This invention relates to the field of semiconductor technology, and particularly to a heterogeneous thin-film substrate and its preparation method. The preparation method includes the following steps: obtaining a heterogeneous thin-film substrate to be annealed, the heterogeneous thin-film substrate comprising a substrate and a first thin film formed on one side surface of the substrate; forming a second thin film on the side surface of the substrate away from the first thin film, obtaining a composite substrate; the coefficient of thermal expansion of the second thin film is α1, the coefficient of thermal expansion of the substrate is α2, and the coefficient of thermal expansion of the first thin film is α3, satisfying the following condition: α1 < α2 < α3 or α1 > α2 > α3; and performing high-temperature annealing on the composite substrate to obtain the heterogeneous thin-film substrate. Compared with the prior art, this invention effectively alleviates the interfacial stress between the first thin film and the substrate during the annealing process of the heterogeneous substrate, prevents functional film cracking and substrate fragmentation, and improves the product yield of the heterogeneous thin-film substrate.

The invention relates to a corrosion-inhibition heat-insulation gradient coating and a use method thereof. The corrosion-inhibition heat-insulation gradient coating is composed of a primer, an intermediate coat and a finish coat which are mutually independent, wherein the primer is composed of 80-90 parts of zirconium sol, 5-10 parts of hollow glass beads and 0.1-0.3 part of a dispersing agent; the intermediate paint is prepared from the following components in parts by weight: 60-70 parts of zirconium sol, 15-20 parts of hollow glass beads and 0.1-0.3 part of a dispersing agent; the finishing paint is prepared from 40 to 50 parts of zirconium sol, 25 to 30 parts of hollow glass beads and 0.1 to 0.3 part of dispersing agent. And the primer layer, the middle paint layer and the surface paint layer are sequentially coated and cured, and are finally sintered and cured. The preparation method has the beneficial effects that the ZrO-hollow glass bead coating can effectively improve the high-temperature resistance of the coating and realize corrosion resistance under extreme conditions, the thermal expansion coefficients of the coating and the substrate are matched, the generated interface stress is reduced, and the coating is prevented from being peeled off.

This invention relates to the field of pressure sensor packaging technology and discloses a micro differential pressure sensor packaging structure, including a PCB board. A MEMS chip is bonded to the inside of a mounting slot using conductive adhesive. Gold wires are mounted at one end of both the ASIC chip and the MEMS chip, with the other end of the gold wires mounted on the upper surface of the PCB board. Gold wires are also installed between the ASIC chip and the MEMS chip. A cover is mounted on the upper surface of the PCB board. A limiting structure is provided at the upper end of the substrate, and the MEMS chip is positioned in the middle of the limiting structure. This invention utilizes the fact that the thermal expansion coefficient of the substrate is between that of the MEMS chip and the PCB board, forming a gradient transition. This reduces interfacial stress caused by material expansion differences during temperature changes. The highly thermally conductive ceramic can quickly disperse the working heat of the MEMS chip, reducing the temperature gradient and avoiding piezoresistive bridge imbalance caused by local thermal deformation, thus preventing zero-point drift of the MEMS chip. Simultaneously, the high hardness and Young's modulus of the ceramic suppress the transmission of energy from PCB board bending or vibration, protecting the MEMS chip from external mechanical impacts.