Flexible display assembly, fabrication method thereof and display panel

A flexible display and component technology, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as easy cracking of display panels, achieve the effect of improving cracking and bending reliability

Inactive Publication Date: 2018-04-27
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The main technical problem to be solved by the present invention is to provide a flexible display component, a manufactu

Method used

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  • Flexible display assembly, fabrication method thereof and display panel
  • Flexible display assembly, fabrication method thereof and display panel
  • Flexible display assembly, fabrication method thereof and display panel

Examples

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Example Embodiment

[0019] Refer to figure 1 The embodiment of the flexible display assembly of the present invention includes a display layer 10, a first film layer 11, and a second film layer 12. The display layer 10 includes a non-bending area 101 and a bending area 102. The first thin film layer 11 at least includes a first inorganic layer 111 and a first organic layer 112 sequentially formed on the bending area 102. The second thin film layer 12 at least includes a second inorganic layer 121 and a second organic layer 122 sequentially formed on the non-bending area 101.

[0020] Wherein, the modulus difference between the first inorganic layer 111 and the display layer 10 is smaller than the modulus difference between the second inorganic layer 121 and the display layer 10, and / or the thickness d of the first inorganic layer 111 is smaller than that of the second inorganic layer 121 Thickness D. The thickness of the first thin film layer 11 is equal to the thickness of the second thin film la...

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Abstract

The embodiment of the invention provides a flexible display assembly, a fabrication method of the same and a display panel. The flexible display assembly comprises a display layer, a first thin film layer and a second thin film layer, wherein the display layer comprises a non-bending region and a bending region, the first thin film layer at least comprises a first inorganic layer and a first organic layer, the first inorganic layer and the first organic layer are sequentially formed on the bending region, the second thin film layer at least comprises a second inorganic layer and a second organic layer, the second inorganic layer and the second organic layer are sequentially formed on the non-bending region, the modulus difference between the first inorganic layer and the display layer is smaller than the modulus difference between the second inorganic layer and the display layer, and/or the thickness of the first inorganic layer is smaller than the thickness of the second inorganic layer, and the thickness of the first thin film layer is equal to the thickness of the second thin film layer. By the mode, the bending reliability of the flexible display assembly can be effectively improved.

Description

technical field [0001] The invention relates to the display field, in particular to a flexible display component, a manufacturing method and a display panel. Background technique [0002] With the development of display technology, the requirements for color and portability are getting higher and higher, and active matrix organic light-emitting diodes (AMOLED) are gradually entering consumer electronics markets such as mobile devices and televisions. OLED displays have the characteristics of high luminous brightness, wide viewing angle, fast response speed, ultra-thin, light weight, and can be fabricated on flexible substrates. Compared with traditional TFT-LCD technology, the biggest advantage of OLED is that it can be made into flexible products. In order to realize the bendable / rollable characteristics of OLEDs, researchers in the industry have done a lot of work on flexible substrates and flexible packaging. The flexible packaging technology is mainly Thin Film Encapsu...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/00
CPCH10K77/111H10K50/844Y02E10/549Y02P70/50
Inventor 赵宸
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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